Predicted protein targets (top 13)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MDM2 | Q00987 | 1/20 | 0.39 |
| ▸ | TAAR1 | Q96RJ0 | 2/20 | 0.39 |
| ▸ | BCHE | P06276 | 1/20 | 0.37 |
| ▸ | TYK2 | P29597 | 3/20 | 0.37 |
| ▸ | JAK2 | O60674 | 2/20 | 0.37 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.36 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | EPHX1 | P07099 | 1/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.34 |
| ▸ | HTT | P42858 | 2/20 | 0.33 |
| ▸ | MEN1 | O00255 | 2/20 | 0.33 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.33 |
| ▸ | LMNA | P02545 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25516100 | 0.79 | MDM2 (0.47) | MDM2TAAR1BCHETYK2JAK2 | |
| SCHEMBL23816384 | 0.68 | KDM4E (0.36) | KDM4ERAB9AMEN1KMT2ALMNA | |
| SCHEMBL23816395 | 0.67 | — | — | |
| SCHEMBL18383509 | 0.66 | TGM2 (0.53) | KDM4EL3MBTL1EPHX1RAB9AMEN1 | |
| SCHEMBL6430031 | 0.66 | TGM2 (0.64) | MDM2TAAR1KDM4EL3MBTL1RAB9A | |
| SCHEMBL14402892 | 0.66 | TGM2 (0.48) | TAAR1KDM4EEPHX1RAB9AKMT2A | |
| SCHEMBL21250127 | 0.66 | MDM2 (0.40) | MDM2TAAR1BCHETYK2JAK2 | |
| SCHEMBL21250145 | 0.65 | MDM2 (0.47) | MDM2TAAR1BCHETYK2JAK2 | |
| SCHEMBL12407894 | 0.65 | MDM2 (0.52) | MDM2TAAR1BCHETYK2JAK2 | |
| SCHEMBL20008068 | 0.65 | TGM2 (0.47) | TAAR1KDM4EEPHX1RAB9AMEN1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2018057590-A1 | COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS | MACDERMID ENTHONE INC. (US) | 2018-03-29 | — | — | WO | disclosed |