SCHEMBL20013245

SCHEMBL20013245

C=C(SCCCS(=O)(=O)O)N(C)C

nearest known ligand 0.35

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
APP P05067 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28745735 0.78 CHRNB2 (0.44) APP
SCHEMBL292860 0.77 APP (0.35) APP
SCHEMBL30608208 0.76 APP (0.34) APP
SCHEMBL564656 0.76 APP (0.34) APP
SCHEMBL18140539 0.73 APP (0.35) APP
Ammonia Solution, Strong SCHEMBL18139017 0.72 APP (0.34) APP
SCHEMBL11660704 0.71 CYP2C19 (0.41) APP
SCHEMBL28478736 0.71 APP (0.41) APP
SCHEMBL7831490 0.69 APP (0.39) APP
SCHEMBL17003713 0.69 CYP2C19 (0.40) APP

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2018057590-A1 COPPER DEPOSITION IN WAFER LEVEL PACKAGING OF INTEGRATED CIRCUITS MACDERMID ENTHONE INC. (US) 2018-03-29 WO disclosed