SCHEMBL1892977

SCHEMBL1892977

C=C(C)C(=O)c1ccccc1C(=O)c1ccccc1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AKR1C3 P42330 3/20 0.59
MAPT P10636 2/20 0.50
GAA P10253 1/20 0.50
ELANE P08246 2/20 0.49
ALDH1A1 P00352 2/20 0.48
MYC P01106 1/20 0.47
ATM Q13315 3/20 0.47
CDC25B P30305 2/20 0.47
CES2 O00748 1/20 0.47
CES1 P23141 1/20 0.47
NPSR1 Q6W5P4 2/20 0.46
HSP90AA1 P07900 1/20 0.46
PKM P14618 1/20 0.46
CCR6 P51684 1/20 0.46
TLR9 Q9NR96 1/20 0.46
TDP1 Q9NUW8 1/20 0.46
POLB P06746 1/20 0.46
NR4A1 P22736 1/20 0.46
KMT2A Q03164 1/20 0.45
LMNA P02545 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30200107 1.00 AKR1C3 (0.59) AKR1C3MAPTGAAELANEALDH1A1
SCHEMBL10533216 0.85 ALDH1A1 (0.43) MAPTGAAALDH1A1ATMCES2
SCHEMBL27604752 0.84 MAPT (0.51) AKR1C3MAPTGAAELANEALDH1A1
SCHEMBL9243704 0.84 AKR1C3 (0.63) AKR1C3MAPTGAAELANEALDH1A1
SCHEMBL8604199 0.82 ALDH1A1 (0.61) AKR1C3MAPTALDH1A1MYCCDC25B
Ethylene SCHEMBL27279241 0.81 AKR1C3 (0.77) AKR1C3MAPTGAAALDH1A1ATM
SCHEMBL700595 0.81 AKR1C3 (0.85) AKR1C3MAPTGAAALDH1A1ATM
SCHEMBL29447165 0.81 AKR1C3 (0.85) AKR1C3MAPTGAAALDH1A1ATM
SCHEMBL1887295 0.80 ELANE (0.61) MAPTELANEALDH1A1ATMCES2
SCHEMBL8864751 0.79 ALDH1A1 (0.40) MAPTALDH1A1ATMCES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4547738-A1 PROCESSES FOR MAKING THREE-DIMENSIONAL POLYMER NETWORKS Safeguard DX Ltd (GB) 2025-05-07 EP disclosed
CN-117603466-A Three-dimensional polymer networks and uses thereof 保障生物系统控股有限公司 2024-02-27 CN disclosed
WO-2024003022-A1 PROCESSES FOR MAKING THREE-DIMENSIONAL POLYMER NETWORKS SAFEGUARD BIOSYSTEMS HOLDINGS LTD (GB) 2024-01-04 WO disclosed
CN-110770583-B Three-dimensional polymer networks and uses thereof 保障生物系统控股有限公司 2023-12-08 CN disclosed
US-20230272245-A1 ADHESIVE-COATED THERMALLY SENSITIVE POLYMER SUBSTRATE, PROCESS FOR ITS MANUFACTURE AND USE THEREOF HENKEL AG & CO KGAA (DE) 2023-08-31 US disclosed
US-11685842-B2 Adhesive-coated thermally sensitive polymer substrate, process for its manufacture and use thereof HENKEL AG & CO., KGAA (DE) 2023-06-27 US disclosed
US-11660371-B2 Negative pressure wound therapy dressings comprising (meth)acrylate pressure-sensitive adhesive with enhanced adhesion to wet surfaces 3M INNOVATIVE PROPERTIES COMPANY (US) 2023-05-30 US disclosed
US-11306224-B2 Articles comprising (meth)acrylate pressure-sensitive adhesive with enhanced adhesion to wet surfaces 3M INNOVATIVE PROPERTIES COMPANY (US) 2022-04-19 US disclosed
US-20210299625-A1 Microparticle for Bioanalytical Investigations and Method for Producing Such a Microparticle AVA LIFESCIENCE GMBH (DE) 2021-09-30 US disclosed
WO-2021191222-A1 MICROPARTICLE FOR BIOLOGICAL ANALYSIS AND METHOD FOR PRODUCING SUCH A MICROPARTICLE AVA LIFESCIENCE GMBH (DE) 2021-09-30 WO disclosed
WO-2015131938-A1 ADHESIVE-COATED THERMALLY SENSITIVE POLYMER SUBSTRATE, PROCESS FOR ITS MANUFACTURE AND USE THEREOF Novamelt GmbH Klebstofftechnologie (DE) 2015-09-11 WO disclosed
WO-2015134249-A1 GENTLE TO SKIN (METH)ACRYLATE PRESSURE-SENSITIVE ADHESIVE 3M INNOVATIVE PROPERTIES COMPANY (US) 2015-09-11 WO disclosed
US-20120302041-A1 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer LINTEC CORPORATION (JP) 2012-11-29 US disclosed
US-8304920-B2 Energy ray-curable polymer, an energy ray-curable adhesive composition, an adhesive sheet and a processing method of a semiconductor wafer LINTEC CORPORATION (JP) 2012-11-06 US disclosed
US-20110104874-A1 Energy Ray-Curable Polymer, an Energy Ray-Curable Adhesive Composition, an Adhesive Sheet and a Processing Method of a Semiconductor Wafer LINTEC CORPORATION (JP) 2011-05-05 US disclosed
US-20100233868-A1 Adhesive Sheet and a Processing Method of Semiconductor Wafer, and a Manufacturing Method of Semiconductive Chip LINTEC CORPORATION (JP) 2010-09-16 US disclosed
US-20070054979-A1 Formulations and their use in the coloration of substrates BASF AKTIENGESELLSCHAFT (DE) 2007-03-08 US disclosed
EP-1675914-A1 FORMULATIONS AND THEIR USE IN THE COLORATION OF SUBSTRATES BASF Aktiengesellschaft (DE) 2006-07-05 EP disclosed
WO-2005037930-A1 FORMULATIONS AND THEIR USE IN THE COLORATION OF SUBSTRATES BASF AKTIENGESELLSCHAFT (DE) 2005-04-28 WO disclosed
US-20040049972-A1 Method for producing adhesive polyacrylates using mercapto functional photoinitiators TESA AG (DE) 2004-03-18 US disclosed