SCHEMBL19600590

SCHEMBL19600590

COCc1cc(F)cc(CCO)c1O

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PRKCE Q02156 3/20 0.42
MYLK Q15746 2/20 0.42
MEN1 O00255 1/20 0.42
ALDH1A1 P00352 1/20 0.42
PRKCG P05129 1/20 0.42
MAPT P10636 1/20 0.42
PRKCA P17252 1/20 0.42
APEX1 P27695 1/20 0.42
RECQL P46063 1/20 0.42
KMT2A Q03164 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
ALOX5 P09917 4/20 0.36
PTGS2 P35354 5/20 0.35
TNKS2 Q9H2K2 1/20 0.34
HMGCR P04035 1/20 0.33
PTGS1 P23219 2/20 0.33
CA12 O43570 1/20 0.32
CA1 P00915 1/20 0.32
CA9 Q16790 1/20 0.32
ADRA1A P35348 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16850505 0.89 PRKCE (0.50) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL10114775 0.85 PRKCE (0.44) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL19600596 0.84 PRKCE (0.43) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL10114746 0.84 PRKCE (0.43) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL15686504 0.82 SHBG (0.46) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL10450418 0.82 PRKCE (0.42) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL16207219 0.82 SHBG (0.46) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL10451913 0.81 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL12151251 0.81 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG
SCHEMBL16451535 0.81 PRKCE (0.41) PRKCEMYLKMEN1ALDH1A1PRKCG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350305-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND TREATMENT LIQUID FUJIFILM CORPORATION (JP) 2023-11-02 US disclosed
US-20170327644-A1 RESIN AND PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed