SCHEMBL1936731

SCHEMBL1936731

C/C(Cl)=C/CC(=O)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1936734 1.00
SCHEMBL2354631 0.77
SCHEMBL2354636 0.77
SCHEMBL822374 0.77
SCHEMBL11024924 0.77 ALDH1A1 (0.47)
SCHEMBL8469715 0.77
SCHEMBL11095819 0.74
SCHEMBL10966029 0.74
SCHEMBL10966032 0.74
SCHEMBL275071 0.72 ALDH1A1 (0.43)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 17 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210289794-A1 COMPOSITIONS AND RELATED METHODS FOR AGRICULTURE FLAGSHIP PIONEERING INNOVATIONS V, INC. 2021-09-23 US disclosed
EP-2331649-B1 METHODS AND COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES CABOT MICROELECTRONICS CORP (US) 2018-06-13 EP disclosed
US-8597540-B2 Compositions for polishing silicon-containing substrates CABOT MICROELECTRONICS CORPORATION (US) 2013-12-03 US disclosed
US-8486169-B2 Method of polishing a silicon-containing dielectric CABOT MICROELECTRONICS CORPORATION (US) 2013-07-16 US disclosed
US-20120280170-A1 COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES CABOT MICROELECTRONICS CORPORATION 2012-11-08 US disclosed
US-8247327-B2 Methods and compositions for polishing silicon-containing substrates CABOT MICROELECTRONICS CORPORATION (US) 2012-08-21 US disclosed
EP-2331649-A2 METHODS AND COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES Cabot Microelectronics Corporation (US) 2011-06-15 EP disclosed
WO-2010014180-A2 METHODS AND COMPOSITIONS FOR POLISHING SILICON-CONTAINING SUBSTRATES CABOT MICROELECTRONICS CORPORATION (US) 2010-02-04 WO disclosed
US-20100029181-A1 Methods and compositions for polishing silicon-containing substrates CMC MATERIALS LLC 2010-02-04 US disclosed
US-20090029633-A1 METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC CABOT MICROELECTRONICS CORPORATION (US) 2009-01-29 US disclosed
US-7442645-B2 Method of polishing a silicon-containing dielectric CABOT MICROELECTRONICS CORPORATION (US) 2008-10-28 US disclosed
US-20060196848-A1 Readily deinkable toners MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT 2006-09-07 US disclosed
US-20060144824-A1 Method of polishing a silicon-containing dielectric CABOT MICROELECTRONICS CORPORATION (US) 2006-07-06 US disclosed
US-7071105-B2 Method of polishing a silicon-containing dielectric CABOT MICROELECTRONICS CORPORATION (US) 2006-07-04 US disclosed
EP-1601735-A1 METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC Cabot Microelectronics Corporation (US) 2005-12-07 EP disclosed
WO-2004069947-A1 METHOD OF POLISHING A SILICON-CONTAINING DIELECTRIC CABOT MICROELECTRONICS CORPORATION (US) 2004-08-19 WO disclosed
US-20040152309-A1 Method of polishing a silicon-containing dielectric CABOT MICROELECTRONICS CORPORATION 2004-08-05 US disclosed