Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.45 |
| ▸ | QPCT | Q16769 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.42 |
| ▸ | GAA | P10253 | 1/20 | 0.42 |
| ▸ | HRH2 | P25021 | 2/20 | 0.41 |
| ▸ | HRH4 | Q9H3N8 | 1/20 | 0.41 |
| ▸ | HRH3 | Q9Y5N1 | 1/20 | 0.41 |
| ▸ | MTNR1B | P49286 | 2/20 | 0.38 |
| ▸ | MTNR1A | P48039 | 2/20 | 0.38 |
| ▸ | MEN1 | O00255 | 1/20 | 0.35 |
| ▸ | PABPC1 | P11940 | 1/20 | 0.35 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19827963 | 0.90 | GAA (0.47) | LMNAALDH1A1GAAMEN1PABPC1 | |
| SCHEMBL19822478 | 0.88 | LMNA (0.47) | LMNAKDM4EQPCTALDH1A1GAA | |
| SCHEMBL19822468 | 0.82 | QPCT (0.44) | LMNAQPCTALDH1A1GAAHRH2 | |
| SCHEMBL19822480 | 0.82 | ALDH1A1 (0.50) | ALDH1A1GAAHRH2HRH4MTNR1B | |
| SCHEMBL19822469 | 0.82 | MEN1 (0.47) | LMNAALDH1A1GAAMEN1PABPC1 | |
| SCHEMBL14872815 | 0.81 | QPCT (0.41) | LMNAKDM4EQPCTALDH1A1GAA | |
| SCHEMBL28739369 | 0.79 | ALDH1A1 (0.39) | LMNAALDH1A1GAAMEN1PABPC1 | |
| SCHEMBL22554357 | 0.79 | ALDH1A1 (0.36) | LMNAALDH1A1GAAMEN1PABPC1 | |
| SCHEMBL26454358 | 0.79 | QPCT (0.45) | LMNAKDM4EQPCTALDH1A1GAA | |
| SCHEMBL4466119 | 0.78 | CA1 (0.43) | LMNAALDH1A1GAAKMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119937247-A | Curable resin composition, resin film, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2025-05-06 | — | — | CN | disclosed |
| CN-114761466-B | Curable resin composition, cured film, laminate, method for producing cured film, semiconductor device, and resin | 富士胶片株式会社 | 2024-12-10 | — | — | CN | disclosed |
| CN-115190891-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-10-15 | — | — | CN | disclosed |
| CN-115667404-B | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-115768832-A | Resin composition, method for producing same, and method for producing composition for pattern formation | 富士胶片株式会社 | 2023-03-07 | — | — | CN | disclosed |
| CN-115667404-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2023-01-31 | — | — | CN | disclosed |
| CN-115190891-A | Curable resin composition, cured film, laminate, method for producing cured film, and semiconductor device | 富士胶片株式会社 | 2022-10-14 | — | — | CN | disclosed |
| CN-114341731-A | Method for producing cured film, photocurable resin composition, method for producing laminate, and method for producing semiconductor device | 富士胶片株式会社 | 2022-04-12 | — | — | CN | disclosed |
| WO-2021261429-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND THERMOSETTING RESIN | 富士フイルム株式会社 | 2021-12-30 | — | — | WO | disclosed |
| WO-2021112189-A1 | CURABLE RESIN COMPOSITION, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, SEMICONDUCTOR DEVICE, AND RESIN | 富士フイルム株式会社 | 2021-06-10 | — | — | WO | disclosed |
| WO-2020246234-A1 | NEGATIVE CURABLE COMPOSITION, CURED FILM, LAYERED PRODUCT, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE | 富士フイルム株式会社 | 2020-12-10 | — | — | WO | disclosed |
| US-10365559-B2 | Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device | TORAY INDUSTRIES, INC. (JP) | 2019-07-30 | — | — | US | disclosed |
| US-20180203353-A1 | CURED FILM AND METHOD FOR MANUFACTURING SAME | TORAY INDUSTRIES, INC. (JP) | 2018-07-19 | — | — | US | disclosed |
| US-20180066107-A1 | PHOTOSENSITIVE RESIN COMPOSITION | TORAY INDUSTRIES, INC. (JP) | 2018-03-08 | — | — | US | disclosed |
| US-20180031970-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2018-02-01 | — | — | US | disclosed |
| US-20180031970-A1 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RESIN FILM, AND SEMICONDUCTOR DEVICE | TORAY INDUSTRIES, INC. (JP) | 2018-02-01 | — | — | US | disclosed |
| EP-2090145-B1 | USE OF SILANE COMPOSITIONS FOR THE PRODUCTION OF MULTILAYER LAMINATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2014-05-21 | — | — | EP | disclosed |
| EP-2090145-A2 | USE OF SILANE COMPOSITIONS FOR THE PRODUCTION OF MULTILAYER LAMINATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2009-08-19 | — | — | EP | disclosed |
| WO-2008122427-A2 | USE OF SILANE COMPOSITIONS FOR THE PRODUCTION OF MUTILAYER LAMINATES | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-10-16 | — | — | WO | disclosed |
| EP-1978024-A1 | Silane compositions comprising novel crosslinking agents | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-10-08 | — | — | EP | disclosed |