SCHEMBL20102166

SCHEMBL20102166

C=CC(=O)OC(C)c1ccccc1C(C)(C)C

nearest known ligand 0.39

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
HCAR2 Q8TDS4 1/20 0.39
TDP1 Q9NUW8 2/20 0.36
ATM Q13315 1/20 0.36
ALDH1A1 P00352 6/20 0.34
TSHR P16473 3/20 0.34
CYP2C19 P33261 3/20 0.33
CYP3A4 P08684 2/20 0.33
THRB P10828 1/20 0.33
ELANE P08246 1/20 0.32
CA2 P00918 1/20 0.32
KDM4E B2RXH2 2/20 0.31
GAA P10253 1/20 0.31
RXRA P19793 1/20 0.31
RXRB P28702 1/20 0.31
RXRG P48443 1/20 0.31
CYP2C9 P11712 1/20 0.31
LPAR1 Q92633 1/20 0.31
CYP1A2 P05177 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2743763 0.88 HCAR2 (0.37) HCAR2ALDH1A1TSHRCYP2C19CYP3A4
SCHEMBL8767852 0.88 HCAR2 (0.37) HCAR2ALDH1A1TSHRCYP2C19CYP3A4
Hydrochloric Acid SCHEMBL2470314 0.87 HCAR2 (0.36) HCAR2ALDH1A1CYP2C19CYP3A4THRB
Hydrochloric Acid SCHEMBL28562162 0.85 HCAR2 (0.35) HCAR2ALDH1A1CYP2C19CYP3A4CYP2C9
SCHEMBL1790914 0.82 ALDH1A1 (0.39) TDP1ATMALDH1A1TSHRCYP2C19
Hydrochloric Acid SCHEMBL9794907 0.81 HCAR2 (0.40) HCAR2ALDH1A1TSHRCYP2C19THRB
Hydrochloric Acid SCHEMBL5399306 0.81 HCAR2 (0.34) HCAR2TSHRCYP2C19THRBCYP1A2
SCHEMBL1790920 0.81 TDP1 (0.40) HCAR2TDP1ATMALDH1A1TSHR
Trifluoromethanesulfonic Acid SCHEMBL16108557 0.80 HCAR2 (0.32) HCAR2
SCHEMBL1906054 0.80 GABRA1 (0.46) HCAR2TSHRCYP2C19THRBCA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114539845-A Ink-jet printing solder-resist ink composition and circuit board thereof 惠州市容大感光科技有限公司 2022-05-27 CN disclosed
US-10739678-B2 Photocurable composition, pattern forming method, and method for manufacturing device FUJIFILM CORPORATION (JP) 2020-08-11 US disclosed
US-20180120698-A1 PHOTOCURABLE COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180120698-A1 PHOTOCURABLE COMPOSITION, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed