SCHEMBL18575437

SCHEMBL18575437

COc1ccc(C(C)NCCN)cc1

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PKM P14618 1/20 0.57
KMT2A Q03164 4/20 0.55
ALDH1A1 P00352 4/20 0.55
HTT P42858 2/20 0.55
MAPT P10636 2/20 0.55
MITF O75030 1/20 0.55
LMNA P02545 1/20 0.55
CA1 P00915 1/20 0.51
CA2 P00918 1/20 0.51
ACHE P22303 1/20 0.51
MEN1 O00255 2/20 0.49
OPRM1 P35372 1/20 0.49
OPRD1 P41143 1/20 0.49
CASR P41180 1/20 0.45
AOC3 Q16853 1/20 0.45
TAAR1 Q96RJ0 1/20 0.44
CYP1A2 P05177 1/20 0.43
CYP2D6 P10635 1/20 0.43
CYP2C19 P33261 1/20 0.43
SMN1; SMN2 Q16637 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18575578 0.87 HTR1A (0.50) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL5093228 0.84 TDP1 (0.48) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL3265762 0.81 PKM (0.56) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL335043 0.80 CASR (0.62) PKMKMT2AMEN1OPRM1CASR
SCHEMBL4589366 0.79 PKM (0.54) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL18575438 0.79 SMN1; SMN2 (0.47) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL20909121 0.79 PKM (0.55) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL17509729 0.79 CA1 (0.51) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL31080779 0.78 PKM (0.54) PKMKMT2AALDH1A1HTTMAPT
SCHEMBL335144 0.78 ESR1 (0.45) KMT2AALDH1A1HTTMAPTLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3344677-B1 LOW-EMISSION EPOXY RESIN COMPOSITION SIKA TECH AG (CH) 2019-11-06 EP disclosed
EP-3350244-A1 CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS Sika Technology AG (CH) 2018-07-25 EP disclosed
WO-2017046293-A1 CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2017-03-23 WO disclosed
EP-3144334-A1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS Sika Technology AG (CH) 2017-03-22 EP disclosed
EP-3138863-A1 LOW-EMISSION EPOXY RESIN COMPOSITION Sika Technology AG (CH) 2017-03-08 EP disclosed