Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ZDHHC20 | Q5W0Z9 | 2/20 | 0.38 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.38 |
| ▸ | DPP4 | P27487 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.31 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL460923 | 0.78 | TSHR (0.42) | ZDHHC20ZDHHC2ALDH1A1TSHR | |
| SCHEMBL2478563 | 0.76 | ZDHHC20 (0.39) | ZDHHC20ZDHHC2DPP4ALDH1A1TSHR | |
| SCHEMBL1881902 | 0.76 | TSHR (0.36) | ZDHHC20ZDHHC2ALDH1A1TSHR | |
| SCHEMBL5428814 | 0.75 | TSHR (0.34) | ZDHHC20ZDHHC2ALDH1A1TSHR | |
| SCHEMBL7051119 | 0.75 | DPP4 (0.46) | ZDHHC20ZDHHC2DPP4TSHR | |
| SCHEMBL27965429 | 0.75 | TSHR (0.39) | ZDHHC20ZDHHC2ALDH1A1TSHR | |
| SCHEMBL2819500 | 0.74 | CHRM2 (0.32) | DPP4 | |
| SCHEMBL28775233 | 0.74 | ALDH1A1 (0.37) | ZDHHC20ZDHHC2ALDH1A1TSHR | |
| SCHEMBL10596060 | 0.73 | TSHR (0.38) | ZDHHC20ZDHHC2ALDH1A1TSHR | |
| SCHEMBL17665959 | 0.73 | TSHR (0.38) | ZDHHC20ZDHHC2ALDH1A1TSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8293846-B2 | Composition for forming layer to be plated, method of producing metal pattern material, metal pattern material | FUJIFILM CORPORATION (JP) | 2012-10-23 | — | — | US | disclosed |
| US-20110104454-A1 | COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, AND METAL PATTERN MATERIAL | FUJIFILM CORPORATION (JP) | 2011-05-05 | — | — | US | disclosed |
| US-20100080964-A1 | COMPOSITION FOR FORMING LAYER TO BE PLATED, METHOD OF PRODUCING METAL PATTERN MATERIAL, METAL PATTERN MATERIAL | FUJIFILM CORPORATION (JP) | 2010-04-01 | — | — | US | disclosed |