SCHEMBL1895801

SCHEMBL1895801

C=Cc1ccc(C(=O)OC2CCOC2=O)cc1

nearest known ligand 0.64

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
POLB P06746 4/20 0.64
ALDH1A1 P00352 3/20 0.55
HPGD P15428 1/20 0.55
TDP1 Q9NUW8 2/20 0.52
MEN1 O00255 1/20 0.52
KMT2A Q03164 1/20 0.52
SMN1; SMN2 Q16637 3/20 0.49
KDM4E B2RXH2 3/20 0.49
CASP6 P55212 1/20 0.48
TSHR P16473 1/20 0.44
CYP1A2 P05177 1/20 0.43
CYP2C19 P33261 1/20 0.43
NTSR1 P30989 1/20 0.43
ATM Q13315 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24812553 0.94 POLB (0.57) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL1899432 0.92 POLB (0.54) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL7749496 0.81 POLB (0.68) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL1900558 0.78 POLB (0.40) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL24811758 0.78 ALDH1A1 (0.41) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL9963794 0.77 ALDH1A1 (0.43) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL13163221 0.76 POLB (0.61) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL13163239 0.76 POLB (0.61) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL13163208 0.75 POLB (0.63) POLBALDH1A1HPGDTDP1MEN1
SCHEMBL14177788 0.74 POLB (0.62) POLBALDH1A1HPGDTDP1MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080160449-A1 Photoresist polymer having nano-smoothness and etching resistance, and resist composition LION CORPORATION (JP) 2008-07-03 US claimed
US-9927708-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-27 US disclosed
US-9927708-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-03-27 US disclosed
US-9658532-B2 Pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-23 US disclosed
US-9658532-B2 Pattern forming process SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-05-23 US disclosed
US-9632415-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-25 US disclosed
US-9632415-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-25 US disclosed
US-9618850-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-11 US disclosed
US-9618850-B2 Pattern forming process and shrink agent SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-04-11 US disclosed
US-20170010537-A1 PATTERN FORMING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-01-12 US disclosed
US-20160139512-A1 PATTERN FORMING PROCESS AND SHRINK AGENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-05-19 US disclosed
US-20160124312-A1 PATTERN FORMING PROCESS AND SHRINK AGENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-05-05 US disclosed
US-20160124313-A1 PATTERN FORMING PROCESS AND SHRINK AGENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-05-05 US disclosed
US-20160124313-A1 PATTERN FORMING PROCESS AND SHRINK AGENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-05-05 US disclosed
US-20160124312-A1 PATTERN FORMING PROCESS AND SHRINK AGENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2016-05-05 US disclosed
US-20110198730-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION 2011-08-18 US disclosed
US-20110101503-A1 HYPERBRANCHED POLYMER SYNTHESIZING METHOD, HYPERBRANCHED POLYMER, RESIST COMPOSITION, SEMICONDUCTOR INTEGRATED CIRCUIT, AND SEMICONDUCTOR INTEGRATED CIRCUIT FABRICATION METHOD LION CORPORATION (JP) 2011-05-05 US disclosed
US-20080160449-A1 Photoresist polymer having nano-smoothness and etching resistance, and resist composition LION CORPORATION (JP) 2008-07-03 US disclosed
US-7306893-B2 Intermediate layer contains a unsaturated polymer having a carboxylic acid group in the side chain, which has specific reaction between the support and the photosensitive layer to promot adhesion strength; improve printing durability, chemical resistance; laser recording, photothermography FUJIFILM CORPORATION (JP) 2007-12-11 US disclosed
US-7306893-B2 Intermediate layer contains a unsaturated polymer having a carboxylic acid group in the side chain, which has specific reaction between the support and the photosensitive layer to promot adhesion strength; improve printing durability, chemical resistance; laser recording, photothermography FUJIFILM CORPORATION (JP) 2007-12-11 US disclosed