SCHEMBL20096388

SCHEMBL20096388

CC(=O)O/N=C(\Cc1cccc(C)c1)C(=O)c1ccc2c(c1)C(CCC(F)(F)F)(CCC(F)(F)F)c1ccccc1-2

nearest known ligand 0.36

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
▸ PDK2 Q15119 15/20 0.36
▸ CTBP2 P56545 1/20 0.35
▸ ORAI1 Q96D31 2/20 0.35
▸ L3MBTL1 Q9Y468 1/20 0.34
▸ MAOB P27338 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20090053 0.97 PDK2 (0.34) PDK2CTBP2ORAI1L3MBTL1
SCHEMBL20096387 0.93 PDK2 (0.38) PDK2
SCHEMBL20090052 0.90 PDK2 (0.36) PDK2
SCHEMBL20090054 0.89 PDK2 (0.33) PDK2CTBP2ORAI1L3MBTL1
SCHEMBL20090055 0.89 CTBP2 (0.37) PDK2CTBP2L3MBTL1MAOB
SCHEMBL20090059 0.89 CTBP2 (0.37) PDK2CTBP2L3MBTL1MAOB
SCHEMBL20090058 0.89 CTBP2 (0.39) PDK2CTBP2L3MBTL1MAOB
SCHEMBL20090056 0.88 CTBP2 (0.36) PDK2CTBP2ORAI1L3MBTL1MAOB
SCHEMBL20090057 0.86 PDK2 (0.37) PDK2CTBP2L3MBTL1MAOB
SCHEMBL20096531 0.86 CTBP2 (0.35) PDK2CTBP2L3MBTL1MAOB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10416560-B2 Coloring agent dispersion, photosensitive resin composition, cured product, organic el element, method for forming pattern, and method for producing photosensitive resin composition TOKYO OHKA KOGYO CO, LTD. (JP) 2019-09-17 — — US disclosed
US-20180113383-A1 COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-04-26 — — US disclosed
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