SCHEMBL18538548

SCHEMBL18538548

CNC1CC(=O)N(c2ccc(Cc3ccc(N4C(=O)C=CC4=O)cc3)cc2)C1=O

nearest known ligand 0.58

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 4/20 0.58
FAAH O00519 2/20 0.58
MAPT P10636 6/20 0.48
ALDH1A1 P00352 9/20 0.45
POLB P06746 1/20 0.45
HTT P42858 1/20 0.45
KDM4E B2RXH2 2/20 0.45
LMNA P02545 1/20 0.45
GAA P10253 4/20 0.43
ALOX12 P18054 1/20 0.43
SMN1; SMN2 Q16637 3/20 0.43
GFER P55789 2/20 0.43
MEN1 O00255 1/20 0.42
KMT2A Q03164 1/20 0.42
HSD17B10 Q99714 1/20 0.42
SPHK2 Q9NRA0 1/20 0.42
SPHK1 Q9NYA1 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16615639 0.86 MAPT (0.63) MGLLFAAHMAPTALDH1A1POLB
SCHEMBL14159540 0.83 MGLL (0.62) MGLLFAAHMAPTALDH1A1POLB
SCHEMBL13040960 0.81 GAA (0.59) MGLLFAAHMAPTALDH1A1POLB
SCHEMBL23489481 0.81 MGLL (0.58) MGLLFAAHMAPTALDH1A1POLB
SCHEMBL16675654 0.80 MGLL (0.57) MGLLFAAHALDH1A1POLBLMNA
SCHEMBL18538549 0.78 MGLL (0.44) MGLLMAPTALDH1A1HTTKDM4E
SCHEMBL26050574 0.78 HTT (0.49) MGLLFAAHMAPTALDH1A1POLB
SCHEMBL9635105 0.77 KDM4E (0.69) MAPTALDH1A1POLBHTTKDM4E
SCHEMBL114168 0.76 MGLL (1.00) MGLLFAAHALDH1A1LMNA
SCHEMBL14159537 0.76 MAPT (0.84) MAPTALDH1A1POLBHTTKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11008420-B2 Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-05-18 US disclosed
US-20210032404-A1 RESIN COMPOSITION, PREPREG, METAL FOIL-CLAD LAMINATE, RESIN COMPOSITE SHEET, AND PRINTED WIRING BOARD MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-02-04 US disclosed
EP-3290480-B1 RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD SHOWA DENKO MATERIALS CO LTD (JP) 2020-12-09 EP disclosed
US-20180134842-A1 RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2018-05-17 US disclosed
US-20180127547-A1 THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD RESONAC CORPORATION (JP) 2018-05-10 US disclosed
EP-3290479-A1 THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD Hitachi Chemical Co., Ltd. (JP) 2018-03-07 EP disclosed
US-9828466-B2 Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same HITACHI CHEMICAL COMPANY, LTD (JP) 2017-11-28 US disclosed
US-9828466-B2 Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same HITACHI CHEMICAL COMPANY, LTD (JP) 2017-11-28 US disclosed
US-20170051109-A1 POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-02-23 US disclosed
US-20170051109-A1 POLYPHENYLENE ETHER DERIVATIVE HAVING N-SUBSTITUTED MALEIMIDE GROUP, AND HEAT CURABLE RESIN COMPOSITION, RESIN VARNISH, PREPREG, METAL-CLAD LAMINATE, AND MULTILAYER PRINTED WIRING BOARD USING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2017-02-23 US disclosed