SCHEMBL19640920

SCHEMBL19640920

COC(OC)[SiH2]CCC(N)CCN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28555730 0.88
SCHEMBL20677333 0.80 MEN1 (0.30)
SCHEMBL17925360 0.78 ALDH1A1 (0.31)
SCHEMBL57613 0.77
SCHEMBL22229581 0.77 ALDH1A1 (0.33)
SCHEMBL23530119 0.76
SCHEMBL2552509 0.76 OPRM1 (0.32)
SCHEMBL57182 0.75 NFKB1 (0.30)
SCHEMBL27634494 0.74
SCHEMBL15578399 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118216066-A Thermosetting resin composition and stator 住友电木株式会社 2024-06-18 CN disclosed
CN-117715835-A Packing body of sealing material and packing method of sealing material 株式会社力森诺科 2024-03-15 CN disclosed
CN-111566163-B Sealing composition and semiconductor device 株式会社力森诺科 2024-02-13 CN disclosed
CN-116761833-A Sealing composition and semiconductor device 株式会社力森诺科 2023-09-15 CN disclosed
CN-116601855-A Stator, rotary electric machine, and method for manufacturing stator 住友电木株式会社 2023-08-15 CN disclosed
CN-116134094-A Crosslinkable compositions based on organosilicon compounds 瓦克化学股份公司 2023-05-16 CN disclosed
CN-115785621-A Epoxy resin composition for sealing and electronic component device 日立化成株式会社 2023-03-14 CN disclosed
CN-115427483-A Method for manufacturing resin molding material for sealing semiconductor, method for manufacturing semiconductor package, and method for manufacturing semiconductor device 昭和电工材料株式会社 2022-12-02 CN disclosed
CN-114402029-A Sealing material for compression molding and electronic component device 昭和电工材料株式会社 2022-04-26 CN disclosed
CN-114206976-A Sealing resin composition and electronic component 住友电木株式会社 2022-03-18 CN disclosed
CN-106867198-B High dielectric resin composition and electrostatic capacity sensor 住友电木株式会社 2020-09-11 CN disclosed
CN-111601849-A Sealing composition, method for producing same, and semiconductor device 日立化成株式会社 2020-08-28 CN disclosed
CN-111566162-A Sealing composition and semiconductor device 日立化成株式会社 2020-08-21 CN disclosed
CN-111566163-A Sealing composition and semiconductor device 日立化成株式会社 2020-08-21 CN disclosed
CN-111286144-A Thermoplastic vulcanized elastomer and method for producing same 财团法人工业技术研究院 2020-06-16 CN disclosed
EP-3267769-B1 RESIN COMPOSITION FOR SEALING, METHOD FOR PRODUCING VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT, AND VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT SUMITOMO BAKELITE CO (JP) 2019-12-18 EP disclosed
US-10079188-B2 Resin composition for encapsulating, manufacturing method of on-vehicle electronic control unit, and on-vehicle electronic control unit SUMITOMO BAKELITE CO., LTD. (JP) 2018-09-18 US disclosed
CN-107868406-A Capacitive type sensor resin composition for encapsulating and capacitive type sensor 住友电木株式会社 2018-04-03 CN disclosed
EP-3267769-A1 RESIN COMPOSITION FOR SEALING, METHOD FOR PRODUCING VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT, AND VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT Sumitomo Bakelite Co.,Ltd. (JP) 2018-01-10 EP disclosed
US-20170345730-A1 RESIN COMPOSITION FOR ENCAPSULATING, MANUFACTURING METHOD OF ON-VEHICLE ELECTRONIC CONTROL UNIT, AND ON-VEHICLE ELECTRONIC CONTROL UNIT SUMITOMO BAKELITE CO., LTD. (JP) 2017-11-30 US disclosed