SCHEMBL19901328

SCHEMBL19901328

Oc1ccc(-c2cc(O)c(-c3ccc(O)cc3)c(-c3ccc(O)cc3)c2O)cc1

nearest known ligand 0.51

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
PDE4B Q07343 3/20 0.51
PDE4A P27815 2/20 0.51
PDE4C Q08493 2/20 0.51
PDE4D Q08499 2/20 0.51
MGAM O43451 2/20 0.50
GAA P10253 2/20 0.50
SI P14410 2/20 0.50
MGAM2 Q2M2H8 2/20 0.50
SENP1 Q9P0U3 1/20 0.45
MMP2 P08253 1/20 0.44
MMP3 P08254 1/20 0.44
ESR1 P03372 7/20 0.42
ABL1 P00519 1/20 0.42
ABCB1 P08183 1/20 0.42
BCR P11274 1/20 0.42
ESR2 Q92731 5/20 0.42
ALOX5 P09917 1/20 0.41
USP7 Q93009 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1760415 0.83 PDE4B (0.62) PDE4BPDE4APDE4CPDE4DESR1
SCHEMBL17625725 0.78 BACE1 (0.60) MMP3ESR1ABL1ABCB1BCR
SCHEMBL17754363 0.75 MGAM (0.81) MGAMGAASIMGAM2
SCHEMBL5890294 0.74 NQO1 (0.62) SENP1MMP3ESR1ABL1ABCB1
SCHEMBL10595101 0.74 ALOX5 (0.56) ESR1ABL1ABCB1BCRESR2
SCHEMBL20873238 0.74 ALOX5 (0.56) ESR1ABL1ABCB1BCRESR2
SCHEMBL25420349 0.72 ESR1 (0.42) PDE4BPDE4APDE4CPDE4DMGAM
SCHEMBL17753392 0.72 TP53 (0.47) MGAMGAASIMGAM2ESR1
SCHEMBL7051517 0.72 SENP1 (0.44) PDE4BPDE4APDE4CPDE4DMGAM
SCHEMBL9794424 0.71 PDE4A (0.57) PDE4BPDE4APDE4CPDE4DMMP3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902798-B2 Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board DIC CORPORATION (JP) 2018-02-27 US disclosed
US-9902798-B2 Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board DIC CORPORATION (JP) 2018-02-27 US disclosed