Predicted protein targets (top 18)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.47 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.47 |
| ▸ | TSHR | P16473 | 1/20 | 0.47 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.47 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.47 |
| ▸ | MEN1 | O00255 | 1/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.40 |
| ▸ | CHRM2 | P08172 | 1/20 | 0.36 |
| ▸ | CHRM5 | P08912 | 1/20 | 0.36 |
| ▸ | CHRM3 | P20309 | 1/20 | 0.36 |
| ▸ | MGLL | Q99685 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 2/20 | 0.35 |
| ▸ | HDAC1 | Q13547 | 1/20 | 0.33 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.33 |
| ▸ | POLB | P06746 | 1/20 | 0.30 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.30 |
| ▸ | SLC5A1 | P13866 | 1/20 | 0.30 |
| ▸ | SLC5A2 | P31639 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL12961267 | 0.93 | ALDH1A1 (0.41) | ALDH1A1CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL17354956 | 0.90 | MEN1 (0.45) | ALDH1A1CYP3A4TSHRTDP1MEN1 | |
| SCHEMBL18615654 | 0.87 | ALDH1A1 (0.36) | ALDH1A1CYP3A4TSHRMAPK1TDP1 | |
| SCHEMBL7157640 | 0.85 | MEN1 (0.41) | ALDH1A1MEN1KMT2ACHRM2LMNA | |
| SCHEMBL17359261 | 0.83 | MEN1 (0.41) | ALDH1A1MEN1KMT2ALMNAPOLB | |
| SCHEMBL1665729 | 0.83 | MEN1 (0.55) | ALDH1A1TSHRTDP1MEN1KMT2A | |
| SCHEMBL9861061 | 0.82 | MEN1 (0.38) | TSHRMEN1KMT2ALMNA | |
| SCHEMBL7776132 | 0.82 | MEN1 (0.35) | ALDH1A1MEN1KMT2ALMNAL3MBTL1 | |
| SCHEMBL10749521 | 0.81 | MEN1 (0.40) | ALDH1A1MEN1KMT2ALMNA | |
| SCHEMBL15195722 | 0.81 | ALDH1A1 (0.40) | ALDH1A1CYP3A4TSHRMAPK1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 776 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023071921-A1 | POLYAMIDE COMPOSITE MATERIAL, AND PREPARATION METHOD THEREFOR AND USE THEREOF | 上海金发科技发展有限公司 | 2023-05-04 | — | — | WO | claimed |
| CN-113999522-A | Polyamide composite material and preparation method and application thereof | 上海金发科技发展有限公司 | 2022-02-01 | — | — | CN | claimed |
| US-20210284881-A1 | Fast Curing Epoxy Acrylic Liquid Shim | Henkel IP & Holding GmbH (DE) | 2021-09-16 | — | — | US | claimed |
| CN-111944309-A | Polyamide composition capable of being stably molded | 江苏金发科技新材料有限公司 | 2020-11-17 | — | — | CN | claimed |
| US-20140264822-A1 | THERMOSETTING RESIN COMPOSITIONS WITH LOW COEFFICIENT OF THERMAL EXPANSION | HENKEL CORPORATION (US) | 2014-09-18 | — | — | US | claimed |
| US-8829694-B1 | Thermosetting resin compositions with low coefficient of thermal expansion | Henkel IP & Holding GmbH (DE) | 2014-09-09 | — | — | US | claimed |
| US-20100285309-A1 | PRIMER COMPOSITIONS FOR ADHESIVE BONDING SYSTEMS AND COATINGS | HENKEL AG & CO. KGAA (DE) | 2010-11-11 | — | — | US | claimed |
| US-20100151253-A1 | Primer Compositions for Adhesive Bonding Systems | HENKEL KGAA (DE) | 2010-06-17 | — | — | US | claimed |
| EP-2190900-A2 | PRIMER COMPOSITIONS FOR ADHESIVE BONDING SYSTEMS AND COATINGS | Henkel AG & Co. KGaA (DE) | 2010-06-02 | — | — | EP | claimed |
| WO-2009037323-A2 | PRIMER COMPOSITIONS FOR ADHESIVE BONDING SYSTEMS AND COATINGS | HENKEL AG & CO. KGAA (DE) | 2009-03-26 | — | — | WO | claimed |
| US-20030131937-A1 | Thermosetting resin compositions useful as underfill sealants | HENKEL LOCTITE CORPORATION | 2003-07-17 | — | — | US | claimed |
| US-20020117259-A1 | Two part, room temperature curable epoxy resin/ (meth) acrylate compositions with high flash point and low odor, reaction products of which demonstrate improved fixture | Henkel IP & Holding GmbH (DE) | 2002-08-29 | — | — | US | claimed |
| US-20020058778-A1 | Toughened thermosetting resin compositions useful as underfill sealants | LOCTITE CORPORATION | 2002-05-16 | — | — | US | claimed |
| US-20020058756-A1 | Underfill sealants with improved adhesion, improved resistance to moisture absorption and improved resistance to stress cracking | LOCTITE CORPORATION | 2002-05-16 | — | — | US | claimed |
| US-6342577-B1 | Thermosetting resin compositions useful as underfill sealants | LOCTITE CORPORATION | 2002-01-29 | — | — | US | claimed |
| US-6248204-B1 | STRUCTURAL REINFORCEMENT COMPONENT THAT INCLUDES A HYDROPHOBIC FUMED SILICA IN AN AMOUNT OF ABOUT 5 TO ABOUT 20 WEIGHT PERCENT, BASED ON THE EPOXY RESIN COMPONENT | LOCTITE CORPORATION | 2001-06-19 | — | — | US | claimed |
| EP-0239804-B1 | EPOXY RESINS BASED ON TETRAGLYCIDYL DIAMINES AND THE USE THEREOF FOR EPOXY SYSTEMS AND PREPREGS | AMOCO CORPORATION (US) | 1989-08-09 | — | — | EP | claimed |
| US-4814414-A | POLYAMINE CURING AGENT, FIBER REINFORCEMENT, CO-POLYEPOXIDES; AIRCRAFT PREPREGS | AMOCO CORPORATION (US) | 1989-03-21 | — | — | US | claimed |
| EP-0239804-A1 | Epoxy resins based on tetraglycidyl diamines and the use thereof for epoxy systems and prepregs | AMOCO CORPORATION (US) | 1987-10-07 | — | — | EP | claimed |
| US-4680341-A | Epoxy resins based on tetraglycidyl diamines | UNION CARBIDE CORPORATION (US) | 1987-07-14 | — | — | US | claimed |