SCHEMBL19640262

SCHEMBL19640262

CCO[Si](CCSOC(C)=O)(OCC)OCC

nearest known ligand 0.33

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.33
LMNA P02545 1/20 0.33
HSD17B10 Q99714 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17107098 0.89 ALDH1A1 (0.31) ALDH1A1LMNAHSD17B10
SCHEMBL19640266 0.83 ALDH1A1 (0.32) ALDH1A1LMNAHSD17B10
SCHEMBL19640279 0.80 ALDH1A1 (0.36) ALDH1A1LMNAHSD17B10
SCHEMBL19640243 0.80 ALDH1A1 (0.31) ALDH1A1
SCHEMBL19640253 0.77 ALDH1A1 (0.30) ALDH1A1LMNAHSD17B10
SCHEMBL3680496 0.76 CYP2C19 (0.39) ALDH1A1LMNAHSD17B10
SCHEMBL333380 0.72
SCHEMBL4457981 0.71 TDP1 (0.31)
SCHEMBL19640251 0.71
SCHEMBL11752721 0.70 THRB (0.31)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113913019-A High-heat-conductivity liquid silicone rubber for composite material mold 祥雅(嘉兴)科技有限公司 2022-01-11 CN claimed
CN-113913019-A High-heat-conductivity liquid silicone rubber for composite material mold 祥雅(嘉兴)科技有限公司 2022-01-11 CN disclosed
CN-113913019-A High-heat-conductivity liquid silicone rubber for composite material mold 祥雅(嘉兴)科技有限公司 2022-01-11 CN disclosed
US-10246581-B2 Rubber compositions containing whey protein BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC (US) 2019-04-02 US disclosed
US-20170342253-A1 RUBBER COMPOSITIONS CONTAINING WHEY PROTEIN BRIDGESTONE AMERICAS TIRE OPERATIONS, LLC 2017-11-30 US disclosed