SCHEMBL199578

SCHEMBL199578

CCC(CCN)NC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL20544164 0.87 SLC6A4 (0.30)
SCHEMBL29180432 0.85
SCHEMBL8852181 0.84
SCHEMBL20778249 0.82 DNM1 (0.36)
SCHEMBL19445841 0.82 SLC6A4 (0.37)
SCHEMBL25019126 0.81
SCHEMBL6027874 0.81
SCHEMBL7561569 0.80
SCHEMBL20613038 0.79 GABBR2 (0.31)
SCHEMBL24014657 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 396 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250019579-A1 COMPOSITION BASED ON (METH)ACRYLATE MONOMERS CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (FR) 2025-01-16 US claimed
EP-4437056-A1 COMPOSITION BASED ON (METH)ACRYLATE MONOMERS Bostik SA (FR) 2024-10-02 EP claimed
CN-118284673-A Compositions based on (meth) acrylate monomers 博斯蒂克股份公司 2024-07-02 CN claimed
WO-2023089252-A1 COMPOSITION BASED ON (METH)ACRYLATE MONOMERS BOSTIK SA (FR) 2023-05-25 WO claimed
EP-4721970-A1 BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE LAYER Henkel AG & Co. KGaA (DE) 2026-04-08 EP disclosed
EP-4721971-A1 METHOD OF SEPARATING BONDED ARTICLES Henkel AG & Co. KGaA (DE) 2026-04-08 EP disclosed
EP-4717746-A1 ONE COMPONENT (1K) COMPOSITION BASED ON EPOXIDE COMPOUNDS Henkel AG & Co. KGaA (DE) 2026-04-01 EP disclosed
US-12590207-B2 Epoxy composition comprising a bio-based epoxy compound HENKEL AG & CO. KGAA (DE) 2026-03-31 US disclosed
US-20260088410-A1 ELECTRONICS ASSEMBLY HAVING ELECTROCHEMICALLY DEBONDABLE COMPONENTS HENKEL AG & CO KGAA (DE) 2026-03-26 US disclosed
EP-4714984-A1 DUAL CURE STRUCTURAL ADHESIVE COMPOSITION Henkel AG & Co. KGaA (DE) 2026-03-25 EP disclosed
US-20260078284-A1 DEBONDABLE ADHESIVE TAPE HENKEL AG & CO KGAA (DE) 2026-03-19 US disclosed
EP-4663713-A1 BONDED STRUCTURE COMPRISING AN THERMALLY DEBONDABLE ADHESIVE FILM Henkel AG & Co. KGaA (DE) 2025-12-17 EP disclosed
EP-1937740-A1 REACTIVE POLYURETHANE-HOT MELT ADHESIVE HAVING A LOW ISOCYANATE-MONOMER CONTENT Sika Technology AG (CH) 2008-07-02 EP disclosed
WO-2008052999-A1 POLYURETHANE COMPOSITION WITH GOOD INITIAL STRENGTH SIKA TECHNOLOGY AG (CH) 2008-05-08 WO disclosed
EP-1918314-A1 Polyurethane composition with high green strength Sika Technology AG (CH) 2008-05-07 EP disclosed
WO-2007036575-A1 REACTIVE POLYURETHANE-HOT MELT ADHESIVE HAVING A LOW ISOCYANATE-MONOMER CONTENT SIKA TECHNOLOGY AG (CH) 2007-04-05 WO disclosed
CN-1809618-A Cyclic bisamides for formulating inks for phase change printing ARIZONA CHEM (US) 2006-07-26 CN disclosed
US-4117108-A RETARDING PLAQUE FORMATION, FATTY ACID AMIDES NOXELL CORPORATION (US) 1978-09-26 US disclosed
US-4117107-A METHOD AND COMPOSITION FOR IMPROVING ORAL HYGIENE NOXELL CORPORATION (US) 1978-09-26 US disclosed
US-4093711-A Oral hygiene NOXELL CORPORATION (US) 1978-06-06 US disclosed