SCHEMBL19600589

SCHEMBL19600589

COCc1cc(CCO)cc(C2CCCCC2)c1O

nearest known ligand 0.39

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
NUDT1 P36639 1/20 0.39
BACE1 P56817 1/20 0.39
HTR2A P28223 2/20 0.35
PRKCE Q02156 3/20 0.33
MEN1 O00255 2/20 0.33
MAPT P10636 2/20 0.33
KMT2A Q03164 2/20 0.33
MYLK Q15746 2/20 0.33
ALDH1A1 P00352 1/20 0.33
PRKCG P05129 1/20 0.33
PRKCA P17252 1/20 0.33
APEX1 P27695 1/20 0.33
RECQL P46063 1/20 0.33
TDP1 Q9NUW8 1/20 0.33
TNKS2 Q9H2K2 1/20 0.33
KDM4E B2RXH2 1/20 0.33
PTGDR2 Q9Y5Y4 3/20 0.32
CNR2 P34972 6/20 0.31
CNR1 P21554 5/20 0.31
PTGDR Q13258 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16850508 0.89 NUDT1 (0.39) NUDT1BACE1HTR2APRKCEMEN1
SCHEMBL3814399 0.85 NUDT1 (0.41) NUDT1BACE1HTR2AMEN1MAPT
SCHEMBL25898419 0.83 CYP2D6 (0.34) NUDT1BACE1HTR2APTGDR2CNR1
SCHEMBL3812713 0.81 NUDT1 (0.43) NUDT1BACE1MEN1MAPTKMT2A
SCHEMBL11764951 0.81 BACE1 (0.46) NUDT1BACE1HTR2AMEN1MAPT
SCHEMBL25898418 0.80 CYP2D6 (0.34) NUDT1BACE1HTR2APTGDR2CNR1
SCHEMBL9189273 0.79 NUDT1 (0.43) NUDT1BACE1HTR2APRKCEMEN1
SCHEMBL16850503 0.79 PRKCE (0.46) BACE1PRKCEMEN1MAPTKMT2A
SCHEMBL5524749 0.78 MEN1 (0.40) PRKCEMEN1MAPTKMT2AMYLK
SCHEMBL19600587 0.78 EPHX2 (0.36) HTR2APRKCEMEN1MAPTKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed