Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 3/20 | 0.39 |
| ▸ | CA2 | P00918 | 3/20 | 0.39 |
| ▸ | CA7 | P43166 | 2/20 | 0.39 |
| ▸ | CA9 | Q16790 | 2/20 | 0.39 |
| ▸ | CA12 | O43570 | 1/20 | 0.39 |
| ▸ | CA4 | P22748 | 1/20 | 0.39 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.39 |
| ▸ | HTT | P42858 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.36 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.36 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | TP53 | P04637 | 1/20 | 0.32 |
| ▸ | ADRA2B | P18089 | 1/20 | 0.32 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6433975 | 0.82 | CA1 (0.57) | CA1CA2CA7CA9CA12 | |
| SCHEMBL10950418 | 0.80 | CA1 (0.36) | CA1CA2CA7CA9CA12 | |
| SCHEMBL2581786 | 0.78 | — | — | |
| SCHEMBL9618107 | 0.77 | ALDH1A1 (0.52) | ALDH1A1L3MBTL1MEN1KMT2ATDP1 | |
| SCHEMBL28674235 | 0.77 | CA12 (0.33) | CA1CA2CA7CA9CA12 | |
| SCHEMBL21936342 | 0.76 | TSHR (0.35) | CA1CA2CA7CA9CA12 | |
| SCHEMBL148575 | 0.76 | TSHR (0.35) | CA1CA2CA7CA9CA12 | |
| SCHEMBL10951444 | 0.75 | HSD17B10 (0.43) | ALDH1A1MAPK1TSHRKMT2ASMN1; SMN2 | |
| SCHEMBL9787307 | 0.73 | — | — | |
| SCHEMBL9300117 | 0.73 | CA12 (0.31) | CA1CA2CA7CA9CA12 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 340 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12218291-B2 | Light-emitting device | SAMSUNG DISPLAY CO., LTD. (KR) | 2025-02-04 | — | — | US | claimed |
| US-20210288230-A1 | LIGHT-EMITTING DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2021-09-16 | — | — | US | claimed |
| EP-3017012-B1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | Henkel IP & Holding GmbH (DE) | 2018-03-21 | — | — | EP | claimed |
| US-9850409-B2 | High temperature debondable adhesive | HENKEL AG & CO. KGAA (DE) | 2017-12-26 | — | — | US | claimed |
| EP-3017012-A1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | Henkel IP & Holding GmbH (DE) | 2016-05-11 | — | — | EP | claimed |
| US-20160068720-A1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | HENKEL AG & CO. KGAA (DE) | 2016-03-10 | — | — | US | claimed |
| WO-2015130652-A1 | SYNTHESIS OF OLIGOMERIC DIVINYLDIALKYLSILANE CONTAINING COMPOSITIONS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-09-03 | — | — | WO | claimed |
| US-9085692-B1 | Synthesis of oligomeric divinyldialkylsilane containing compositions | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-07-21 | — | — | US | claimed |
| WO-2015000150-A1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | Henkel IP & Holding GmbH (DE) | 2015-01-08 | — | — | WO | claimed |
| US-8920931-B2 | Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins | DOW CORNING CORPORATION (US) | 2014-12-30 | — | — | US | claimed |
| US-20130149520-A1 | PHOSPHOSILOXANE RESINS, AND CURABLE SILICONE COMPOSITIONS, FREE-STANDING FILMS, AND LAMINATES COMPRISING THE PHOSPHOSILOXANE RESINS | DOW CORNING CORPORATION (US) | 2013-06-13 | — | — | US | claimed |
| WO-2011129935-A1 | COPOLYMERS AND CERAMIC-CARBONACEOUS SOLIDS FROM DIVINYL AROMATIC ETHER OLIGOMERS AND DIVINYL CARBORANE SILOXANE | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2011-10-20 | — | — | WO | claimed |
| US-7897715-B1 | Copolymers and ceramic-carbonaceous solids from divinyl aromatic ether oligomers and divinyl carborane siloxane | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2011-03-01 | — | — | US | claimed |
| US-7863401-B2 | Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2011-01-04 | — | — | US | claimed |
| US-7772355-B2 | Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2010-08-10 | — | — | US | claimed |
| US-7723420-B2 | Catalytic hydrosilylation reaction with oligomeric vinyl silane terminated resin based on bisphenol A or F and 1,3-dibromobenzene and tetrakis(dimethylsiloxy)silane crosslinker in presence of a crosslinking catalyst e.g. platinum-vinylmethylsiloxane complex | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2010-05-25 | — | — | US | claimed |
| US-20100022693-A1 | SYNTHESIS AND POLYMERIZATION OF OLIGOMERIC DIVINYL-TERMINATED AROMATIC ETHER-CONTAINING RESINS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2010-01-28 | — | — | US | claimed |
| WO-2009097252-A1 | DIVINYLSILANE-TERMINATED AROMATIC ETHER-AROMATIC KETONE-CONTAINING COMPOUNDS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2009-08-06 | — | — | WO | claimed |
| US-20090192272-A1 | DIVINYLSILANE-TERMINATED AROMATIC ETHER-AROMATIC KETONE-CONTAINING COMPOUNDS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2009-07-30 | — | — | US | claimed |
| US-12454617-B2 | Silicone elastomer compositions | DOW SILICONES CORPORATION (US) | 2025-10-28 | — | — | US | disclosed |
| US-12378456-B2 | Inflatable safety devices | DOW SILICONES CORPORATION (US) | 2025-08-05 | — | — | US | disclosed |
| US-12378443-B2 | Silicone elastomer compositions | DOW SILICONES CORPORATION (US) | 2025-08-05 | — | — | US | disclosed |
| US-20250115700-A1 | (METH)ACRYLATED HYPERBRANCHED POLYMERS, METHOD OF MAKING, COMPOSITIONS INCLUDING THE SAME, AND ELECTRONIC DEVICE | 3M INNOVATIVE PROPERTIES COMPANY | 2025-04-10 | — | — | US | disclosed |
| WO-2025052187-A1 | HYPERBRANCHED POLYMERS FOR CURABLE HIGH REFRACTIVE INDEX COMPOSITIONS, ARTICLES THEREOF, AND METHODS OF MAKING SUCH ARTICLES | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2025-03-13 | — | — | WO | disclosed |
| CN-113345992-B | Light emitting device | 三星显示有限公司 | 2025-02-25 | — | — | CN | disclosed |
| US-12218291-B2 | Light-emitting device | SAMSUNG DISPLAY CO., LTD. (KR) | 2025-02-04 | — | — | US | disclosed |
| EP-4291615-B1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORP (US) | 2024-12-04 | — | — | EP | disclosed |
| EP-3194501-B1 | 3D PRINTING METHOD UTILIZING A PHOTOCURABLE SILICONE COMPOSITION | DOW SILICONES CORP (US) | 2024-07-10 | — | — | EP | disclosed |
| US-20240132671-A1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORP (US) | 2024-04-25 | — | — | US | disclosed |
| EP-4291615-A1 | SILICONE ELASTOMER COMPOSITIONS | Dow Silicones Corporation (US) | 2023-12-20 | — | — | EP | disclosed |
| US-20230331928-A1 | HYPERBRANCHED POLYMER, METHOD OF MAKING, AND CURABLE COMPOSITION INCLUDING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY | 2023-10-19 | — | — | US | disclosed |
| US-20230303891-A1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORPORATION | 2023-09-28 | — | — | US | disclosed |
| WO-2023161753-A1 | (METH)ACRYLATED HYPERBRANCHED POLYMERS, METHOD OF MAKING, COMPOSITIONS INCLUDING THE SAME, AND ELECTRONIC DEVICE | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2023-08-31 | — | — | WO | disclosed |
| US-20230265290-A1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORPORATION | 2023-08-24 | — | — | US | disclosed |
| EP-3569654-B1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS (JP) | 2023-08-23 | — | — | EP | disclosed |
| US-20230257639-A1 | INFLATABLE SAFETY DEVICES | DOW SILICONES CORPORATION | 2023-08-17 | — | — | US | disclosed |
| EP-4214267-A1 | HYPERBRANCHED POLYMER, METHOD OF MAKING, AND CURABLE COMPOSITION INCLUDING THE SAME | 3M Innovative Properties Company (US) | 2023-07-26 | — | — | EP | disclosed |
| EP-4172245-A1 | SILICONE ELASTOMER COMPOSITIONS | Dow Silicones Corporation (US) | 2023-05-03 | — | — | EP | disclosed |
| EP-4172286-A1 | SILICONE ELASTOMER COMPOSITIONS | Dow Silicones Corporation (US) | 2023-05-03 | — | — | EP | disclosed |
| EP-4172007-A1 | INFLATABLE SAFETY DEVICES | Dow Silicones Corporation (US) | 2023-05-03 | — | — | EP | disclosed |
| US-11603466-B2 | Epoxy resin composition | SUMITOMO SEIKA CHEMICALS CO.. LTD. (JP) | 2023-03-14 | — | — | US | disclosed |
| EP-3569626-B1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS (JP) | 2023-03-01 | — | — | EP | disclosed |
| WO-2022173725-A1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORPORATION (US) | 2022-08-18 | — | — | WO | disclosed |
| US-20220243001-A1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2022-08-04 | — | — | US | disclosed |
| US-11292872-B2 | Epoxy resin composition | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2022-04-05 | — | — | US | disclosed |
| WO-2022058810-A1 | HYPERBRANCHED POLYMER, METHOD OF MAKING, AND CURABLE COMPOSITION INCLUDING THE SAME | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2022-03-24 | — | — | WO | disclosed |
| WO-2021262832-A1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORPORATION (US) | 2021-12-30 | — | — | WO | disclosed |
| WO-2021262830-A1 | SILICONE ELASTOMER COMPOSITIONS | DOW SILICONES CORPORATION (US) | 2021-12-30 | — | — | WO | disclosed |
| WO-2021262828-A1 | INFLATABLE SAFETY DEVICES | DOW SILICONES CORPORATION (US) | 2021-12-30 | — | — | WO | disclosed |
| US-20210288230-A1 | LIGHT-EMITTING DEVICE | SAMSUNG DISPLAY CO., LTD. (KR) | 2021-09-16 | — | — | US | disclosed |
| US-11111382-B2 | Epoxy resin composition | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2021-09-07 | — | — | US | disclosed |
| CN-113345992-A | Light emitting device | 三星显示有限公司 | 2021-09-03 | — | — | CN | disclosed |
| US-11091627-B2 | Epoxy resin composition | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2021-08-17 | — | — | US | disclosed |
| EP-3569628-B1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS (JP) | 2021-08-11 | — | — | EP | disclosed |
| WO-2021145241-A1 | RESIN COMPOSITION | 住友精化株式会社 | 2021-07-22 | — | — | WO | disclosed |
| EP-3569653-B1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS (JP) | 2021-03-10 | — | — | EP | disclosed |
| EP-3239111-B1 | CURABLE COMPOSITION, TRANSFER FILM, FRONT PLATE OF IMAGE DISPLAY DEVICE, FRONT PLATE-INTEGRATED SENSOR, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD FOR FRONT PLATE OF IMAGE DISPLAY DEVICE | FUJIFILM CORP (JP) | 2021-02-17 | — | — | EP | disclosed |
| US-20200385514-A1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2020-12-10 | — | — | US | disclosed |
| US-20200385565-A1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2020-12-10 | — | — | US | disclosed |
| EP-3430085-B1 | MATERIALS FOR ENCAPSULATING LEDS | FRAUNHOFER GES FORSCHUNG (DE) | 2020-06-24 | — | — | EP | disclosed |
| US-20190352448-A1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2019-11-21 | — | — | US | disclosed |
| EP-3569628-A1 | EPOXY RESIN COMPOSITION | Sumitomo Seika Chemicals Co. Ltd. (JP) | 2019-11-20 | — | — | EP | disclosed |
| EP-3569653-A1 | EPOXY RESIN COMPOSITION | Sumitomo Seika Chemicals Co. Ltd. (JP) | 2019-11-20 | — | — | EP | disclosed |
| EP-3569627-A1 | EPOXY RESIN COMPOSITION | Sumitomo Seika Chemicals Co. Ltd. (JP) | 2019-11-20 | — | — | EP | disclosed |
| EP-3569654-A1 | EPOXY RESIN COMPOSITION | Sumitomo Seika Chemicals Co. Ltd. (JP) | 2019-11-20 | — | — | EP | disclosed |
| EP-3569626-A1 | EPOXY RESIN COMPOSITION | Sumitomo Seika Chemicals Co. Ltd. (JP) | 2019-11-20 | — | — | EP | disclosed |
| US-20190322858-A1 | EPOXY RESIN COMPOSITION | SUMITOMO SEIKA CHEMICALS CO., LTD. (JP) | 2019-10-24 | — | — | US | disclosed |
| EP-3329308-B1 | SMART OPTICAL MATERIALS, FORMULATIONS, METHODS, USES, ARTICLES, AND DEVICES | DOW SILICONES CORP (US) | 2019-09-04 | — | — | EP | disclosed |
| CN-110167989-A | Composition epoxy resin | 住友精化株式会社 | 2019-08-23 | — | — | CN | disclosed |
| EP-3473328-A1 | METHOD OF SEPARATING VOLATILE SILOXANE FROM A LIQUID FEED MIXTURE | Dow Silicones Corporation (US) | 2019-04-24 | — | — | EP | disclosed |
| US-20190106593-A1 | 3D PRINTING METHOD UTILIZING A PHOTOCURABLE SILICONE COMPOSITION | DOW SILICONES CORP (US) | 2019-04-11 | — | — | US | disclosed |
| US-20190088838-A1 | MATERIALS FOR LED ENCAPSULATION | OSRAM OPTO SEMICONDUCTORS GMBH (DE) | 2019-03-21 | — | — | US | disclosed |
| EP-3430085-A1 | MATERIALS FOR ENCAPSULATING LEDS | Fraunhofer Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) | 2019-01-23 | — | — | EP | disclosed |
| US-10175510-B2 | Smart optical materials, formulations, methods, uses, articles, and devices | DOW CORNING CORPORATION (US) | 2019-01-08 | — | — | US | disclosed |
| EP-2938678-B1 | COMPOSITION FOR FORMING AN ARTICLE HAVING EXCELLENT REFLECTANCE AND FLAME RETARDANT PROPERTIES AND ARTICLE FORMED THEREFROM | DOW SILICONES CORP (US) | 2018-12-19 | — | — | EP | disclosed |
| US-10155884-B2 | 3D printing method utilizing a photocurable silicone composition | DOW SILICONES CORPORATION (US) | 2018-12-18 | — | — | US | disclosed |
| EP-3122440-B1 | METHOD OF SEPARATING VOLATILE SILOXANE FROM A LIQUID FEED MIXTURE | DOW SILICONES CORP (US) | 2018-11-21 | — | — | EP | disclosed |
| EP-2935429-B1 | CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME | DOW SILICONES CORP (US) | 2018-11-07 | — | — | EP | disclosed |
| US-20180299705-A1 | SMART OPTICAL MATERIALS, FORMULATIONS, METHODS, USES, ARTICLES, AND DEVICES | DOW CORNING CORPORATION (US) | 2018-10-18 | — | — | US | disclosed |
| EP-3352887-A1 | METHOD OF REMOVING VOLATILE COMPOUNDS FOR EMULSIONS | Dow Silicones Corporation (US) | 2018-08-01 | — | — | EP | disclosed |
| US-20180200675-A1 | METHOD OF REMOVING VOLATILE COMPOUNDS FROM EMULSIONS | DOW SILICONES CORPORATION | 2018-07-19 | — | — | US | disclosed |
| EP-3329308-A1 | SMART OPTICAL MATERIALS, FORMULATIONS, METHODS, USES, ARTICLES, AND DEVICES | Dow Silicones Corporation (US) | 2018-06-06 | — | — | EP | disclosed |
| US-9962657-B2 | Method of and system for separating volatile siloxane from feed mixture | DOW CORNING CORPORATION (US) | 2018-05-08 | — | — | US | disclosed |
| EP-3017012-B1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | Henkel IP & Holding GmbH (DE) | 2018-03-21 | — | — | EP | disclosed |
| US-20180002569-A1 | CURABLE SILICONE FORMULATIONS AND RELATED CURED PRODUCTS, METHODS, ARTICLES, AND DEVICES | DOW SILICONES CORPORATION | 2018-01-04 | — | — | US | disclosed |
| US-9850409-B2 | High temperature debondable adhesive | HENKEL AG & CO. KGAA (DE) | 2017-12-26 | — | — | US | disclosed |
| US-9842952-B2 | Photovoltaic cell module and method of forming | DOW CORNING CORPORATION (US) | 2017-12-12 | — | — | US | disclosed |
| EP-3239111-A1 | CURABLE COMPOSITION, TRANSFER FILM, FRONT PLATE OF IMAGE DISPLAY DEVICE, FRONT PLATE-INTEGRATED SENSOR, IMAGE DISPLAY DEVICE, AND MANUFACTURING METHOD FOR FRONT PLATE OF IMAGE DISPLAY DEVICE | FUJIFILM Corporation (JP) | 2017-11-01 | — | — | EP | disclosed |
| US-20170283655-A1 | 3D PRINTING METHOD UTILIZING A PHOTOCURABLE SILICONE COMPOSITION | DOW CORNING CORPORATION (US) | 2017-10-05 | — | — | US | disclosed |
| WO-2017157743-A1 | MATERIALS FOR ENCAPSULATING LEDS | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. (DE) | 2017-09-21 | — | — | WO | disclosed |
| EP-3194501-A1 | 3D PRINTING METHOD UTILIZING A PHOTOCURABLE SILICONE COMPOSITION | Dow Corning Corporation (US) | 2017-07-26 | — | — | EP | disclosed |
| US-20170200667-A1 | Photopatternable Silicones For Wafer Level Z-Axis Thermal Interposer | DOW CORNING CORPORATION (US) | 2017-07-13 | — | — | US | disclosed |
| EP-3158582-A1 | PHOTOPATTERNABLE SILICONES FOR WAFER LEVEL Z-AXIS THERMAL INTERPOSER | Dow Corning Corporation (US) | 2017-04-26 | — | — | EP | disclosed |
| US-9593241-B2 | Resin composition for encapsulating optical element | DONGJIN SEMICHEM CO., LTD. (KR) | 2017-03-14 | — | — | US | disclosed |
| EP-3122440-A1 | METHOD OF SEPARATING VOLATILE SILOXANE FROM FEED MIXTURE | Dow Corning Corporation (US) | 2017-02-01 | — | — | EP | disclosed |
| US-20170021307-A1 | Method Of Separating Volatile Siloxane From Feed Mixture | DOW CORNING CORPORATION | 2017-01-26 | — | — | US | disclosed |
| US-9507054-B2 | Composition for forming an article having excellent reflectance and flame retardant properties and article formed therefrom | DOW CORNING CORPORATION (US) | 2016-11-29 | — | — | US | disclosed |
| EP-3094685-A1 | CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES | Henkel AG & Co. KGaA (DE) | 2016-11-23 | — | — | EP | disclosed |
| US-20160319103-A1 | CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES | HENKEL AG & CO KGAA (DE) | 2016-11-03 | — | — | US | disclosed |
| US-9447308-B2 | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same | DOW CORNING CORPORATION (US) | 2016-09-20 | — | — | US | disclosed |
| US-9441086-B2 | Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same | DOW CORNING CORPORATION (US) | 2016-09-13 | — | — | US | disclosed |
| US-9428680-B2 | Conductive silicone materials and uses | DOW CORNING CORPORATION (US) | 2016-08-30 | — | — | US | disclosed |
| WO-2016126438-A1 | CURABLE SILICONE FORMULATIONS AND RELATED CURED PRODUCTS, METHODS, ARTICLES, AND DEVICES | DOW CORNING CORPORATION (US) | 2016-08-11 | — | — | WO | disclosed |
| EP-3017012-A1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | Henkel IP & Holding GmbH (DE) | 2016-05-11 | — | — | EP | disclosed |
| WO-2016044547-A1 | 3D PRINTING METHOD UTILIZING A PHOTOCURABLE SILICONE COMPOSITION | DOW CORNING CORPORATION (US) | 2016-03-24 | — | — | WO | disclosed |
| US-20160068720-A1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | HENKEL AG & CO. KGAA (DE) | 2016-03-10 | — | — | US | disclosed |
| US-9268451-B2 | Transfer film, manufacturing method of capacitive input device, capacitive input device, and image display device including the same | FUJIFILM CORPORATION (JP) | 2016-02-23 | — | — | US | disclosed |
| US-20160024358-A1 | Conductive Silicone Materials And Uses | DOW SILICONES CORPORATION | 2016-01-28 | — | — | US | disclosed |
| US-20160017185-A1 | Curable Silicone Compositions, Electrically Conductive Silicone Adhesives, Methods of Making and Using Same, and Electrical Devices Containing Same | DOW SILICONES CORPORATION | 2016-01-21 | — | — | US | disclosed |
| EP-2970728-A1 | CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME | Dow Corning Corporation (US) | 2016-01-20 | — | — | EP | disclosed |
| US-20150376407-A1 | RESIN COMPOSITION FOR ENCAPSULATING OPTICAL ELEMENT | DONGJIN SEMICHEM CO., LTD. (KR) | 2015-12-31 | — | — | US | disclosed |
| US-20150362628-A1 | Composition For Forming An Article Having Excellent Reflectance And Flame Retardant Properties And Article Formed Therefrom | DOW SILICONES CORPORATION | 2015-12-17 | — | — | US | disclosed |
| US-9187602-B2 | Heteroelement siloxane compounds and polymers | DOW CORNING CORPORATION (US) | 2015-11-17 | — | — | US | disclosed |
| US-20150315437-A1 | Curable Silicone Compositions, Electrically Conductive Silicone Adhesives, Methods Of Making And Using Same, And Electrical Devices Containing Same | DOW CORNING CORPORATION (US) | 2015-11-05 | — | — | US | disclosed |
| EP-2938678-A1 | COMPOSITION FOR FORMING AN ARTICLE HAVING EXCELLENT REFLECTANCE AND FLAME RETARDANT PROPERTIES AND ARTICLE FORMED THEREFROM | Dow Corning Corporation (US) | 2015-11-04 | — | — | EP | disclosed |
| EP-2935429-A1 | CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME | Dow Corning Corporation (US) | 2015-10-28 | — | — | EP | disclosed |
| EP-2795682-B1 | METHOD OF FORMING A PHOTOVOLTAIC CELL MODULE HAVING IMPROVED IMPACT RESISTANCE | DOW CORNING (US) | 2015-09-30 | — | — | EP | disclosed |
| WO-2015130652-A1 | SYNTHESIS OF OLIGOMERIC DIVINYLDIALKYLSILANE CONTAINING COMPOSITIONS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-09-03 | — | — | WO | disclosed |
| WO-2015106438-A1 | CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICES | HENKEL (CHINA) COMPANY LIMITED (CN) | 2015-07-23 | — | — | WO | disclosed |
| US-9085692-B1 | Synthesis of oligomeric divinyldialkylsilane containing compositions | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2015-07-21 | — | — | US | disclosed |
| US-9080017-B2 | Siloxane-based composition and cured product thereof, and use therefor | CENTRAL GLASS COMPANY, LIMITED (JP) | 2015-07-14 | — | — | US | disclosed |
| US-20150171249-A1 | PHOTOVOLTAIC CELL MODULE AND METHOD OF FORMING | DOW SILICONES CORPORATION | 2015-06-18 | — | — | US | disclosed |
| US-9012547-B2 | Hydrosilylation cured silicone resins plasticized by organophosphorous compounds | DOW CORNING CORPORATION (US) | 2015-04-21 | — | — | US | disclosed |
| US-20150092123-A1 | TRANSFER FILM, MANUFACTURING METHOD OF CAPACITIVE INPUT DEVICE, CAPACITIVE INPUT DEVICE, AND IMAGE DISPLAY DEVICE INCLUDING THE SAME | FUJIFILM CORPORATION (JP) | 2015-04-02 | — | — | US | disclosed |
| EP-2265666-B1 | SILICONE COMPOSITION, SILICONE ADHESIVE, COATED AND LAMINATED SUBSTRATES | DOW CORNING (US) | 2015-03-25 | — | — | EP | disclosed |
| WO-2015000150-A1 | HIGH TEMPERATURE DEBONDABLE ADHESIVE | Henkel IP & Holding GmbH (DE) | 2015-01-08 | — | — | WO | disclosed |
| US-8920931-B2 | Phosphosiloxane resins, and curable silicone compositions, free-standing films, and laminates comprising the phosphosiloxane resins | DOW CORNING CORPORATION (US) | 2014-12-30 | — | — | US | disclosed |
| US-8912268-B2 | Silicone resin film, method of preparing same, and nanomaterial-filled silicone composition | DOW CORNING CORPORATION (US) | 2014-12-16 | — | — | US | disclosed |
| EP-1516208-B1 | PLANAR OPTICAL WAVEGUIDE ASSEMBLY AND METHOD OF PREPARING SAME | DOW CORNING (US) | 2014-11-05 | — | — | EP | disclosed |
| EP-1523525-B1 | PLANAR OPTICAL WAVEGUIDE ASSEMBLY AND METHOD OF PREPARING SAME | DOW CORNING (US) | 2014-11-05 | — | — | EP | disclosed |
| CN-102433003-B | Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material | CHEIL IND INC | 2014-11-05 | — | — | CN | disclosed |
| US-8877877-B2 | Polyorganosiloxane, encapsulation material obtained from the polyorganosiloxane, and electronic device including the encapsulation material | CHEIL INDUSTRIES, INC. (KR) | 2014-11-04 | — | — | US | disclosed |
| EP-2795682-A1 | METHOD OF FORMING A PHOTOVOLTAIC CELL MODULE HAVING IMPROVED IMPACT RESISTANCE | Dow Corning Corporation (US) | 2014-10-29 | — | — | EP | disclosed |
| US-20140305500-A1 | LOW THERMAL DISTORTION SILICONE COMPOSITE MOLDS | DOW CORNING (US) | 2014-10-16 | — | — | US | disclosed |
| WO-2014159792-A1 | CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME | DOW CORNING CORPORATION (US) | 2014-10-02 | — | — | WO | disclosed |
| WO-2014150302-A1 | CONDUCTIVE SILICONE MATERIALS AND USES | DOW CORNING CORPORATION (US) | 2014-09-25 | — | — | WO | disclosed |
| WO-2014143627-A1 | CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME | DOW CORNING CORPORATION (US) | 2014-09-18 | — | — | WO | disclosed |
| US-20140275445-A1 | Siloxane-Based Composition and Cured Product Thereof, and Use Therefor | CENTRAL GLASS COMPANY, LIMITED (JP) | 2014-09-18 | — | — | US | disclosed |
| EP-2351102-B1 | PHOTOVOLTAIC CELL MODULE AND METHOD OF FORMING | DOW CORNING (US) | 2014-08-20 | — | — | EP | disclosed |
| US-8795560-B2 | Low thermal distortion silicone composite molds | DOW CORNING CORPORATION (US) | 2014-08-05 | — | — | US | disclosed |
| US-20140194019-A1 | Silicone Composition, Silicone Adhesive, Coated and Laminated Substrates | DOW CORNING CORPORATION (US) | 2014-07-10 | — | — | US | disclosed |
| WO-2014105645-A1 | COMPOSITION FOR FORMING AN ARTICLE HAVING EXCELLENT REFLECTANCE AND FLAME RETARDANT PROPERTIES AND ARTICLE FORMED THEREFROM | DOW CORNING CORPORATION (US) | 2014-07-03 | — | — | WO | disclosed |
| WO-2014105981-A1 | METHOD OF PREPARING ELECTROACTIVE ARTICLE AND ELECTROACTIVE ARTICLE FORMED IN ACCORDANCE THEREWITH | DOW CORNING CORPORATION (US) | 2014-07-03 | — | — | WO | disclosed |
| WO-2014105986-A1 | ELECTROACTIVE ARTICLE INCLUDING MODIFIED ELECTROACTIVE LAYER | DOW CORNING CORPORATION (US) | 2014-07-03 | — | — | WO | disclosed |
| WO-2014099639-A1 | CURABLE SILICONE COMPOSITIONS, ELECTRICALLY CONDUCTIVE SILICONE ADHESIVES, METHODS OF MAKING AND USING SAME, AND ELECTRICAL DEVICES CONTAINING SAME | DOW CORNING CORPORATION (US) | 2014-06-26 | — | — | WO | disclosed |
| US-20140137736-A1 | MEMBRANE DERIVED FROM POLYETHER- AND SILICEOUS FILLER-CONTAINING SILICONE COMPOSITION | DOW CORNING CORPORATION (US) | 2014-05-22 | — | — | US | disclosed |
| EP-2052292-B1 | METHOD OF PREPARING A PATTERNED FILM WITH A DEVELOPING SOLVENT | DOW CORNING (US) | 2014-02-26 | — | — | EP | disclosed |
| CN-101681939-B | A solar cell including a silicone resin layer | DOW CORNING | 2014-02-26 | — | — | CN | disclosed |
| US-8647964-B2 | Temporary wafer bonding method for semiconductor processing | DOW CORNING CORPORATION (US) | 2014-02-11 | — | — | US | disclosed |
| US-8637627-B2 | Phenoxyphenyl polysiloxane composition and method for making and using same | ROHM AND HAAS COMPANY (US) | 2014-01-28 | — | — | US | disclosed |
| EP-2655057-A2 | SILICONE COMPOSITION, SILICONE ADHESIVE, COATED AND LAMINATED SUBSTRATES | Dow Corning Corporation (US) | 2013-10-30 | — | — | EP | disclosed |
| EP-2653923-A1 | Method for forming semipermeable membranes for sensor applications using photopolymerizable silicone materials | Dow Corning Corporation (US) | 2013-10-23 | — | — | EP | disclosed |
| EP-2638106-A1 | HYDROSILYLATION CURED SILICONE RESINS PLASTICIZED BY ORGANOPHOSPHOROUS COMPOUNDS | Dow Corning Corporation (US) | 2013-09-18 | — | — | EP | disclosed |
| WO-2013133884-A1 | METHOD OF FORMING A PHOTOVOLTAIC CELL MODULE HAVING IMPROVED IMPACT RESISTANCE | DOW CORNING CORPORATION (US) | 2013-09-12 | — | — | WO | disclosed |
| US-8486615-B2 | Photopolymerizable silicone materials forming semipermeable membranes for sensor applications | DOW CORNING CORPORATION (US) | 2013-07-16 | — | — | US | disclosed |
| WO-2013103330-A2 | SILICONE COMPOSITION, SILICONE ADHESIVE, COATED AND LAMINATED SUBSTRATES | DOW CORNING CORPORATION (US) | 2013-07-11 | — | — | WO | disclosed |
| EP-2609137-A1 | PHOSPHOSILOXANE RESINS, AND CURABLE SILICONE COMPOSITIONS, FREE-STANDING FILMS, AND LAMINATES COMPRISING THE PHOSPHOSILOXANE RESINS | Dow Corning Corporation (US) | 2013-07-03 | — | — | EP | disclosed |
| US-20130164517-A1 | Hydrosilylation Cured Silicone Resins Plasticized By Organophosphorous Compounds | DOW CORNING CORPORATION (US) | 2013-06-27 | — | — | US | disclosed |
| US-20130149520-A1 | PHOSPHOSILOXANE RESINS, AND CURABLE SILICONE COMPOSITIONS, FREE-STANDING FILMS, AND LAMINATES COMPRISING THE PHOSPHOSILOXANE RESINS | DOW CORNING CORPORATION (US) | 2013-06-13 | — | — | US | disclosed |
| US-20130146118-A1 | Silicone Junction Box and Assemblies | DOW CORNING CORPORATION (US) | 2013-06-13 | — | — | US | disclosed |
| US-8450442-B2 | Borosiloxane composition, borosiloxane adhesive, coated and laminated substrates | DOW CORNING CORPORATION (US) | 2013-05-28 | — | — | US | disclosed |
| US-20130023109-A1 | Temporary Wafer Bonding Method for Semiconductor Processing | DOW CORNING CORPORATION | 2013-01-24 | — | — | US | disclosed |
| EP-2534218-A1 | TEMPORARY WAFER BONDING METHOD FOR SEMICONDUCTOR PROCESSING | Dow Corning Corporation (US) | 2012-12-19 | — | — | EP | disclosed |
| WO-2012170541-A1 | MEMBRANE DERIVED FROM POLYETHER- AND SILICEOUS FILLER-CONTAINING SILICONE COMPOSITION | AHN DONGCHAN (US) | 2012-12-13 | — | — | WO | disclosed |
| US-8323797-B2 | Composite article having excellent fire and impact resistance and method of making the same | DOW CORNING CORPORATION (US) | 2012-12-04 | — | — | US | disclosed |
| EP-2117836-B1 | REINFORCED SILICONE RESIN FILMS | DOW CORNING (US) | 2012-11-07 | — | — | EP | disclosed |
| US-20120256303-A1 | METHOD OF PREPARING A PATTERNED FILM WITH A DEVELOPING SOLVENT | DOW CORNING CORPORATION | 2012-10-11 | — | — | US | disclosed |
| US-8283025-B2 | Reinforced silicone resin films | DOW CORNING CORPORATION (US) | 2012-10-09 | — | — | US | disclosed |
| WO-2012135114-A1 | FLUORO SURFACE SEGREGATED MONOLAYER COATING | DOW CORNING CORPORATION (US) | 2012-10-04 | — | — | WO | disclosed |
| US-8277945-B2 | Glass substrates coated or laminated with multiple layers of cured silicone resin compositions | DOW CORNING CORPORATION (US) | 2012-10-02 | — | — | US | disclosed |
| US-8277939-B2 | Glass substrates coated or laminated with cured silicone resin compositions | DOW CORNING CORPORATION (US) | 2012-10-02 | — | — | US | disclosed |
| US-8268445-B2 | — | — | 2012-09-18 | — | — | US | disclosed |
| US-20120232227-A1 | POLYMERS MADE FROM POLYHEDRAL OLIGOMERIC SILSESQUIOXANES AND ACETYLENE-CONTAINING COMPOUNDS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2012-09-13 | — | — | US | disclosed |
| US-8263727-B1 | Polymers made from polyhedral oligomeric silsesquioxanes acetylene-containing compounds | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2012-09-11 | — | — | US | disclosed |
| EP-2485276-A2 | Photovoltaic Cell Module and Method of Forming | Dow Corning Corporation (US) | 2012-08-08 | — | — | EP | disclosed |
| EP-2485277-A2 | Photovoltaic cell module and method of forming | Dow Corning Corporation (US) | 2012-08-08 | — | — | EP | disclosed |
| US-8227181-B2 | Method of preparing a patterned film with a developing solvent | DOW CORNING CORPORATION (US) | 2012-07-24 | — | — | US | disclosed |
| US-8208359-B2 | Optical head, optical information recording and reproducing device, and optical information system device | PANASONIC CORPORATION (JP) | 2012-06-26 | — | — | US | disclosed |
| US-8207442-B2 | Reinforcing structures for thin-film photovoltaic device substrates, and associated methods | ITN ENERGY SYSTEMS, INC. (US) | 2012-06-26 | — | — | US | disclosed |
| EP-2118217-B1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING (US) | 2012-05-23 | — | — | EP | disclosed |
| WO-2012064534-A1 | HYDROSILYLATION CURED SILICONE RESINS PLASTICIZED BY ORGANOPHOSPHOROUS COMPOUNDS | DOW CORNING CORPORATION (US) | 2012-05-18 | — | — | WO | disclosed |
| CN-102433003-A | Polyorganosiloxane, encapsulating material obtained from the polyorganosiloxane, and electronic device including the encapsulating material | CHEIL IND INC | 2012-05-02 | — | — | CN | disclosed |
| WO-2012027337-A1 | PHOSPHOSILOXANE RESINS, AND CURABLE SILICONE COMPOSITIONS, FREE-STANDING FILMS, AND LAMINATES COMPRISING THE PHOSPHOSILOXANE RESINS | DOW CORNING CORPORATION (US) | 2012-03-01 | — | — | WO | disclosed |
| US-20120046423-A1 | POLYORGANOSILOXANE, ENCAPSULATION MATERIAL OBTAINED FROM THE POLYORGANOSILOXANE, AND ELECTRONIC DEVICE INCLUDING THE ENCAPSULATION MATERIAL | CHEIL INDUSTRIES, INC. (KR) | 2012-02-23 | — | — | US | disclosed |
| US-8092910-B2 | Reinforced silicone resin film and method of preparing same | DOW CORNING TORAY CO., LTD. (JP) | 2012-01-10 | — | — | US | disclosed |
| EP-1535965-B1 | POLYSILOXANE FILM AND PROCESS FOR PRODUCING THE SAME | DOW CORNING ASIA LTD (JP) | 2012-01-04 | — | — | EP | disclosed |
| EP-1636653-B1 | ADHESION METHOD USING GRAY-SCALE PHOTOLITHOGRAPHY | DOW CORNING (US) | 2011-12-28 | — | — | EP | disclosed |
| WO-2011129935-A1 | COPOLYMERS AND CERAMIC-CARBONACEOUS SOLIDS FROM DIVINYL AROMATIC ETHER OLIGOMERS AND DIVINYL CARBORANE SILOXANE | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2011-10-20 | — | — | WO | disclosed |
| EP-1856206-B1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING (US) | 2011-10-12 | — | — | EP | disclosed |
| US-20110240103-A1 | SOLAR CELL INCLUDING A SILICONE RESIN LAYER | DOW CORNING CORPORATION | 2011-10-06 | — | — | US | disclosed |
| US-8008420-B2 | Organohydrogenpolysiloxane resin and silicone composition | DOW CORNING CORPORATION (US) | 2011-08-30 | — | — | US | disclosed |
| WO-2011100030-A1 | TEMPORARY WAFER BONDING METHOD FOR SEMICONDUCTOR PROCESSING | DOW CORNING CORPORATION (US) | 2011-08-18 | — | — | WO | disclosed |
| CN-101548322-B | Optical head, optical information recording and retrieval device, and optical information system device | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 2011-08-17 | — | — | CN | disclosed |
| EP-2351102-A2 | PHOTOVOLTAIC CELL MODULE AND METHOD OF FORMING | Dow Corning Corporation (US) | 2011-08-03 | — | — | EP | disclosed |
| EP-1969065-B1 | SILICONE RESIN FILM, METHOD OF PREPARING SAME, AND NANOMATERIAL-FILLED SILICONE COMPOSITION | DOW CORNING (US) | 2011-07-27 | — | — | EP | disclosed |
| EP-1979427-B1 | SILICONE RESIN FILM, METHOD OF PREPARING SAME, AND NANOMATERIAL-FILLED SILICONE COMPOSITION | DOW CORNING (US) | 2011-07-13 | — | — | EP | disclosed |
| EP-2201063-B1 | REINFORCED SILICONE RESIN FILM AND NANOFIBER-FILLED SILICONE COMPOSITION | DOW CORNING (US) | 2011-07-06 | — | — | EP | disclosed |
| EP-2333841-A2 | Cadmium telluride-based photovoltaic device and method of preparing the same | Dow Corning Corporation (US) | 2011-06-15 | — | — | EP | disclosed |
| EP-2325003-A1 | Extruder die assembly for multilayers | Dow Corning Corporation (US) | 2011-05-25 | — | — | EP | disclosed |
| US-7897715-B1 | Copolymers and ceramic-carbonaceous solids from divinyl aromatic ether oligomers and divinyl carborane siloxane | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2011-03-01 | — | — | US | disclosed |
| US-20110014482-A1 | DUCTILE MULTILAYER SILICONE RESIN FILMS | DOW CORNING CORPORATION (US) | 2011-01-20 | — | — | US | disclosed |
| EP-1362364-B1 | SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME | DOW CORNING (US) | 2011-01-05 | — | — | EP | disclosed |
| US-7863401-B2 | Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2011-01-04 | — | — | US | disclosed |
| EP-2265666-A1 | SILICONE COMPOSITION, SILICONE ADHESIVE, COATED AND LAMINATED SUBSTRATES | Dow Corning Corporation (US) | 2010-12-29 | — | — | EP | disclosed |
| US-20100316876-A1 | Borosiloxane Composition, Borosiloxane Adhesive, Coated and Laminated Substrates | DOW CORNING CORPORATION | 2010-12-16 | — | — | US | disclosed |
| EP-2254934-A1 | BOROSILOXANE COMPOSITION, BOROSILOXANE ADHESIVE, COATED AND LAMINATED SUBSTRATES | Dow Corning Corporation (US) | 2010-12-01 | — | — | EP | disclosed |
| US-20100298481-A1 | DIVINYLSILANE-TERMINATED AROMATIC ETHER-AROMATIC KETONE-CONTAINING COMPOUNDS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2010-11-25 | — | — | US | disclosed |
| US-7799842-B2 | Reinforced silicone resin film and method of preparing same | DOW CORNING CORPORATION (US) | 2010-09-21 | — | — | US | disclosed |
| US-20100209687-A1 | Reinforced Silicone Resin Film and Nanofiber-Filled Silicone Composition | ZHU BIZHONG | 2010-08-19 | — | — | US | disclosed |
| US-20100200146-A1 | LOW THERMAL DISTORTION SILICONE COMPOSITE MOLDS | DOW CORNING CORPORATION | 2010-08-12 | — | — | US | disclosed |
| US-7772355-B2 | Divinylsilane-terminated aromatic ether-aromatic ketone-containing compounds | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2010-08-10 | — | — | US | disclosed |
| US-20100178472-A1 | Method of Preparing A Patterned Film With A Developing Solvent | DOW SILICONES CORPORATION | 2010-07-15 | — | — | US | disclosed |
| EP-2201063-A1 | REINFORCED SILICONE RESIN FILM AND NANOFIBER-FILLED SILICONE COMPOSITION | Dow Corning Corporation (US) | 2010-06-30 | — | — | EP | disclosed |
| US-20100146886-A1 | Composite Article Having Excellent Fire Resistance | DOW CORNING CORPORATION | 2010-06-17 | — | — | US | disclosed |
| US-20100130702-A1 | Organohydrogenpolysiloxane resin and silicone composition | DOW CORNING CORPORATION | 2010-05-27 | — | — | US | disclosed |
| US-7723420-B2 | Catalytic hydrosilylation reaction with oligomeric vinyl silane terminated resin based on bisphenol A or F and 1,3-dibromobenzene and tetrakis(dimethylsiloxy)silane crosslinker in presence of a crosslinking catalyst e.g. platinum-vinylmethylsiloxane complex | THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2010-05-25 | — | — | US | disclosed |
| WO-2010051355-A2 | PHOTOVOLTAIC CELL MODULE AND METHOD OF FORMING | DOW CORNING CORPORATION (US) | 2010-05-06 | — | — | WO | disclosed |
| US-20100104877-A1 | Composite Article Having Excellent Fire and Impact Resistance and Method Of Making The Same | DOW CORNING CORPORATION | 2010-04-29 | — | — | US | disclosed |
| US-20100093242-A1 | Composite Article Having Excellent Fire Resistance | DOW CORNING CORPORATION | 2010-04-15 | — | — | US | disclosed |
| US-20100086760-A1 | Reinforced Silicone Resin Films | DOW CORNING CORPORATION | 2010-04-08 | — | — | US | disclosed |
| US-20100075127-A1 | Reinforced Silicone Resin Film and Method of Preparing Same | DOW CORNING CORPORATION | 2010-03-25 | — | — | US | disclosed |
| CN-101681939-A | A solar cell including a silicone resin layer | DOW CORNING | 2010-03-24 | — | — | CN | disclosed |
| US-20100068538-A1 | Silicone Resin Film, Method of Preparing Same, and Nanomaterial-Filled Silicone Composition | DOW CORNING CORPORATION (US) | 2010-03-18 | — | — | US | disclosed |
| US-20100051920-A1 | Composite Article Including a Cation-Sensitive Layer | DOW CORNING CORPORATION (US) | 2010-03-04 | — | — | US | disclosed |
| US-20100041851-A1 | HETEROELEMENT SILOXANE COMPOUNDS AND POLYMERS | DOW CORNING CORPORATION (US) | 2010-02-18 | — | — | US | disclosed |
| US-20100022693-A1 | SYNTHESIS AND POLYMERIZATION OF OLIGOMERIC DIVINYL-TERMINATED AROMATIC ETHER-CONTAINING RESINS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2010-01-28 | — | — | US | disclosed |
| US-20100015439-A1 | Glass Substrates Coated or Laminated With Cured Silicone Resin Compositions | DOW CORNING CORPORATION | 2010-01-21 | — | — | US | disclosed |
| US-20100015454-A1 | Glass Substrates Coated or Laminated With Multiple Layers of Cured Silicone Resin Compositions | DOW CORNING CORPORATION | 2010-01-21 | — | — | US | disclosed |
| EP-1893671-B1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING (US) | 2009-12-23 | — | — | EP | disclosed |
| EP-2125652-A1 | GLASS SUBSTRATES COATED OR LAMINATED WITH CURED SILICONE RESIN COMPOSITIONS | Dow Corning Corporation (US) | 2009-12-02 | — | — | EP | disclosed |
| EP-2125651-A1 | GLASS SUBSTRATES COATED OR LAMINATED WITH MULTIPLE LAYERS OF CURED SILICONE RESIN COMPOSITIONS | Dow Corning Corporation (US) | 2009-12-02 | — | — | EP | disclosed |
| EP-2125363-A2 | COMPOSITE ARTICLE HAVING EXCELLENT FIRE AND IMPACT RESISTANCE AND METHOD OF MAKING THE SAME | Dow Corning Corporation (US) | 2009-12-02 | — | — | EP | disclosed |
| EP-2125362-A1 | COMPOSITE ARTICLE HAVING EXCELLENT FIRE RESISTANCE | Dow Corning Corporation (US) | 2009-12-02 | — | — | EP | disclosed |
| EP-2118217-A1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2009-11-18 | — | — | EP | disclosed |
| EP-2117836-A1 | REINFORCED SILICONE RESIN FILMS | Dow Corning Corporation (US) | 2009-11-18 | — | — | EP | disclosed |
| EP-2018669-B1 | COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | DOW CORNING (US) | 2009-11-11 | — | — | EP | disclosed |
| EP-2115039-A2 | HETEROELEMENT SILOXANE COMPOUNDS AND POLYMERS | DOW CORNING CORPORATION (US) | 2009-11-11 | — | — | EP | disclosed |
| EP-2114670-A1 | COMPOSITE ARTICLE HAVING EXCELLENT FIRE RESISTANCE | Dow Corning Corporation (US) | 2009-11-11 | — | — | EP | disclosed |
| US-20090268588-A1 | OPTICAL HEAD, OPTICAL INFORMATION RECORDING AND REPRODUCING DEVICE, AND OPTICAL INFORMATION SYSTEM DEVICE | PANASONIC CORPORATION (JP) | 2009-10-29 | — | — | US | disclosed |
| US-20090246499-A1 | Silicone Resin Film and Method of Preparing Same | DOW CORNING CORPORATION | 2009-10-01 | — | — | US | disclosed |
| CN-101548322-A | Optical head, optical information recording and retrieval device, and optical information system device | MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) | 2009-09-30 | — | — | CN | disclosed |
| WO-2009111193-A1 | BOROSILOXANE COMPOSITION, BOROSILOXANE ADHESIVE, COATED AND LAMINATED SUBSTRATES | DOW CORNING CORPORATION (US) | 2009-09-11 | — | — | WO | disclosed |
| WO-2009111190-A1 | SILICONE COMPOSITION, SILICONE ADHESIVE, COATED AND LAMINATED SUBSTRATES | DOW CORNING CORPORATION (US) | 2009-09-11 | — | — | WO | disclosed |
| EP-2016625-B1 | COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | DOW CORNING (US) | 2009-09-02 | — | — | EP | disclosed |
| EP-2095446-A1 | COMPOSITE ARTICLE INCLUDING A CATION-SENSITIVE LAYER | Dow Corning Corporation (US) | 2009-09-02 | — | — | EP | disclosed |
| WO-2009097252-A1 | DIVINYLSILANE-TERMINATED AROMATIC ETHER-AROMATIC KETONE-CONTAINING COMPOUNDS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2009-08-06 | — | — | WO | disclosed |
| US-20090192272-A1 | DIVINYLSILANE-TERMINATED AROMATIC ETHER-AROMATIC KETONE-CONTAINING COMPOUNDS | THE GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF THE NAVY (US) | 2009-07-30 | — | — | US | disclosed |
| EP-2076387-A2 | DUCTILE MULTILAYER SILICONE RESIN FILMS | Dow Corning Corporation (US) | 2009-07-08 | — | — | EP | disclosed |
| CN-101461057-A | Electronic assembly and preparation method thereof | DOW CORNING (US) | 2009-06-17 | — | — | CN | disclosed |
| US-20090146324-A1 | Phenoxyphenyl polysiloxane composition and method for making and using same | ROHM AND HAAS COMPANY (US) | 2009-06-11 | — | — | US | disclosed |
| EP-2066757-A1 | SILICONE RESIN FILM AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2009-06-10 | — | — | EP | disclosed |
| US-7541264-B2 | Temporary wafer bonding method for semiconductor processing | DOW CORNING CORPORATION (US) | 2009-06-02 | — | — | US | disclosed |
| US-20090110917-A1 | Electronic Package and Method of Preparing Same | DOW CORNING CORPORATION | 2009-04-30 | — | — | US | disclosed |
| EP-2052292-A2 | METHOD OF PREPARING A PATTERNED FILM WITH A DEVELOPING SOLVENT | Dow Corning Corporation (US) | 2009-04-29 | — | — | EP | disclosed |
| US-20090105362-A1 | Reinforced silicone resin film and method of preparing same | DOW CORNING CORPORATION | 2009-04-23 | — | — | US | disclosed |
| WO-2009048694-A1 | REINFORCED SILICONE RESIN FILM AND NANOFIBER-FILLED SILICONE COMPOSITION | DOW CORNING CORPORATION (US) | 2009-04-16 | — | — | WO | disclosed |
| US-7517808-B2 | Method for forming and removing a patterned silicone film | DOW CORNING CORPORATION (US) | 2009-04-14 | — | — | US | disclosed |
| US-20090090413-A1 | Cadmium Telluride-Based Photovoltaic Device And Method Of Preparing The Same | DOW CORNING CORPORATION | 2009-04-09 | — | — | US | disclosed |
| US-20090084427-A1 | Copper Indium Diselenide-Based Photovoltaic Device And Method Of Preparing the Same | DOW CORNING CORPORATION | 2009-04-02 | — | — | US | disclosed |
| US-20090084428-A1 | Copper Indium Diselenide-Based Photovoltaic Device And Method Of Preparing The Same | AIR FORCE, UNITED STATES | 2009-04-02 | — | — | US | disclosed |
| EP-2041801-A2 | A SOLAR CELL INCLUDING A SILICONE RESIN LAYER | Dow Corning Corporation (US) | 2009-04-01 | — | — | EP | disclosed |
| EP-2024998-A1 | ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2009-02-18 | — | — | EP | disclosed |
| EP-2018669-A1 | COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | Dow Corning Corporation (US) | 2009-01-28 | — | — | EP | disclosed |
| EP-2016625-A1 | COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | Dow Corning Corporation (US) | 2009-01-21 | — | — | EP | disclosed |
| EP-2016626-A2 | CADMIUM TELLURIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | Dow Corning Corporation (US) | 2009-01-21 | — | — | EP | disclosed |
| WO-2009007786-A2 | A SOLAR CELL INCLUDING A SILICONE RESIN LAYER | DOW CORNING CORPORATION (US) | 2009-01-15 | — | — | WO | disclosed |
| US-20090005499-A1 | Silicone Resin Film, Method of Preparing Same, and Nanomaterial-Filled Silicone Composition | DOW CORNING CORPORATION | 2009-01-01 | — | — | US | disclosed |
| EP-2005248-A2 | LOW THERMAL DISTORTION SILICONE COMPOSITE MOLDS | Dow Corning Corporation (US) | 2008-12-24 | — | — | EP | disclosed |
| US-20080277276-A1 | Photopolymerizable Silicone Materials Forming Semipermeable Membranes for Sensor Applications | DOW CORNING CORPORATION | 2008-11-13 | — | — | US | disclosed |
| EP-1979427-A2 | SILICONE RESIN FILM, METHOD OF PREPARING SAME, AND NANOMATERIAL-FILLED SILICONE COMPOSITION | Dow Corning Corporation (US) | 2008-10-15 | — | — | EP | disclosed |
| EP-1819775-B1 | ORGANOHYDROGENPOLY SILOXANE RESIN AND SILICON COMPOSITION | DOW CORNING (US) | 2008-09-24 | — | — | EP | disclosed |
| EP-1969065-A2 | SILICONE RESIN FILM, METHOD OF PREPARING SAME, AND NANOMATERIAL-FILLED SILICONE COMPOSITION | Dow Corning Corporation (US) | 2008-09-17 | — | — | EP | disclosed |
| WO-2008103407-A1 | COMPOSITE ARTICLE HAVING EXCELLENT FIRE RESISTANCE | DOW CORNING CORPORATION (US) | 2008-08-28 | — | — | WO | disclosed |
| WO-2008103411-A1 | COMPOSITE ARTICLE HAVING EXCELLENT FIRE RESISTANCE | DOW CORNING CORPORATION (US) | 2008-08-28 | — | — | WO | disclosed |
| WO-2008103228-A1 | REINFORCED SILICONE RESIN FILMS | DOW CORNING CORPORATION (US) | 2008-08-28 | — | — | WO | disclosed |
| WO-2008103227-A1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2008-08-28 | — | — | WO | disclosed |
| WO-2008103419-A2 | COMPOSITE ARTICLE HAVING EXCELLENT FIRE AND IMPACT RESISTANCE AND METHOD OF MAKING THE SAME | DOW CORNING CORPORATION (US) | 2008-08-28 | — | — | WO | disclosed |
| WO-2008097877-A2 | HETEROELEMENT SILOXANE COMPOUNDS AND POLYMERS | DOW CORNING CORPORATION (US) | 2008-08-14 | — | — | WO | disclosed |
| WO-2008088570-A1 | REINFORCING STRUCTURES FOR THIN-FILM PHOTOVOLTAIC DEVICE SUBSTRATES, AND ASSOCIATED METHODS | ITN ENERGY SYSTEMS, INC. (US) | 2008-07-24 | — | — | WO | disclosed |
| WO-2008088407-A1 | GLASS SUBSTRATES COATED OR LAMINATED WITH MULTIPLE LAYERS OF CURED SILICONE RESIN COMPOSITIONS | DOW CORNING CORPORATION (US) | 2008-07-24 | — | — | WO | disclosed |
| WO-2008079179-A1 | GLASS SUBSTRATES COATED OR LAMINATED WITH CURED SILICONE RESIN COMPOSITIONS | DOW CORNING CORPORATION (US) | 2008-07-03 | — | — | WO | disclosed |
| WO-2008079275-A1 | COMPOSITE ARTICLE INCLUDING A CATION-SENSITIVE LAYER | DOW CORNING CORPORATION (US) | 2008-07-03 | — | — | WO | disclosed |
| US-7381470-B2 | Polysiloxane film and process for producing the same | DOW CORNING TORAY CO., LTD. (JP) | 2008-06-03 | — | — | US | disclosed |
| US-20080115827-A1 | Reinforcing Structures For Thin-Film Photovoltaic Device Substrates, And Associated Methods | ITN ENERGY SYSTEMS, INC. (US) | 2008-05-22 | — | — | US | disclosed |
| US-20080090380-A1 | Temporary Wafer Bonding Method for Semiconductor Processing | ROAMWARE, INC. | 2008-04-17 | — | — | US | disclosed |
| WO-2008045104-A2 | SILICONE RESIN FILM, METHOD OF PREPARING SAME, AND NANOMATERIAL-FILLED SILICONE COMPOSITION | DOW CORNING CORPORATION (US) | 2008-04-17 | — | — | WO | disclosed |
| US-7358582-B2 | Planar optical waveguide assembly | DOW CORNING CORPORATION (US) | 2008-04-15 | — | — | US | disclosed |
| WO-2008042056-A1 | SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2008-04-10 | — | — | WO | disclosed |
| EP-1893671-A2 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2008-03-05 | — | — | EP | disclosed |
| US-20080051548-A1 | Reinforced Silicone Resin Film and Method of Preparing Same | DOW CORNING TORAY CO., LTD. (JP) | 2008-02-28 | — | — | US | disclosed |
| WO-2008021125-A2 | METHOD OF PREPARING A PATTERNED FILM WITH A DEVELOPING SOLVENT | DOW CORNING CORPORATION (US) | 2008-02-21 | — | — | WO | disclosed |
| WO-2007145885-A2 | DUCTILE MULTILAYER SILICONE RESIN FILMS | DOW CORNING CORPORATION (US) | 2007-12-21 | — | — | WO | disclosed |
| WO-2007145711-A1 | ELECTRONIC PACKAGE AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2007-12-21 | — | — | WO | disclosed |
| WO-2007120905-A9 | CADMIUM TELLURIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | DOW CORNING (US) | 2007-12-13 | — | — | WO | disclosed |
| EP-1856206-A1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2007-11-21 | — | — | EP | disclosed |
| EP-1854136-A1 | TEMPORARY WAFER BONDING METHOD FOR SEMICONDUCTOR PROCESSING | Dow Corning Corporation (US) | 2007-11-14 | — | — | EP | disclosed |
| WO-2007123898-A1 | COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | DOW CORNING CORPORATION (US) | 2007-11-01 | — | — | WO | disclosed |
| WO-2007123901-A1 | COPPER INDIUM DISELENIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | DOW CORNING CORPORATION (US) | 2007-11-01 | — | — | WO | disclosed |
| WO-2007121006-A2 | LOW THERMAL DISTORTION SILICONE COMPOSITE MOLDS | DOW CORNING CORPORATION (US) | 2007-10-25 | — | — | WO | disclosed |
| WO-2007120905-A2 | CADMIUM TELLURIDE-BASED PHOTOVOLTAIC DEVICE AND METHOD OF PREPARING THE SAME | DOW CORNING CORPORATION (US) | 2007-10-25 | — | — | WO | disclosed |
| EP-1819775-A2 | ORGANOHYDROGENPOLY SILOXANE RESIN AND SILICON COMPOSITION | Dow Corning Corporation (US) | 2007-08-22 | — | — | EP | disclosed |
| EP-1820065-A2 | PHOTOPOLYMERIZABLE SILICONE MATERIALS FORMING SEMIPERMEABLE MEMBRANES FOR SENSOR APPLICATIONS | Dow Corning Corporation (US) | 2007-08-22 | — | — | EP | disclosed |
| WO-2007092118-A2 | SILICONE RESIN FILM, METHOD OF PREPARING SAME, AND NANOMATERIAL-FILLED SILICONE COMPOSITION | DOW CORNING CORPORATION (US) | 2007-08-16 | — | — | WO | disclosed |
| WO-2007092032-A2 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2007-08-16 | — | — | WO | disclosed |
| US-20070160936-A1 | Adhesion method using gray-scale photolithography | GARDNER GEOFFREY B | 2007-07-12 | — | — | US | disclosed |
| US-20060286809-A1 | Method for etching a patterned silicone layyer | DOW CORNING CORPORATION (US) | 2006-12-21 | — | — | US | disclosed |
| WO-2006093639-A1 | TEMPORARY WAFER BONDING METHOD FOR SEMICONDUCTOR PROCESSING | DOW CORNING CORPORATION (US) | 2006-09-08 | — | — | WO | disclosed |
| WO-2006088646-A1 | REINFORCED SILICONE RESIN FILM AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2006-08-24 | — | — | WO | disclosed |
| US-20060178495-A1 | Integral resin-silane coating system | UNIVERSITY OF CINCINNATI | 2006-08-10 | — | — | US | disclosed |
| WO-2006083656-A2 | INTEGRAL RESIN-SILANE COATING SYSTEM | UNIVERSITY OF CINCINNATI (US) | 2006-08-10 | — | — | WO | disclosed |
| WO-2006055232-A2 | ORGANOHYDROGENPOLY SILOXANE RESIN AND SILICON COMPOSITION | DOW CORNING CORPORATION (US) | 2006-05-26 | — | — | WO | disclosed |
| EP-1636653-A2 | ADHESION METHOD USING GRAY-SCALE PHOTOLITHOGRAPHY | Dow Corning Corporation (US) | 2006-03-22 | — | — | EP | disclosed |
| WO-2006023037-A2 | PHOTOPOLYMERIZABLE SILICONE MATERIALS FORMING SEMIPERMEABLE MEMBRANES FOR SENSOR APPLICATIONS | DOW CORNING CORPORATION (US) | 2006-03-02 | — | — | WO | disclosed |
| US-20050232557-A1 | Method of preparing a planar optical waveguide assembly | LSI LOGIC CORPORATION | 2005-10-20 | — | — | US | disclosed |
| US-20050227091-A1 | Polysiloxane film and process for producing the same | DOW CORNING TORAY CO. LTD. (JP) | 2005-10-13 | — | — | US | disclosed |
| US-20050175301-A1 | Planar optical waveguide assembly | DOW SILICONES CORPORATION | 2005-08-11 | — | — | US | disclosed |
| US-6905904-B2 | Planar optical waveguide assembly and method of preparing same | DOW CORNING CORPORATION (US) | 2005-06-14 | — | — | US | disclosed |
| US-6907176-B2 | Planar optical waveguide assembly and method of preparing same | DOW CORNING CORPORATION (US) | 2005-06-14 | — | — | US | disclosed |
| EP-1535965-A1 | POLYSILOXANE FILM AND PROCESS FOR PRODUCING THE SAME | DOW CORNING ASIA Ltd (JP) | 2005-06-01 | — | — | EP | disclosed |
| EP-1523525-A1 | PLANAR OPTICAL WAVEGUIDE ASSEMBLY AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2005-04-20 | — | — | EP | disclosed |
| EP-1516208-A1 | PLANAR OPTICAL WAVEGUIDE ASSEMBLY AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2005-03-23 | — | — | EP | disclosed |
| WO-2005017627-A1 | METHOD FOR ETCHING A PATTERNED SILICONE LAYYER | DOW CORNING CORPORATION (US) | 2005-02-24 | — | — | WO | disclosed |
| WO-2005001573-A2 | ADHESION METHOD USING GRAY-SCALE PHOTOLITHOGRAPHY | DOW CORNING CORPORATION (US) | 2005-01-06 | — | — | WO | disclosed |
| US-20040239006-A1 | Silicone compositions, methods of making, and uses thereof | MICROFABRICA INC. | 2004-12-02 | — | — | US | disclosed |
| CN-1514954-A | Semiconductor package and method of manufacturing the same | — | 2004-07-21 | — | — | CN | disclosed |
| WO-2004001458-A1 | PLANAR OPTICAL WAVEGUIDE ASSEMBLY AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2003-12-31 | — | — | WO | disclosed |
| WO-2004000942-A1 | PLANAR OPTICAL WAVEGUIDE ASSEMBLY AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2003-12-31 | — | — | WO | disclosed |
| US-20030235383-A1 | Planar optical waveguide assembly and method of preparing same | DOW SILICONES CORPORATION | 2003-12-25 | — | — | US | disclosed |
| US-20030234458-A1 | Planar optical waveguide assembly and method of preparing same | DOW SILICONES CORPORATION | 2003-12-25 | — | — | US | disclosed |
| EP-1362364-A2 | SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME | Dow Corning Corporation (US) | 2003-11-19 | — | — | EP | disclosed |
| US-6617674-B2 | Wafer having an active surface comprising an integrated circuit having bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer | DOW CORNING CORPORATION | 2003-09-09 | — | — | US | disclosed |
| US-6509435-B1 | Heat resistance, stability; moldings | TEIJIN LIMITED (JP) | 2003-01-21 | — | — | US | disclosed |
| EP-1275694-A1 | AROMATIC POLYCARBONATE COMPOSITION, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE THEREOF | TEIJIN LIMITED (JP) | 2003-01-15 | — | — | EP | disclosed |
| US-20020158317-A1 | Semiconductor package and method of preparing same | DOW SILICONES CORPORATION | 2002-10-31 | — | — | US | disclosed |
| WO-2002067292-A2 | SEMICONDUCTOR PACKAGE AND METHOD OF PREPARING SAME | DOW CORNING CORPORATION (US) | 2002-08-29 | — | — | WO | disclosed |
| EP-1191049-A1 | POLYCARBONATE, PROCESS FOR PRODUCING THE SAME, AND MOLDED ARTICLE THEREOF | TEIJIN LIMITED (JP) | 2002-03-27 | — | — | EP | disclosed |
| US-5081164-A | Organosilicon dental composite restorative materials | LAI LABORATORIES, INC. (US) | 1992-01-14 | — | — | US | disclosed |
| US-4780510-A | Cross-linked optical siloxane polymer | SUMITOMO ELECTRIC INDUSTRIES, LTD. (JP) | 1988-10-25 | — | — | US | disclosed |
| EP-0204171-A1 | Cross-linked optical siloxane polymer | SUMITOMO ELECTRIC INDUSTRIES LIMITED (JP) | 1986-12-10 | — | — | EP | disclosed |
| EP-0202542-A1 | Liquid optical siloxane polymer | SUMITOMO ELECTRIC INDUSTRIES LIMITED (JP) | 1986-11-26 | — | — | EP | disclosed |
| EP-0202542-A1 | Liquid optical siloxane polymer | SUMITOMO ELECTRIC INDUSTRIES LIMITED (JP) | 1986-11-26 | — | — | EP | disclosed |