SCHEMBL19200547

SCHEMBL19200547

Cc1ccc2cc3ccc(CN4C(=O)c5ccccc5C4=O)cc3cc2c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ PABPC1 P11940 1/20 0.59
▸ ALOX15 P16050 1/20 0.59
▸ MAPK1 P28482 1/20 0.59
▸ MAPT P10636 1/20 0.59
▸ HPGD P15428 1/20 0.59
▸ HTT P42858 1/20 0.59
▸ CLTC Q00610 1/20 0.50
▸ KMT2A Q03164 2/20 0.49
▸ CASP3 P42574 2/20 0.49
▸ CA12 O43570 1/20 0.49
▸ CA1 P00915 1/20 0.49
▸ CA2 P00918 1/20 0.49
▸ CA9 Q16790 1/20 0.49
▸ PKM P14618 1/20 0.49
▸ TSHR P16473 1/20 0.49
▸ SMN1; SMN2 Q16637 1/20 0.49
▸ KDM4E B2RXH2 1/20 0.48
▸ NPSR1 Q6W5P4 1/20 0.48
▸ ACHE P22303 1/20 0.47
▸ ADRA1D P25100 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2569297 0.84 PABPC1 (0.60) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL8737445 0.82 CASP3 (0.65) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL29820192 0.82 CASP3 (0.65) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL6336921 0.81 CASP3 (0.58) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL10922984 0.80 KMT2A (0.60) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL29819860 0.80 KMT2A (0.60) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL1205148 0.77 MAPT (0.56) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL9757294 0.76 MAPT (0.58) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL8816419 0.76 CASP3 (0.56) PABPC1ALOX15MAPK1MAPTHPGD
SCHEMBL12104396 0.75 CA12 (0.65) MAPTHPGDKMT2ACASP3CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10941320-B2 Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin compostion TORAY INDUSTRIES, INC. (JP) 2021-03-09 — — US disclosed
US-20190080952-A1 ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSTION TORAY INDUSTRIES, INC. (JP) 2019-03-14 — — US disclosed
US-10177022-B2 Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition TORAY INDUSTRIES, INC. (JP) 2019-01-08 — — US disclosed
US-20170221746-A1 ADHESIVE FOR TEMPORARY BONDING, ADHESIVE LAYER, WAFER WORK PIECE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME, REWORK SOLVENT, POLYIMIDE COPOLYMER, POLYIMIDE MIXED RESIN, AND RESIN COMPOSITION (AS AMENDED) TORAY INDUSTRIES, INC. (JP) 2017-08-03 — — US disclosed
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