SCHEMBL19902004

SCHEMBL19902004

CCC(Cc1cc(O)ccc1O)c1cccc(O)c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 2/20 0.44
ESR2 Q92731 2/20 0.44
SLC22A1 O15245 1/20 0.42
OPRM1 P35372 1/20 0.42
HIF1A Q16665 3/20 0.42
LMNA P02545 2/20 0.42
GALR3 O60755 1/20 0.42
SLC6A3 Q01959 4/20 0.41
ADRB1 P08588 2/20 0.41
ADRA1A P35348 2/20 0.41
ADRB2 P07550 1/20 0.41
HTR1A P08908 1/20 0.41
ADRA2A P08913 1/20 0.41
ADRB3 P13945 1/20 0.41
TSHR P16473 1/20 0.41
ADRA2B P18089 1/20 0.41
ADRA2C P18825 1/20 0.41
NFKB1 P19838 1/20 0.41
DRD1 P21728 1/20 0.41
HTR7 P34969 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2383072 0.81 HIF1A (0.53) ESR1ESR2SLC22A1OPRM1HIF1A
SCHEMBL6395780 0.80 ESR1 (0.38) ESR1ESR2SLC22A1OPRM1HIF1A
SCHEMBL19902003 0.78 TYR (0.40) ESR1ESR2TSHRGABRA1GABRB2
SCHEMBL6402386 0.77 ESR1 (0.38) ESR1ESR2SLC22A1OPRM1HIF1A
SCHEMBL6395778 0.77 ESR1 (0.35) ESR1ESR2SLC22A1OPRM1HIF1A
SCHEMBL6396108 0.77 POLB (0.36) ESR1ESR2SLC22A1OPRM1HIF1A
SCHEMBL29492448 0.76 ALOX5 (0.49) ESR1ESR2LMNATSHRGAA
SCHEMBL21830520 0.76 ALOX5 (0.49) ESR1ESR2LMNATSHRGAA
SCHEMBL21164589 0.75 SLC22A1 (0.47) ESR1ESR2SLC22A1OPRM1HIF1A
SCHEMBL6397679 0.74 ESR1 (0.38) ESR1ESR2SLC22A1OPRM1HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902798-B2 Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board DIC CORPORATION (JP) 2018-02-27 US disclosed