SCHEMBL19795476

SCHEMBL19795476

CC(C)COCc1cc(F)c(F)c(F)c1F

nearest known ligand 0.40

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
PTPN1 P18031 1/20 0.40
KDM4E B2RXH2 1/20 0.34
NPC1 O15118 1/20 0.34
MAPT P10636 1/20 0.34
HTT P42858 1/20 0.34
RAB9A P51151 1/20 0.34
L3MBTL1 Q9Y468 1/20 0.34
HDAC3 O15379 1/20 0.33
HDAC6 Q9UBN7 1/20 0.33
DPP4 P27487 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26706139 0.84 MAPT (0.31) MAPTHDAC3HDAC6
SCHEMBL28036668 0.82 ALDH1A1 (0.34) PTPN1KDM4EMAPTHTTDPP4
SCHEMBL19795479 0.81 DPP4 (0.44) PTPN1KDM4ENPC1MAPTHTT
SCHEMBL19795471 0.78 PTPN1 (0.37) PTPN1KDM4EMAPTHTT
SCHEMBL19795484 0.77 PTPN1 (0.39) PTPN1KDM4EMAPTHTT
SCHEMBL19795470 0.76 PTPN1 (0.39) PTPN1KDM4ENPC1L3MBTL1
SCHEMBL19075445 0.73 IDO1 (0.55) PTPN1KDM4ENPC1MAPTHTT
SCHEMBL13676865 0.72 IDO1 (0.52) KDM4ENPC1MAPTHTTRAB9A
SCHEMBL19795489 0.71 PTPN1 (0.33) PTPN1
SCHEMBL21662937 0.68 PTPN1 (0.35) PTPN1KDM4ENPC1MAPTHTT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230350294-A1 Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-11-02 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-11768434-B2 Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts SHIN-ETSU CHEMICAL CO., LTD. (JP) 2023-09-26 US disclosed
US-20200041903-A1 POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2020-02-06 US disclosed
US-20180024434-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2018-01-25 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180024434-A1 TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM F12, RTF1, PUF60 PTPN1 2443/4885KDM4E 243/4885NPC1 3303/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.