SCHEMBL1995648

SCHEMBL1995648

CCCC[C](OCC)OCC

nearest known ligand 0.41

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CES1 P23141 3/20 0.41
CES2 O00748 2/20 0.41
ALDH1A1 P00352 6/20 0.40
TP53 P04637 1/20 0.38
CA1 P00915 2/20 0.36
DGKA P23743 1/20 0.36
CYP1A2 P05177 1/20 0.36
FAAH O00519 2/20 0.35
LMNA P02545 2/20 0.35
HSD17B10 Q99714 1/20 0.35
ALOX15 P16050 1/20 0.33
MGAM O43451 1/20 0.33
GAA P10253 1/20 0.33
SI P14410 1/20 0.33
MGAM2 Q2M2H8 1/20 0.33
TSHR P16473 1/20 0.33
CA12 O43570 1/20 0.33
CA2 P00918 1/20 0.33
CA9 Q16790 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1066094 0.92 DGKA (0.44) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL9629142 0.89 DGKA (0.48) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL9629686 0.89 DGKA (0.48) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL9629133 0.89 DGKA (0.48) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL9628764 0.89 DGKA (0.48) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL2199092 0.89 DGKA (0.48) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL9629173 0.89 DGKA (0.48) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL9630878 0.89 DGKA (0.48) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL27560145 0.87 DGKA (0.46) CES1CES2ALDH1A1DGKAFAAH
SCHEMBL25721 0.81 ALDH1A1 (0.40) CES1CES2ALDH1A1CA1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024070845-A1 PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, CURED PRODUCT PRODUCTION METHOD, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND RESIN PRODUCTION METHOD 東レ株式会社 2024-04-04 WO disclosed
WO-2023248887-A1 POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, POSITIVE TYPE PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, CURED PRODUCT MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND DISPLAY DEVICE 東レ株式会社 2023-12-28 WO disclosed
EP-2339048-B1 Method for depositing organometallic compounds ROHM & HAAS ELECT MAT (US) 2016-12-07 EP disclosed
US-8343580-B2 Organometallic compounds ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2013-01-01 US disclosed
CN-102093405-B Compound siloxane modified isocyanate tripolymer with high compatibility and low viscosity and preparation method thereof DIAMOND ADVANCED MATERIAL OF CHEMICAL INC 2012-10-03 CN disclosed
EP-2339048-A1 Organometallic compounds Rohm and Haas Electronic Materials, L.L.C. (US) 2011-06-29 EP disclosed
CN-102093405-A Compound siloxane modified isocyanate tripolymer with high compatibility and low viscosity and preparation method thereof DIAMOND ADVANCED MATERIAL OF CHEMICAL CO LTD 2011-06-15 CN disclosed
US-20110064879-A1 ORGANOMETALLIC COMPOUNDS ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) 2011-03-17 US disclosed
CN-1057548-C Thermoplastic resin composition MITSUBISHI RAYON CO (JP) 2000-10-18 CN disclosed
CN-1099775-A Thermoplastic resin composition MITSUBISHI RAYON CO (JP) 1995-03-08 CN disclosed
EP-0225129-A1 Phospholipid derivatives, their production and use Takeda Chemical Industries, Ltd. (JP) 1987-06-10 EP disclosed