SCHEMBL196638

SCHEMBL196638

CCOCN1C(=O)N(COCC)C2C1N(COCC)C(=O)N2COCC

nearest known ligand 0.45

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
L3MBTL1 Q9Y468 1/20 0.45
GAA P10253 2/20 0.35
TP53 P04637 1/20 0.34
ADRA2C P18825 1/20 0.31
F2 P00734 1/20 0.31
ELANE P08246 1/20 0.31
CTSG P08311 1/20 0.31
CTRC Q99895 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16451550 0.94 L3MBTL1 (0.55) L3MBTL1GAATP53F2ELANE
SCHEMBL12024038 0.92 L3MBTL1 (0.39) L3MBTL1GAATP53
SCHEMBL18804142 0.89 L3MBTL1 (0.41) L3MBTL1GAATP53
SCHEMBL11308698 0.89 L3MBTL1 (0.41) L3MBTL1GAATP53ADRA2C
SCHEMBL19421989 0.85 L3MBTL1 (0.35) L3MBTL1GAATP53
SCHEMBL17190789 0.84 L3MBTL1 (0.38) L3MBTL1
SCHEMBL24298472 0.82 TP53 (0.40) L3MBTL1GAATP53
SCHEMBL21242821 0.82 TP53 (0.40) L3MBTL1GAATP53
SCHEMBL196871 0.82 L3MBTL1 (0.42) L3MBTL1GAATP53
SCHEMBL11373410 0.82 L3MBTL1 (0.38) L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 195 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7008476-B2 Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof AZ ELECTRONIC MATERIALS USA CORP. (US) 2006-03-07 US claimed
US-20040253532-A1 Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof MERCK PATENT GMBH (DE) 2004-12-16 US claimed
EP-3877459-B1 POLYMER NETWORK FORMING SILANE COMPOSITIONS MOMENTIVE PERFORMANCE MAT INC (US) 2025-01-22 EP disclosed
US-11905428-B2 Resin compositions and methods of production MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2024-02-20 US disclosed
US-20230375932-A1 RESIST COMPOUND AND UNDERLAYER COMPOUND FOR PHOTOLITHOGRAPHY, MULTILAYERED STRUCTURE FORMED USING THE SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME INHA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION (KR) 2023-11-23 US disclosed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
US-11822248-B2 Coating compositions for use with an overcoated photoresist ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD. (KR) 2023-11-21 US disclosed
CN-113227228-B Silane composition for forming polymer network 迈图高新材料公司 2023-09-05 CN disclosed
US-20230213858-A1 MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2023-07-06 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-20220145115-A1 RESIN COMPOSITIONS AND METHODS OF PRODUCTION MOMENTIVE PERFORMANCE MATERIALS INC. 2022-05-12 US disclosed
WO-2004111092-A1 MODIFIED ALGINIC ACID OR ALGINIC ACID DERIVATIVES AND THERMOSETTING ANTI-REFLECTIVE COMPOSITIONS THEREOF AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-12-23 WO disclosed
US-20040253532-A1 Modified alginic acid of alginic acid derivatives and thermosetting anti-reflective compositions thereof MERCK PATENT GMBH (DE) 2004-12-16 US disclosed
US-20030022095-A1 Negative type radiation sensitive resin composition JSR CORPORATION (JP) 2003-01-30 US disclosed
US-6468714-B2 FINE PHOTORESIST PATTERNS JSR CORPORATION (JP) 2002-10-22 US disclosed
US-6437052-B1 Monomer having diol structure, polymer thereof, and negative photoresist composition and pattern forming method using the same NEC CORPORATION (JP) 2002-08-20 US disclosed
US-20020016431-A1 Monomer having diol structure, polymer thereof, and negative photoresist composition and pattern forming method using the same background of the invention NEC CORPORATION 2002-02-07 US disclosed
US-20010006758-A1 Negative radiation-sensitive resin composition JSR CORPORATION (JP) 2001-07-05 US disclosed
EP-1111465-A1 Negative radiation-sensitive resin composition JSR Corporation (JP) 2001-06-27 EP disclosed
US-6074801-A POLYMER WITH REPEATING UNITS, CROSSLINKING AND ADDING PHOTOACID GENERATOR WITH LIGHT NEC CORPORATION (JP) 2000-06-13 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R L3MBTL1 293/4885GAA 4768/4885TP53 3867/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.