Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 2/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.41 |
| ▸ | TSHR | P16473 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 3/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.33 |
| ▸ | CHRNA7 | P36544 | 1/20 | 0.33 |
| ▸ | GLA | P06280 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 1/20 | 0.32 |
| ▸ | MCOLN3 | Q8TDD5 | 1/20 | 0.32 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.31 |
| ▸ | ACHE | P22303 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17354956 | 0.92 | MEN1 (0.45) | MEN1KMT2AALDH1A1TSHRLMNA | |
| SCHEMBL7157640 | 0.86 | MEN1 (0.41) | MEN1KMT2AALDH1A1LMNAL3MBTL1 | |
| SCHEMBL17359261 | 0.85 | MEN1 (0.41) | MEN1KMT2AALDH1A1LMNAL3MBTL1 | |
| SCHEMBL10749521 | 0.83 | MEN1 (0.40) | MEN1KMT2AALDH1A1LMNAHPGD | |
| SCHEMBL187220 | 0.83 | ALDH1A1 (0.47) | MEN1KMT2AALDH1A1TSHRLMNA | |
| SCHEMBL1030304 | 0.82 | LMNA (0.51) | MEN1KMT2AALDH1A1LMNAL3MBTL1 | |
| SCHEMBL232952 | 0.82 | MEN1 (0.57) | MEN1KMT2AALDH1A1TSHRLMNA | |
| SCHEMBL9861061 | 0.80 | MEN1 (0.38) | MEN1KMT2ATSHRLMNASMN1; SMN2 | |
| SCHEMBL21013003 | 0.80 | LMNA (0.55) | MEN1KMT2AALDH1A1TSHRLMNA | |
| SCHEMBL12961267 | 0.78 | ALDH1A1 (0.41) | MEN1KMT2AALDH1A1TSHRLMNA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 51 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-4028464-A1 | HIGH-VOLTAGE COMPONENTS | LANXESS Deutschland GmbH (DE) | 2022-07-20 | — | — | EP | disclosed |
| EP-4028465-A1 | HIGH-VOLTAGE COMPONENTS | LANXESS Deutschland GmbH (DE) | 2022-07-20 | — | — | EP | disclosed |
| EP-3938442-A1 | HIGH VOLTAGE COMPONENTS | LANXESS Deutschland GmbH (DE) | 2022-01-19 | — | — | EP | disclosed |
| EP-3938436-A1 | HIGH VOLTAGE COMPONENTS | LANXESS Deutschland GmbH (DE) | 2022-01-19 | — | — | EP | disclosed |
| WO-2021047937-A1 | HIGH-VOLTAGE COMPONENTS | LANXESS DEUTSCHLAND GMBH (DE) | 2021-03-18 | — | — | WO | disclosed |
| WO-2021047936-A1 | HIGH-VOLTAGE COMPONENTS | LANXESS DEUTSCHLAND GMBH (DE) | 2021-03-18 | — | — | WO | disclosed |
| WO-2020187702-A1 | HIGH VOLTAGE COMPONENTS | LANXESS DEUTSCHLAND GMBH (DE) | 2020-09-24 | — | — | WO | disclosed |
| WO-2020187704-A1 | HIGH VOLTAGE COMPONENTS | LANXESS DEUTSCHLAND GMBH (DE) | 2020-09-24 | — | — | WO | disclosed |
| EP-3507330-A1 | THERMOPLASTIC MOLDING COMPOUNDS | Lanxess Deutschland GmbH (DE) | 2019-07-10 | — | — | EP | disclosed |
| CN-109563017-A | Inclusion compound and preparation method thereof with and application thereof | 大阪燃气化学有限公司 | 2019-04-02 | — | — | CN | disclosed |
| CN-101193975-B | Hardenable resin composition | ADEKA CORP | 2011-01-12 | — | — | CN | disclosed |
| CN-101821312-A | Single-component cyanate-epoxy composite resin composition, cured product thereof and method for producing the same, and sealing material and adhesive each using the single-component cyanate-epoxy composite resin composition | ADEKA CORP | 2010-09-01 | — | — | CN | disclosed |
| US-20100210793-A1 | ONE LIQUID TYPE CYANATE-EPOXY COMPOSITE RESIN COMPOSITION, ITS HARDENED MATERIAL, MANUFACTURING METHOD THEREOF, AND MATERIALS FOR SEALING AND ADHESIVE AGENTS USING THE SAME | ADEKA CORPORATION (JP) | 2010-08-19 | — | — | US | disclosed |
| CN-101679608-A | One-pack type cyanate-epoxy composite resin composition | ADEKA CORP | 2010-03-24 | — | — | CN | disclosed |
| CN-100526380-C | Acrylic sol composition | ADEKA CORP (JP) | 2009-08-12 | — | — | CN | disclosed |
| CN-100509681-C | Curing polymer cement composition | ADEKA CORP (JP) | 2009-07-08 | — | — | CN | disclosed |
| CN-101415791-A | One-part type heat curable composition | SIKA TECHNOLOGY AG (CH) | 2009-04-22 | — | — | CN | disclosed |
| CN-101193975-A | Hardenable resin composition | ADEKA CORP (JP) | 2008-06-04 | — | — | CN | disclosed |
| CN-101014663-A | Acrylic sol composition | ADEKA CORP (JP) | 2007-08-08 | — | — | CN | disclosed |
| CN-1765810-A | Curing polymer cement composition | ASAHI DENKA KOGYO KK (JP) | 2006-05-03 | — | — | CN | disclosed |