SCHEMBL19902021

SCHEMBL19902021

CC(Cc1cc(O)ccc1O)c1ccc(O)cc1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ESR1 P03372 6/20 0.58
▸ ESR2 Q92731 5/20 0.58
▸ GABRA1 P14867 1/20 0.46
▸ GABRB2 P47870 1/20 0.46
▸ EGFR P00533 1/20 0.44
▸ PDCD1 Q15116 1/20 0.43
▸ CD274 Q9NZQ7 1/20 0.43
▸ MIF P14174 1/20 0.42
▸ TYR P14679 2/20 0.40
▸ ALOX15 P16050 2/20 0.40
▸ USP2 O75604 1/20 0.40
▸ ALDH1A1 P00352 1/20 0.40
▸ GAA P10253 1/20 0.40
▸ PKM P14618 1/20 0.40
▸ HPGD P15428 1/20 0.40
▸ HSD17B10 Q99714 1/20 0.40
▸ LMNA P02545 1/20 0.39
▸ CYP1A2 P05177 1/20 0.39
▸ PGR P06401 1/20 0.39
▸ CHRM2 P08172 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11193682 0.89 TYR (0.49) ESR1ESR2GABRA1GABRB2EGFR
SCHEMBL1899586 0.88 ESR1 (0.68) ESR1ESR2GABRA1GABRB2PDCD1
SCHEMBL7058427 0.86 ESR1 (0.51) ESR1ESR2GABRA1GABRB2PDCD1
SCHEMBL5159407 0.85 ESR1 (0.58) ESR1ESR2PDCD1CD274MIF
SCHEMBL10706145 0.81 ESR1 (0.58) ESR1ESR2PDCD1CD274MIF
SCHEMBL5877825 0.80 GABRA1 (0.68) ESR1GABRA1GABRB2EGFRTYR
SCHEMBL4289027 0.80 TYR (0.46) GABRA1GABRB2EGFRTYR
SCHEMBL28231502 0.80 ESR1 (0.56) ESR1ESR2GABRA1GABRB2PDCD1
SCHEMBL3235535 0.79 ESR1 (0.55) ESR1ESR2PDCD1CD274MIF
SCHEMBL2472270 0.79 ESR1 (0.64) ESR1ESR2GABRA1GABRB2PDCD1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902798-B2 Compound containing phenolic hydroxyl group, phenolic resin, curable composition, cured product thereof, semiconductor sealing material, and printed circuit board DIC CORPORATION (JP) 2018-02-27 — — US disclosed
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