SCHEMBL20109836

SCHEMBL20109836

CC(=O)Oc1ccc(/C=C/C(=O)N2CCCCC2)c(O)c1

nearest known ligand 0.55

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ PELI1 Q96FA3 3/20 0.55
▸ TRPV1 Q8NER1 2/20 0.50
▸ HPGD P15428 1/20 0.48
▸ NPC1 O15118 2/20 0.46
▸ RAB9A P51151 2/20 0.46
▸ PTGS2 P35354 2/20 0.46
▸ KDM4E B2RXH2 2/20 0.45
▸ LMNA P02545 1/20 0.45
▸ KMT2A Q03164 3/20 0.44
▸ ALDH1A1 P00352 3/20 0.44
▸ MAOB P27338 2/20 0.44
▸ ALOX5 P09917 2/20 0.44
▸ MEN1 O00255 2/20 0.44
▸ MAPT P10636 2/20 0.44
▸ SMN1; SMN2 Q16637 2/20 0.44
▸ HTT P42858 1/20 0.44
▸ POLB P06746 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29449824 0.87 TRPV1 (0.58) PELI1TRPV1HPGDPTGS2KDM4E
SCHEMBL10230139 0.87 TRPV1 (0.58) PELI1TRPV1HPGDPTGS2KDM4E
SCHEMBL20109837 0.85 PELI1 (0.50) PELI1TRPV1HPGDNPC1RAB9A
SCHEMBL20109835 0.84 PELI1 (0.54) PELI1TRPV1HPGDNPC1RAB9A
SCHEMBL20109825 0.84 PELI1 (0.49) PELI1TRPV1HPGDNPC1RAB9A
SCHEMBL766060 0.83 PELI1 (0.67) PELI1TRPV1HPGDNPC1KMT2A
SCHEMBL10322050 0.83 PELI1 (0.67) PELI1TRPV1HPGDNPC1KMT2A
SCHEMBL766034 0.82 PELI1 (0.52) PELI1TRPV1HPGDPTGS2KDM4E
SCHEMBL766014 0.80 MAPT (0.55) PELI1TRPV1HPGDNPC1RAB9A
SCHEMBL20109845 0.79 PELI1 (0.49) PELI1TRPV1HPGDNPC1RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 — — US disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 — — US disclosed
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