Methacrylic Acid

Methacrylic Acid

SCHEMBL1930348

C=C(C)C(=O)O.C=C(C)C(=O)O.CC(CO)CCCCCCO

nearest known ligand 0.38

Full drug profile on Sugi Atlas →

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
ACE2 Q9BYF1 1/20 0.38
TSHR P16473 1/20 0.35
GPR84 Q9NQS5 1/20 0.34
FFAR1 O14842 1/20 0.34
FFAR4 Q5NUL3 1/20 0.34
TGFBR1 P36897 1/20 0.34
BLM P54132 1/20 0.32
FNTA P49354 1/20 0.32
FNTB P49356 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Bicarbonate SCHEMBL2143440 0.86 ACE2 (0.44) ACE2TSHRGPR84FFAR1FFAR4
Methacrylic Acid SCHEMBL10400354 0.85 LMNA (0.36) ACE2TSHRTGFBR1BLM
Methacrylic Acid SCHEMBL28795338 0.85 KDM4C (0.39) ACE2TSHRGPR84FFAR1FFAR4
Methacrylic Acid SCHEMBL5145666 0.84 TSHR (0.44) ACE2TSHRTGFBR1BLM
Methacrylic Acid SCHEMBL4526194 0.84 TSHR (0.44) ACE2TSHRTGFBR1BLM
Methacrylic Acid SCHEMBL6426046 0.83 LMNA (0.42) TSHRGPR84FFAR1FFAR4TGFBR1
Methacrylic Acid SCHEMBL10399538 0.83 LMNA (0.42) TSHRGPR84FFAR1FFAR4TGFBR1
Methacrylic Acid SCHEMBL870592 0.83 ALDH1A1 (0.37) ACE2GPR84FFAR1FFAR4TGFBR1
Methacrylic Acid SCHEMBL9183114 0.83 LMNA (0.42) TSHRGPR84FFAR1FFAR4TGFBR1
Methacrylic Acid SCHEMBL10791484 0.83 ALDH1A1 (0.37) ACE2GPR84FFAR1FFAR4TGFBR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 152 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2881163-A1 Composite membrane Gambro Lundia AB (SE) 2015-06-10 EP claimed
US-7956147-B2 comprising polymerizing hydrophobic monomer to form particulate resin exhibiting molecular weight of from 20,000 to 500,000, dispersing the particulate resin in an aqueous medium to form a resin particle dispersion and adding thereto a hydrophobic cross-linkable monomer KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2011-06-07 US claimed
US-20080269447-A1 comprising polymerizing hydrophobic monomer to form particulate resin exhibiting molecular weight of from 20,000 to 500,000, dispersing the particulate resin in an aqueous medium to form a resin particle dispersion and adding thereto a hydrophobic cross-linkable monomer KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) 2008-10-30 US claimed
US-12384099-B2 Dual cure epoxy formulations for 3D printing applications HENKEL AG & CO. KGAA (DE) 2025-08-12 US disclosed
US-20250155808-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN ZEON CORPORATION (JP) 2025-05-15 US disclosed
US-12227024-B2 Writing implement MITSUBISHI PENCIL COMPANY, LIMITED (JP) 2025-02-18 US disclosed
US-12215246-B2 Composition comprising a light-weight filler HENKEL AG & CO. KGAA (DE) 2025-02-04 US disclosed
WO-2024143072-A1 COMPOSITION AND CURED PRODUCT 株式会社ADEKA 2024-07-04 WO disclosed
US-20240132687-A1 Thermally expandable compositions comprising wax HENKEL AG & CO KGAA (DE) 2024-04-25 US disclosed
WO-2024070672-A1 RESIST COMPOSITION AND METHOD FOR FORMING RESIST PATTERN 日本ゼオン株式会社 2024-04-04 WO disclosed
CN-113692421-B Pumpable, thermally curable and expandable formulation 汉高股份有限及两合公司 2024-03-08 CN disclosed
EP-1295899-A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2003-03-26 EP disclosed
US-20030055166-A1 Thermoplastic resin compostion and poduction processes thereof RIKEN TECHNOS CORPORATION (JP) 2003-03-20 US disclosed
EP-1266915-A1 THERMOPLASTIC RESIN COMPOSITIONS AND PRODUCTION PROCESSES THEREOF Riken Technos Corporation (JP) 2002-12-18 EP disclosed
US-6458893-B1 SAPONIFIED ETHYLENE-VINYL ACETATE COPOLYMER OF SPECIFIED ETHYLENE CONTENT AND DEGREE OF SAPONIFICATION AND AN OPTIONALLY HYDROGENATED COPOLYMER OF A VINYL AROMATIC SUCH AS STYRENE WITH A CONJUGATED DIENE SUCH AS ISOPRENE; MOLDABILITY RIKEN VINYL INDUSTRY CO., LTD. (JP) 2002-10-01 US disclosed
US-20020028882-A1 Thermoplastic resin composition RIKEN TECHNOS CORPORATION (JP) 2002-03-07 US disclosed
EP-1176168-A2 Thermoplastic resin composition RIKEN VINYL INDUSTRY CO., LTD. (JP) 2002-01-30 EP disclosed
US-20010021747-A1 Composition derived from a softening agent and a thermoplastic resin composition containing the same RIKEN TECHNOS CORPORATION (JP) 2001-09-13 US disclosed
EP-1127915-A1 Composition derived from a softening agent and a thermoplastic resin composition containing the same RIKEN VINYL INDUSTRY CO., LTD. (JP) 2001-08-29 EP disclosed
EP-1086991-A1 Thermoplastic elastomeric resin composition and a granule thereof RIKEN VINYL INDUSTRY CO., LTD. (JP) 2001-03-28 EP disclosed