Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.33 |
| ▸ | SCN9A | Q15858 | 3/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL22541477 | 0.91 | SMN1; SMN2 (0.44) | SMN1; SMN2SCN9AALDH1A1TDP1 | |
| SCHEMBL127998 | 0.83 | — | — | |
| SCHEMBL16108499 | 0.83 | SMN1; SMN2 (0.43) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9645375 | 0.81 | SMN1; SMN2 (0.39) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9645379 | 0.81 | SMN1; SMN2 (0.39) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9645385 | 0.81 | SMN1; SMN2 (0.39) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9646561 | 0.78 | SMN1; SMN2 (0.36) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9406757 | 0.78 | SMN1; SMN2 (0.36) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9406753 | 0.78 | SMN1; SMN2 (0.36) | SMN1; SMN2ALDH1A1TDP1 | |
| SCHEMBL9647528 | 0.76 | SMN1; SMN2 (0.35) | SMN1; SMN2ALDH1A1TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20230350294-A1 | Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic Component | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-11-02 | — | — | US | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11768434-B2 | Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2023-09-26 | — | — | US | disclosed |
| US-11150556-B2 | Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic parts | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2021-10-19 | — | — | US | disclosed |
| US-20200041903-A1 | POLYMER HAVING A STRUCTURE OF POLYAMIDE, POLYAMIDE-IMIDE, OR POLYIMIDE, PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, PHOTOSENSITIVE DRY FILM, AND PROTECTIVE FILM FOR ELECTRIC AND ELECTRONIC PARTS | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2020-02-06 | — | — | US | disclosed |
| US-20180024434-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2018-01-25 | — | — | US | disclosed |
Patent text — is the patent's own abstract consistent with the prediction?
For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.
| Patent | Title | Text reads most about | Predicted target · text-rank |
|---|---|---|---|
| US-20180024434-A1 | TETRACARBOXYLIC ACID DIESTER COMPOUND, POLYIMIDE PRECURSOR POLYMER AND METHOD FOR PRODUCING THE SAME, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, AND METHOD FOR FORMING CURED FILM | F12, RTF1, PUF60 | SMN1; SMN2 2988/4885SCN9A 2465/4885ALDH1A1 2329/4885 |
“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.