⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL7661422 | 0.81 | — | — | |
| SCHEMBL301420 | 0.79 | — | — | |
| SCHEMBL29046781 | 0.75 | ADRA2A (0.53) | — | |
| SCHEMBL189942 | 0.75 | — | — | |
| Hydrochloric Acid SCHEMBL10681958 | 0.73 | ADRA2A (0.47) | — | |
| Hydrochloric Acid SCHEMBL27564991 | 0.73 | — | — | |
| Bromide SCHEMBL5133738 | 0.73 | — | — | |
| Hydrochloric Acid SCHEMBL4259010 | 0.73 | ADRA2A (0.47) | — | |
| SCHEMBL2512229 | 0.72 | — | — | |
| SCHEMBL14918848 | 0.72 | FPR2 (0.39) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 273 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-120484446-B | Resin glue solution for copper-clad plate, high heat-resistant copper-clad plate and preparation method | 俊萱新材料(杭州)有限公司 | 2026-05-19 | — | — | CN | claimed |
| CN-118956099-B | High-reflectivity flame-retardant resin composition, prepreg and laminated board | 广东伊帕思新材料科技有限公司 | 2025-03-25 | — | — | CN | claimed |
| CN-115678205-B | Glue solution for copper-clad plate and preparation method of copper-clad plate | 安徽鸿海新材料股份有限公司 | 2025-01-28 | — | — | CN | claimed |
| CN-118956099-A | High-reflectivity flame-retardant resin composition, prepreg and laminated board | 广东伊帕思新材料科技有限公司 | 2024-11-15 | — | — | CN | claimed |
| CN-116528509-B | Production and processing technology of copper-embedded circuit board | 兴宁市精维进电子有限公司 | 2024-05-10 | — | — | CN | claimed |
| CN-115197279-B | One class (sp) 3 ) C-C chelate ring palladium metal complex and synthetic method and application thereof | 常州大学 | 2024-02-13 | — | — | CN | claimed |
| CN-116528509-A | Production and processing technology of copper-embedded circuit board | 兴宁市精维进电子有限公司 | 2023-08-01 | — | — | CN | claimed |
| CN-116102851-A | Halogen-free copper-clad plate with CTI of more than 600V and preparation method thereof | 林州致远电子科技有限公司 | 2023-05-12 | — | — | CN | claimed |
| CN-115678205-A | Glue solution for copper-clad plate and preparation method of copper-clad plate | 安徽鸿海新材料股份有限公司 | 2023-02-03 | — | — | CN | claimed |
| CN-115197279-A | Class I (sp) 3 ) C ^ C chelate ring palladium metal complex and synthesis method and application thereof | 常州大学 | 2022-10-18 | — | — | CN | claimed |
| CN-113004856-A | high-Tg thermosetting resin composition and preparation method and application thereof | 林州致远电子科技有限公司 | 2021-06-22 | — | — | CN | claimed |
| CN-112063114-A | Glue solution for primary-color copper-clad plate and preparation method and application thereof | 林州致远电子科技有限公司 | 2020-12-11 | — | — | CN | claimed |
| CN-111718678-A | Glue solution for copper-clad plate, copper-clad plate and preparation method thereof | 林州致远电子科技有限公司 | 2020-09-29 | — | — | CN | claimed |
| CN-105695150-A | Glue removing agent for LED (light emitting diode) encapsulation residue glue | 深圳市盛元半导体有限公司 | 2016-06-22 | — | — | CN | claimed |
| CN-104001540-B | A kind of ionic-liquid catalyst and preparation method thereof | Nanchang Hangkong University (NCHU) (CN) | 2016-04-06 | — | — | CN | claimed |
| CN-104001540-A | Ionic liquid catalyst and preparing method of ionic liquid catalyst | UNIV NANCHANG HANGKONG | 2014-08-27 | — | — | CN | claimed |
| CN-103933830-A | CO2 trapping agent and preparation method thereof | UNIV NANCHANG HANGKONG | 2014-07-23 | — | — | CN | claimed |
| EP-0129819-B1 | METHOD OF IMPREGNATING AND ENVELOPING ELECTRICAL COILS | SIEMENS AKTIENGESELLSCHAFT (DE) | 1987-01-07 | — | — | EP | claimed |
| US-4576768-A | Method for impregnating and embedding electrical windings | SIEMENS AKTIENGESELLSCHAFT (DE) | 1986-03-18 | — | — | US | claimed |
| EP-0129819-A1 | Method of impregnating and enveloping electrical coils | SIEMENS AKTIENGESELLSCHAFT (DE) | 1985-01-02 | — | — | EP | claimed |