Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM1A | O60341 | 8/20 | 0.50 |
| ▸ | ESR2 | Q92731 | 7/20 | 0.36 |
| ▸ | ESR1 | P03372 | 3/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.35 |
| ▸ | GAA | P10253 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.35 |
| ▸ | ACHE | P22303 | 1/20 | 0.33 |
| ▸ | DEGS1 | O15121 | 1/20 | 0.33 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.32 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.32 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL16530012 | 0.89 | KDM1A (0.38) | KDM1AALDH1A1GAATDP1KDM4E | |
| SCHEMBL6234699 | 0.89 | KDM1A (0.38) | KDM1AALDH1A1GAATDP1KDM4E | |
| SCHEMBL21525760 | 0.85 | KDM1A (0.42) | KDM1AHDAC6KDM4ELMNA | |
| SCHEMBL21525759 | 0.85 | KDM1A (0.42) | KDM1AHDAC6KDM4ELMNA | |
| SCHEMBL912758 | 0.80 | HTR2A (0.43) | KDM1AALDH1A1CYP3A4CYP2C9KDM4E | |
| SCHEMBL1739265 | 0.80 | KDM1A (0.50) | KDM1ATDP1CYP2C9KDM4ELMNA | |
| SCHEMBL12997456 | 0.80 | KDM1A (0.36) | KDM1AALDH1A1TDP1CYP3A4 | |
| SCHEMBL912333 | 0.80 | HTR2A (0.43) | KDM1A | |
| SCHEMBL8686930 | 0.79 | LMNA (0.37) | KDM1AESR2ESR1ALDH1A1GAA | |
| SCHEMBL31109576 | 0.79 | CA2 (0.35) | KDM1AKDM4ELMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 158 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250110403-A1 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC POLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | US | claimed |
| WO-2025072614-A2 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC POLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | WO | claimed |
| US-20250110399-A1 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC TERPOLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | US | claimed |
| WO-2025072607-A1 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS FREE POLYCYCLOOLEFINIC TERPOLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | WO | claimed |
| US-10591818-B2 | Nadic anhydride polymers and photosensitive compositions derived therefrom | PROMERUS, LLC (US) | 2020-03-17 | — | — | US | claimed |
| WO-2018022952-A1 | NADIC ANHYDRIDE POLYMERS AND PHOTOSENSITIVE COMPOSITIONS DERIVED THEREFROM | PROMERUS, LLC (US) | 2018-02-01 | — | — | WO | claimed |
| US-20180030189-A1 | NADIC ANHYDRIDE POLYMERS AND PHOTOSENSITIVE COMPOSITIONS DERIVED THEREFROM | PROMERUS, LLC (US) | 2018-02-01 | — | — | US | claimed |
| US-8753790-B2 | Self-imageable film forming polymer, compositions thereof and devices and structures made therefrom | PROMERUS, LLC (US) | 2014-06-17 | — | — | US | claimed |
| EP-2448991-B1 | A SELF-IMAGEABLE FILM FORMING POLYMER, COMPOSITIONS THEREOF AND DEVICES AND STRUCTURES MADE THEREFROM | PROMERUS LLC (US) | 2014-02-26 | — | — | EP | claimed |
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | claimed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | claimed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | claimed |
| US-20250110403-A1 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC POLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | US | disclosed |
| US-20250110399-A1 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC TERPOLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | US | disclosed |
| WO-2025072614-A2 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS-FREE POLYCYCLOOLEFINIC POLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | WO | disclosed |
| WO-2025072607-A1 | PHOTOSENSITIVE COMPOSITION CONTAINING PFAS FREE POLYCYCLOOLEFINIC TERPOLYMERS AND SEMICONDUCTOR DEVICE MADE THEREOF | PROMERUS, LLC (US) | 2025-04-03 | — | — | WO | disclosed |
| US-7727705-B2 | High etch resistant underlayer compositions for multilayer lithographic processes | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. (US) | 2010-06-01 | — | — | US | disclosed |
| WO-2008140846-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) | 2008-11-20 | — | — | WO | disclosed |
| US-20080217617-A1 | Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same | ZEON CORPORATION (JP) | 2008-09-11 | — | — | US | disclosed |
| US-20080206667-A1 | HIGH ETCH RESISTANT UNDERLAYER COMPOSITIONS FOR MULTILAYER LITHOGRAPHIC PROCESSES | FUJIFILM ELECTRONIC MATERIALS, U.S.A., INC. | 2008-08-28 | — | — | US | disclosed |