SCHEMBL19809155

SCHEMBL19809155

CCC[Si](OC)(OCC)c1ccccc1

nearest known ligand 0.30

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL707895 0.90 LTA4H (0.32)
SCHEMBL705763 0.88 TP53 (0.32)
SCHEMBL19809239 0.87 LMNA (0.33)
SCHEMBL3295855 0.85 TSHR (0.32) TSHR
SCHEMBL28235872 0.84 TSHR (0.36) TSHR
SCHEMBL19809151 0.84 LMNA (0.33)
SCHEMBL19809161 0.82 ESR1 (0.41) TSHR
SCHEMBL645725 0.82 LTA4H (0.34) TSHR
SCHEMBL27822361 0.81 NPSR1 (0.31) TSHR
SCHEMBL29066979 0.81 LTA4H (0.40) TSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10696845-B2 Energy-sensitive resin composition TOKYO OHKA KOGYO CO., LTD. (JP) 2020-06-30 US disclosed
EP-3275940-B1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-18 EP disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 EP disclosed