Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TRPA1 | O75762 | 2/20 | 0.48 |
| ▸ | ATM | Q13315 | 1/20 | 0.48 |
| ▸ | IAPP | P10997 | 3/20 | 0.40 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | TP53 | P04637 | 1/20 | 0.40 |
| ▸ | GAA | P10253 | 1/20 | 0.40 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.40 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.40 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.39 |
| ▸ | TAAR1 | Q96RJ0 | 1/20 | 0.39 |
| ▸ | PDCD1 | Q15116 | 1/20 | 0.38 |
| ▸ | CD274 | Q9NZQ7 | 1/20 | 0.38 |
| ▸ | GABRA1 | P14867 | 1/20 | 0.38 |
| ▸ | GABRB2 | P47870 | 1/20 | 0.38 |
| ▸ | HTR2A | P28223 | 1/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.37 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.37 |
| ▸ | HTR1A | P08908 | 1/20 | 0.36 |
| ▸ | HPGD | P15428 | 1/20 | 0.36 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28091513 | 0.88 | TRPA1 (0.45) | TRPA1ATMIAPPMAPTTP53 | |
| SCHEMBL5694414 | 0.86 | PDCD1 (0.43) | TRPA1ATMMAPTTP53GAA | |
| SCHEMBL1039776 | 0.83 | TRPA1 (0.48) | TRPA1ATMIAPPMAPTTP53 | |
| SCHEMBL286623 | 0.82 | PDCD1 (0.55) | TRPA1ATMIAPPMAPTTP53 | |
| SCHEMBL8902163 | 0.81 | TRPA1 (0.46) | TRPA1ATMIAPPMAPTTP53 | |
| SCHEMBL27622035 | 0.81 | TRPA1 (0.46) | TRPA1ATMIAPPMAPTTP53 | |
| SCHEMBL629761 | 0.80 | ESR1 (0.46) | TRPA1ATMMAPTTP53GAA | |
| SCHEMBL845508 | 0.79 | HSPA5 (0.56) | TRPA1ATMIAPPMAPTTP53 | |
| SCHEMBL822159 | 0.79 | TYR (0.53) | TRPA1ATMIAPPMAPTHSD17B10 | |
| Water SCHEMBL29281670 | 0.78 | ESR1 (0.44) | TRPA1ATMMAPTTP53GAA |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 72 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122095031-A | Resin composition, dry film, cured product, and light-emitting element mounting substrate | — | 2026-05-26 | — | — | CN | disclosed |
| WO-2025095046-A1 | RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND LIGHT EMITTING ELEMENT MOUNTED SUBSTRATE | 太陽ホールディングス株式会社 | 2025-05-08 | — | — | WO | disclosed |
| WO-2025095045-A1 | TRANSPARENT RESIN COMPOSITION, DRY FILM, CURED PRODUCT, AND ELECTRONIC COMPONENT | 太陽ホールディングス株式会社 | 2025-05-08 | — | — | WO | disclosed |
| CN-119278225-A | Curable resin, curable resin intermediate, curable resin composition, and method for producing cured product | 株式会社日本触媒 | 2025-01-07 | — | — | CN | disclosed |
| CN-113168097-B | Positive dry film resist and etching method | 三菱制纸株式会社 | 2024-08-23 | — | — | CN | disclosed |
| WO-2024009612-A1 | CURABLE RESIN, AND METHODS FOR MANUFACTURING CURABLE RESIN INTERMEDIATE, CURABLE RESIN, CURABLE RESIN COMPOSITION, AND CURED PRODUCT | 株式会社日本触媒 | 2024-01-11 | — | — | WO | disclosed |
| US-20230324789-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | RESONAC CORPORATION (JP) | 2023-10-12 | — | — | US | disclosed |
| CN-110582726-B | Positive photosensitive resin composition, thermal crosslinking agent for positive photosensitive resin, pattern cured film, method for producing pattern cured film, semiconductor element, and electronic device | 株式会社力森诺科 | 2023-08-04 | — | — | CN | disclosed |
| CN-116194840-A | Photosensitive resin composition, permanent resist, method for forming permanent resist, and method for inspecting cured film for permanent resist | 株式会社力森诺科 | 2023-05-30 | — | — | CN | disclosed |
| WO-2023281584-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PERMANENT RESIST, METHOD FOR FORMING PERMANENT RESIST, AND METHOD FOR INSPECTING PERMANENT RESIST CURED FILM | 昭和電工マテリアルズ株式会社 | 2023-01-12 | — | — | WO | disclosed |
| CN-101281367-A | Solder resist compound and cured product thereof | TAIYO INK MFG CO LTD (JP) | 2008-10-08 | — | — | CN | disclosed |
| CN-101253449-A | Photosensitive resin composition and photosensitive element | HITACHI CHEMICAL CO LTD (JP) | 2008-08-27 | — | — | CN | disclosed |
| CN-101105626-A | Light solidifying/heat solidifying resin composition, condensate of the same and printing circuit board | TAIYO INK MFG CO LTD (JP) | 2008-01-16 | — | — | CN | disclosed |
| US-6773855-B1 | PRINTED CIRCUIT BOARD HAVING A SOLDER RESIST FILM FORMED FROM THE CURED FILM | TAIYO INK MANUFACTURING CO., LTD. (JP) | 2004-08-10 | — | — | US | disclosed |
| US-6749765-B2 | Aperture fill | SHIPLEY COMPANY, L.L.C. | 2004-06-15 | — | — | US | disclosed |
| US-6461717-B1 | Aperture fill | SHIPLEY COMPANY, L.L.C. | 2002-10-08 | — | — | US | disclosed |
| US-20020110665-A1 | Aperture fill | SHIPLEY COMPANY, L.L.C. | 2002-08-15 | — | — | US | disclosed |
| EP-1172695-A1 | Barrier layer | Shipley Company LLC (US) | 2002-01-16 | — | — | EP | disclosed |
| EP-1150343-A2 | Aperture fill | Shipley Company LLC (US) | 2001-10-31 | — | — | EP | disclosed |
| US-6077879-A | RADICALLY POLYMERIZABLE CURABLE RESIN OBTAINED BY REACTING POLYEPOXIDE WITH PHENOL COMPOUND HAVING ALCOHOLIC HYDROXYL GROUP AND UNSATURATED MONOBASIC ACID | NIPPON SHOKUBAI CO., LTD. (JP) | 2000-06-20 | — | — | US | disclosed |