SCHEMBL1994665

SCHEMBL1994665

Cc1cc(Cc2cc(C)c(O)cc2O)c(O)c(Cc2cc(C)c(O)cc2O)c1

nearest known ligand 0.63

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
AMY1A P0DUB6 1/20 0.63
HIF1A Q16665 6/20 0.52
CYP2C9 P11712 4/20 0.52
CYP2C19 P33261 4/20 0.52
SMN1; SMN2 Q16637 2/20 0.52
HSPA5 P11021 2/20 0.48
HSD17B10 Q99714 3/20 0.46
CYP2D6 P10635 2/20 0.46
SELL P14151 1/20 0.39
SELP P16109 1/20 0.39
SELE P16581 1/20 0.39
MAPT P10636 4/20 0.37
ALDH1A1 P00352 4/20 0.37
ALOX15 P16050 3/20 0.37
KDM4E B2RXH2 2/20 0.37
CYP1A2 P05177 2/20 0.37
CYP3A4 P08684 2/20 0.37
HPGD P15428 2/20 0.37
ALOX12 P18054 2/20 0.37
G6PD P11413 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30320307 1.00 AMY1A (0.63) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL13609020 0.88 AMY1A (0.58) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL30375265 0.88 AMY1A (0.58) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL29941774 0.88 AMY1A (0.58) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL278491 0.88 AMY1A (0.58) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL27420293 0.88 AMY1A (0.68) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL27420295 0.88 AMY1A (0.68) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL278396 0.87 ALDH1A1 (0.46) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL14255733 0.83 CYP2C9 (0.50) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2
SCHEMBL8077742 0.82 AMY1A (0.61) AMY1AHIF1ACYP2C9CYP2C19SMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 92 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2203783-A2 THICK FILM RESISTS AZ Electronic Materials USA Corp. (US) 2010-07-07 EP claimed
WO-2009040661-A2 THICK FILM RESISTS AZ ELECTRONIC MATERIALS USA CORP. (DE) 2009-04-02 WO claimed
US-20090081589-A1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2009-03-26 US claimed
EP-1623274-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-02-08 EP claimed
EP-1614005-A2 PHOTORESIST COMPOSITIONS AZ Electronic Materials USA Corp. (US) 2006-01-11 EP claimed
WO-2004088424-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
WO-2004088423-A2 PHOTORESIST COMPOSITIONS AZ ELECTRONIC MATERIALS USA CORP. (US) 2004-10-14 WO claimed
US-20040197696-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
US-20040197704-A1 Photoresist compositions AZ ELECTRONIC MATERIALS USA CORP. 2004-10-07 US claimed
EP-2203783-B1 THICK FILM RESISTS MERCK PATENT GMBH (DE) 2019-11-13 EP disclosed
CN-104145217-B Metalloperoxy compounds with organic co-ligands for electron beam, deep UV and extreme UV photoresists 格芯公司 2019-02-05 CN disclosed
US-9851639-B2 Photoacid generating polymers containing a urethane linkage for lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2017-12-26 US disclosed
US-8828493-B2 Methods of directed self-assembly and layered structures formed therefrom INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-09-09 US disclosed
US-8821978-B2 Methods of directed self-assembly and layered structures formed therefrom INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-09-02 US disclosed
EP-0902326-A2 Novolak resin precursor, novolak resin and positive photoresist composition containing the novolak resin TOKYO OHKA KOGYO CO., LTD. (JP) 1999-03-17 EP disclosed
US-5853948-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-12-29 US disclosed
US-5728504-A Positive photoresist compositions and multilayer resist materials using the same TOKYO OHKA KOGYO CO., LTD. (JP) 1998-03-17 US disclosed
US-5702861-A BLEND OF ALKALI SOLUBLE RESIN, QUINONE DIAZIDE COMPOUND AND AN AROMATIC POLYHYDROXY COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1997-12-30 US disclosed
US-5601961-A QUINONE DIAZIDE GROUP-CONTAINING COMPOUND AS PHOTOSENSITIZING AGENT, ALKALI-SOLUBLE RESINOUS INGREDIENT AS FILM-FORMING AGENT MADE FROM A BLEND OF AT LEAST TWO NOVOLAK-TYPE RESINS FROM M-AND P-CRESOL, A XYLENOL AND A TRIMETHYLPHENOL TOKYO OHKA KOGYO CO., LTD. (JP) 1997-02-11 US disclosed
US-5576138-A MIXTURE OF RESIN, PHOTOSENSITIZER AND BENZOPHENONE COMPOUND TOKYO OHKA KOGYO CO., LTD. (JP) 1996-11-19 US disclosed