Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.35 |
| ▸ | LMNA | P02545 | 3/20 | 0.34 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.34 |
| ▸ | HTT | P42858 | 2/20 | 0.34 |
| ▸ | MGLL | Q99685 | 2/20 | 0.34 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | MEN1 | O00255 | 1/20 | 0.34 |
| ▸ | FAAH | O00519 | 1/20 | 0.34 |
| ▸ | JAK2 | O60674 | 1/20 | 0.34 |
| ▸ | BBOX1 | O75936 | 1/20 | 0.34 |
| ▸ | TP53 | P04637 | 1/20 | 0.34 |
| ▸ | ALDH2 | P05091 | 1/20 | 0.34 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | FBP1 | P09467 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | PKM | P14618 | 1/20 | 0.34 |
| ▸ | HPGD | P15428 | 1/20 | 0.34 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL564656 | 0.98 | APP (0.34) | APPLMNAALDH1A1HTTMGLL | |
| SCHEMBL30608208 | 0.98 | APP (0.34) | APPLMNAALDH1A1HTTMGLL | |
| SCHEMBL28404865 | 0.88 | LMNA (0.37) | LMNAALDH1A1HTTMGLLL3MBTL1 | |
| SCHEMBL13321325 | 0.85 | ALDH1A1 (0.36) | LMNAALDH1A1HTTMGLLL3MBTL1 | |
| SCHEMBL6700776 | 0.81 | MGLL (0.48) | APPLMNAALDH1A1HTTMGLL | |
| SCHEMBL1258660 | 0.81 | LMNA (0.36) | LMNAALDH1A1HTTMGLLL3MBTL1 | |
| SCHEMBL28745735 | 0.78 | CHRNB2 (0.44) | APPLMNACYP2C19 | |
| SCHEMBL18714336 | 0.78 | — | — | |
| SCHEMBL20013245 | 0.77 | APP (0.35) | APP | |
| SCHEMBL19629284 | 0.75 | ALDH1A1 (0.40) | LMNAALDH1A1HTTMGLLL3MBTL1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 444 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024131535-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| WO-2024131536-A1 | METAL PLATING COMPOSITION AND USE METHOD THEREFOR | 宁波安集微电子科技有限公司 | 2024-06-27 | — | — | WO | claimed |
| CN-118241267-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-118241266-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-06-25 | — | — | CN | claimed |
| CN-117684222-A | Metal electroplating composition for electrolytic copper coating and application method thereof | 宁波安集微电子科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| CN-117684223-A | Metal electroplating composition and application method thereof | 宁波安集微电子科技有限公司 | 2024-03-12 | — | — | CN | claimed |
| US-20230160068-A1 | METHOD FOR FORMING A BLACK-PASSIVATION LAYER ON A ZINC-IRON ALLOY AND BLACK- PASSIVATION COMPOSITION | Atotech Deutschland GmbH & Co. KG (DE) | 2023-05-25 | — | — | US | claimed |
| CN-112725851-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| CN-112746292-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-04-28 | — | — | CN | claimed |
| CN-112795960-B | Chip copper interconnection electroplating additive, preparation method and application thereof | 上海新阳半导体材料股份有限公司 | 2023-03-31 | — | — | CN | claimed |
| US-20070160857-A1 | Cobalt-based alloy electroless planting solution and electroless plating method using the same | LG CHEM, LTD. (KR) | 2007-07-12 | — | — | US | claimed |
| US-7064068-B2 | Method to improve planarity of electroplated copper | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2006-06-20 | — | — | US | claimed |
| US-20060011483-A1 | Process for electroplating metals into microscopic recessed features | NOVELLUS SYSTEMS, INC. | 2006-01-19 | — | — | US | claimed |
| EP-1152071-B1 | Copper plating method | ELECTROPLATING ENG (JP) | 2005-09-07 | — | — | EP | claimed |
| EP-1152071-A1 | Copper plating method | Electroplating Engineers of Japan Limited (JP) | 2001-11-07 | — | — | EP | claimed |
| EP-0785297-B1 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH DEUTSCHLAND GMBH (DE) | 2000-01-05 | — | — | EP | claimed |
| EP-0304315-B1 | BATH FOR ELECTROLYTIC DEPOSITION OF A GOLD-COPPER-ZINC ALLOY | ENGELHARD LIMITED (GB) | 1993-03-03 | — | — | EP | claimed |
| US-5051154-A | Copper salt, an electrolyte and an organic additive for modification of the charge transfer overpotential | SHIPLEY COMPANY INC. (US) | 1991-09-24 | — | — | US | claimed |
| EP-0440027-A2 | Additive for acid-copper electroplating baths to increase throwing power | SHIPLEY COMPANY INC. (US) | 1991-08-07 | — | — | EP | claimed |
| US-4975159-A | Copper salt, inorganic acid and alkoxylated lactam; reinforcing electroconductivity of printed circuit | SCHERING AKTIENGESELLSCHAFT (DE) | 1990-12-04 | — | — | US | claimed |