SCHEMBL19600587

SCHEMBL19600587

COCc1cc(C2CCCCC2)cc(CCO)c1O

nearest known ligand 0.36

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.36
PRKCE Q02156 3/20 0.35
MYLK Q15746 2/20 0.35
ALDH1A1 P00352 2/20 0.35
MEN1 O00255 1/20 0.35
PRKCG P05129 1/20 0.35
MAPT P10636 1/20 0.35
PRKCA P17252 1/20 0.35
APEX1 P27695 1/20 0.35
RECQL P46063 1/20 0.35
KMT2A Q03164 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
HTR2A P28223 2/20 0.34
ESR2 Q92731 8/20 0.33
P2RX3 P56373 1/20 0.32
ESR1 P03372 6/20 0.32
HTR1D P28221 1/20 0.32
CYP3A4 P08684 1/20 0.31
CYP2D6 P10635 1/20 0.31
CYP2C9 P11712 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16850510 0.91 ALDH1A1 (0.41) EPHX2PRKCEMYLKALDH1A1MEN1
SCHEMBL16318059 0.78 P2RX3 (0.35) EPHX2PRKCEMYLKALDH1A1MEN1
SCHEMBL5527123 0.78 PRKCE (0.41) EPHX2PRKCEMYLKALDH1A1MEN1
SCHEMBL19600589 0.78 NUDT1 (0.39) PRKCEMYLKALDH1A1MEN1PRKCG
SCHEMBL25767420 0.77 EPHX2 (0.33) EPHX2MAPTP2RX3GAAHSD17B10
SCHEMBL10114775 0.76 PRKCE (0.44) PRKCEMYLKALDH1A1MEN1PRKCG
SCHEMBL25767418 0.76 EPHX2 (0.34) EPHX2P2RX3
SCHEMBL10114746 0.75 PRKCE (0.43) PRKCEMYLKALDH1A1MEN1PRKCG
SCHEMBL19600596 0.75 PRKCE (0.43) PRKCEMYLKALDH1A1MEN1PRKCG
SCHEMBL2219914 0.74 ACMSD (0.39) EPHX2MEN1MAPTKMT2AESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed