SCHEMBL19822478

SCHEMBL19822478

CNC(=S)NCC[Si](OC)(OC)OC

nearest known ligand 0.47

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.47
KDM4E B2RXH2 1/20 0.47
MTNR1B P49286 2/20 0.40
MTNR1A P48039 2/20 0.40
QPCT Q16769 1/20 0.38
ALDH1A1 P00352 3/20 0.36
GAA P10253 1/20 0.36
HRH2 P25021 2/20 0.36
HRH4 Q9H3N8 1/20 0.36
HRH3 Q9Y5N1 1/20 0.36
HPGD P15428 1/20 0.33
MAPT P10636 1/20 0.33
MEN1 O00255 1/20 0.30
PABPC1 P11940 1/20 0.30
KMT2A Q03164 1/20 0.30
TDP1 Q9NUW8 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4459433 0.88 LMNA (0.45) LMNAKDM4EMTNR1BMTNR1AQPCT
SCHEMBL19822467 0.79 KDM4E (0.38) LMNAKDM4EMTNR1BMTNR1AQPCT
SCHEMBL19827963 0.76 GAA (0.47) LMNAALDH1A1GAAMAPTMEN1
SCHEMBL14192214 0.75 KDM4E (0.45) LMNAKDM4EMTNR1BMTNR1AQPCT
SCHEMBL13411550 0.73
SCHEMBL4580302 0.72
SCHEMBL1252676 0.71 LMNA (0.31) LMNA
SCHEMBL16411943 0.70 EPHX1 (0.39) MTNR1BMTNR1AALDH1A1GAA
SCHEMBL26454358 0.70 QPCT (0.45) LMNAKDM4EMTNR1BMTNR1AQPCT
SCHEMBL9949252 0.70 ALDH1A1 (0.73) LMNAKDM4EALDH1A1GAAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10365559-B2 Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device TORAY INDUSTRIES, INC. (JP) 2019-07-30 US disclosed
US-20180203353-A1 CURED FILM AND METHOD FOR MANUFACTURING SAME TORAY INDUSTRIES, INC. (JP) 2018-07-19 US disclosed
US-20180066107-A1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 2018-03-08 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed
US-20180031970-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2018-02-01 US disclosed