Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | AMY1A | P0DUB6 | 1/20 | 0.58 |
| ▸ | HIF1A | Q16665 | 5/20 | 0.54 |
| ▸ | CYP2C9 | P11712 | 4/20 | 0.54 |
| ▸ | CYP2C19 | P33261 | 4/20 | 0.54 |
| ▸ | HSD17B10 | Q99714 | 3/20 | 0.54 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.54 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.52 |
| ▸ | HSPA5 | P11021 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.42 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.41 |
| ▸ | MAPT | P10636 | 3/20 | 0.41 |
| ▸ | CYP1A2 | P05177 | 2/20 | 0.41 |
| ▸ | ALOX15 | P16050 | 2/20 | 0.41 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.41 |
| ▸ | G6PD | P11413 | 1/20 | 0.41 |
| ▸ | PKM | P14618 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | CCR6 | P51684 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL13609020 | 1.00 | AMY1A (0.58) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL29941774 | 1.00 | AMY1A (0.58) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL30375265 | 1.00 | AMY1A (0.58) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL1057297 | 0.92 | CYP2C9 (0.51) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL21097154 | 0.91 | AMY1A (0.64) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL10445991 | 0.90 | CYP2C9 (0.61) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL14255733 | 0.90 | CYP2C9 (0.50) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL8819971 | 0.88 | SHBG (0.53) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL1994665 | 0.88 | AMY1A (0.63) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 | |
| SCHEMBL30320307 | 0.88 | AMY1A (0.63) | AMY1AHIF1ACYP2C9CYP2C19HSD17B10 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 178 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023024783-A1 | POSITIVE PHOTORESIST AND PREPARATION METHOD, PREPARATION METHOD FOR GLASS HOUSING, AND ELECTRONIC DEVICE | OPPO广东移动通信有限公司 | 2023-03-02 | — | — | WO | claimed |
| JP-9110759-A | — | — | None | — | — | JP | disclosed |
| US-20250376552-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORP (JP) | 2025-12-11 | — | — | US | disclosed |
| US-20250264801-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-08-21 | — | — | US | disclosed |
| EP-4597225-A1 | FILM PRODUCTION METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT PRODUCTION METHOD, CURED PRODUCT, AND LAMINATE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| EP-4596607-A1 | RESIN COMPOSITION, CURED OBJECT, LAYERED PRODUCT, METHOD FOR PRODUCING CURED OBJECT, METHOD FOR PRODUCING LAYERED PRODUCT, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM Corporation (JP) | 2025-08-06 | — | — | EP | disclosed |
| US-20250230283-A1 | RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJIFILM CORPORATION (JP) | 2025-07-17 | — | — | US | disclosed |
| EP-3961676-B1 | ETCHING METHOD AND PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO LTD (JP) | 2025-01-22 | — | — | EP | disclosed |
| WO-2024143212-A1 | METHOD FOR MANUFACTURING LAMINATE, METHOD FOR MANUFACTURING SEMICONDUCTOR MEMBER, PHOTOSENSITIVE RESIN COMPOSITION, LAMINATE, SEMICONDUCTOR MEMBER, AND RESIN COMPOSITION | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| WO-2024143209-A1 | METHOD FOR PRODUCING MULTILAYER BODY, PHOTOSENSITIVE RESIN COMPOSITION AND METHOD FOR PRODUCING SEMICONDUCTOR MEMBER | 富士フイルム株式会社 | 2024-07-04 | — | — | WO | disclosed |
| US-5620828-A | Positive photoresist composition containing quinonediazide esterification product, novolak resin and pocyhydroxy alkali dissolution accelerator | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-15 | — | — | US | disclosed |
| EP-0766139-A1 | Positive working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-04-02 | — | — | EP | disclosed |
| US-5609982-A | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1997-03-11 | — | — | US | disclosed |
| US-5602260-A | PHOTORESISTS | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1997-02-11 | — | — | US | disclosed |
| EP-0744661-A1 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1996-11-27 | — | — | EP | disclosed |
| EP-0740213-A2 | Positive photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1996-10-30 | — | — | EP | disclosed |
| US-5547814-A | PHOTORESISTS | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-20 | — | — | US | disclosed |
| EP-0725053-A1 | Selected O-quinonediazide sulfonic acid esters of phenolic compounds and their use in radiation-sensitive compositions | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-08-07 | — | — | EP | disclosed |
| US-5541033-A | PHOTOSENSITIVE COMPOUNDS FOR POSITIVE PHOTORESISTS FORMING PATTERNS | OCG MICROELECTRONIC MATERIALS, INC. (US) | 1996-07-30 | — | — | US | disclosed |
| EP-0658807-A1 | Positive-working photoresist composition | FUJI PHOTO FILM CO., LTD. (JP) | 1995-06-21 | — | — | EP | disclosed |