SCHEMBL1859062

SCHEMBL1859062

Cc1cc(C(C)(C)C)cc(C(C)(C)C)c1C(C)OP(O)O

nearest known ligand 0.33

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 2/20 0.33
CYP2C9 P11712 2/20 0.33
CYP2C19 P33261 2/20 0.33
POLB P06746 1/20 0.32
CYP3A4 P08684 1/20 0.31
TSHR P16473 1/20 0.31
GABRA1 P14867 1/20 0.31
GABRB2 P47870 1/20 0.31
HTR1D P28221 1/20 0.30
HTR1B P28222 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1859057 0.87 POLB (0.34) CYP1A2CYP2C9CYP2C19POLBHTR1D
SCHEMBL39337 0.85 CYP1A2 (0.34) CYP1A2CYP2C9CYP2C19POLBCYP3A4
SCHEMBL29421158 0.85 CYP1A2 (0.34) CYP1A2CYP2C9CYP2C19POLBCYP3A4
SCHEMBL8919537 0.78
SCHEMBL20972388 0.77 HTR1D (0.35) HTR1DHTR1B
SCHEMBL39015 0.75 ALDH1A1 (0.35) CYP1A2CYP2C9CYP2C19POLBCYP3A4
SCHEMBL29421164 0.75 ALDH1A1 (0.35) CYP1A2CYP2C9CYP2C19POLBCYP3A4
SCHEMBL789567 0.75 HMGCR (0.36) POLB
SCHEMBL9879682 0.75 POLB (0.41) CYP1A2CYP2C9CYP2C19POLBCYP3A4
SCHEMBL32675226 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 88 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117126594-A Optical coating composition, optical coating and photovoltaic module comprising optical coating composition 浙江福斯特新材料研究院有限公司 2023-11-28 CN claimed
CN-105511226-B Photosensitive resin composition 东友精细化工有限公司 2021-04-20 CN claimed
CN-112080029-A Quantum dot film and preparation method thereof 苏州星烁纳米科技有限公司 2020-12-15 CN claimed
CN-118355085-A Anaerobic curable adhesive composition, adhesive laminate, motor, and primer composition for anaerobic curing 东亚合成株式会社 2024-07-16 CN disclosed
CN-118318016-A Anaerobic curable adhesive composition, adhesive laminate, and motor 东亚合成株式会社 2024-07-09 CN disclosed
CN-118317867-A Decorative sheet and decorative sheet using biomass-derived polyethylene 大日本印刷株式会社 2024-07-09 CN disclosed
CN-118302296-A Decorative sheet and decorative sheet using biomass-derived polyethylene 大日本印刷株式会社 2024-07-05 CN disclosed
CN-118284635-A Photocurable resin composition, fuel cell, and sealing method 三键有限公司 2024-07-02 CN disclosed
CN-118126437-A Resin composition, master batch, adhesive film, photovoltaic module and display device 浙江福斯特新材料研究院有限公司 2024-06-04 CN disclosed
CN-118119662-A Conductive resin composition 阪田油墨股份有限公司 2024-05-31 CN disclosed
CN-118027842-A Polymer adhesive film, polymer conductor film, battery string and photovoltaic module 杭州福斯特应用材料股份有限公司 2024-05-14 CN disclosed
CN-110947985-A Foamed polyvinyl chloride layered product and its making method 南亚塑胶工业股份有限公司 2020-04-03 CN disclosed
CN-110741445-A Organic insulator, metal-clad laminate, and wiring board 京瓷株式会社 2020-01-31 CN disclosed
CN-107250640-B Fiber reinforced composite pipe and cold and hot water piping system 积水化学工业株式会社 2020-01-03 CN disclosed
US-8497140-B2 Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate DAI NIPPON PRINTING CO., LTD. (JP) 2013-07-30 US disclosed
CN-102348761-A Stabilized blends of polyester and polyamide BASF SE 2012-02-08 CN disclosed
US-20110183442-A1 ENCAPSULANT LAYER FOR PHOTOVOLTAIC MODULE, PHOTOVOLTAIC MODULE AND METHOD FOR MANUFACTURING REGENERATED PHOTOVOLTAIC CELL AND REGENERATED TRANSPARENT FRONT FACE SUBSTRATE DAI NIPPON PRINTING CO., LTD. (JP) 2011-07-28 US disclosed
US-7935884-B2 Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate DAI NIPPON PRINTING CO., LTD. (JP) 2011-05-03 US disclosed
EP-1889869-A1 Flame-retarded foamed plastic compositions and shaped articles Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2008-02-20 EP disclosed
EP-1724304-A1 FLAME-RETARDANT STYRENE RESIN COMPOSITION Dai-Ichi Kogyo Seiyaku Co., Ltd. (JP) 2006-11-22 EP disclosed