SCHEMBL766014

SCHEMBL766014

Cc1ccc(/C=C/C(=O)N2CCCCC2)c(O)c1

nearest known ligand 0.55

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MAPT P10636 4/20 0.55
PELI1 Q96FA3 3/20 0.54
TRPV1 Q8NER1 2/20 0.52
HPGD P15428 2/20 0.50
ALOX5 P09917 2/20 0.49
MAOB P27338 1/20 0.49
ALDH1A1 P00352 6/20 0.48
RAB9A P51151 4/20 0.48
KMT2A Q03164 3/20 0.48
NPC1 O15118 3/20 0.48
SMN1; SMN2 Q16637 2/20 0.48
MEN1 O00255 2/20 0.48
KDM4E B2RXH2 1/20 0.46
L3MBTL1 Q9Y468 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10322050 0.85 PELI1 (0.67) PELI1TRPV1HPGDALOX5MAOB
SCHEMBL766060 0.85 PELI1 (0.67) PELI1TRPV1HPGDALOX5MAOB
SCHEMBL10446033 0.83 PELI1 (0.63) MAPTPELI1TRPV1HPGDALOX5
SCHEMBL766033 0.82 PELI1 (0.56) MAPTPELI1TRPV1HPGDALOX5
SCHEMBL15970761 0.82 MAPT (0.57) MAPTPELI1TRPV1HPGDALDH1A1
SCHEMBL15970762 0.82 MAPT (0.57) MAPTPELI1TRPV1HPGDALDH1A1
SCHEMBL29449824 0.82 TRPV1 (0.58) MAPTPELI1TRPV1HPGDALDH1A1
SCHEMBL10230139 0.82 TRPV1 (0.58) MAPTPELI1TRPV1HPGDALDH1A1
SCHEMBL26478626 0.82 LMNA (0.49) MAPTALDH1A1RAB9AKMT2ANPC1
SCHEMBL10446290 0.82 PELI1 (0.62) MAPTPELI1TRPV1HPGDALOX5

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9647242-B2 Heat-conductive sealing member and electroluminescent element DAI NIPPON PRINTING CO., LTD. (JP) 2017-05-09 US disclosed
US-9332631-B2 Heat dissipating substrate, and element equipped with same DAI NIPPON PRINTING CO., LTD. (JP) 2016-05-03 US disclosed
US-9024312-B2 Substrate for flexible device, thin film transistor substrate for flexible device, flexible device, substrate for thin film element, thin film element, thin film transistor, method for manufacturing substrate for thin film element, method for manufacturing thin film element, and method for manufacturing thin film transistor DAI NIPPON PRINTING CO., LTD. (JP) 2015-05-05 US disclosed
US-8778596-B2 Photosensitive resin composition, pattern forming material comprising the photosensitive resin composition, and pattern forming method and article using the photosensitive resin composition DAI NIPPON PRINTING CO., LTD. (JP) 2014-07-15 US disclosed
US-20140085830-A1 HEAT DISSIPATING SUBSTRATE, AND ELEMENT EQUIPPED WITH SAME DAI NIPPON PRINTING CO., LTD. (JP) 2014-03-27 US disclosed
US-20130309607-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION DAI NIPPON PRINTING CO., LTD. (JP) 2013-11-21 US disclosed
US-8476444-B2 Base generator DAI NIPPON PRINTING CO., LTD. (JP) 2013-07-02 US disclosed
US-20130126860-A1 THIN FILM TRANSISTOR SUBSTRATE DAI NIPPON PRINTING CO., LTD. (JP) 2013-05-23 US disclosed
US-20120187399-A1 SUBSTRATE FOR FLEXIBLE DEVICE, THIN FILM TRANSISTOR SUBSTRATE FOR FLEXIBLE DEVICE, FLEXIBLE DEVICE, SUBSTRATE FOR THIN FILM ELEMENT, THIN FILM ELEMENT, THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING SUBSTRATE FOR THIN FILM ELEMENT, METHOD FOR MANUFACTURING THIN FILM ELEMENT, AND METHOD FOR MANUFACTURING THIN FILM TRANSISTOR DAI NIPPON PRINTING CO., LTD. (JP) 2012-07-26 US disclosed
US-20120181914-A1 HEAT-CONDUCTIVE SEALING MEMBER AND ELECTROLUMINESCENT ELEMENT DAI NIPPON PRINTING CO., LTD. (JP) 2012-07-19 US disclosed
US-20120070781-A1 BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME DAI NIPPON PRINTING CO., LTD. (JP) 2012-03-22 US disclosed
US-20110086311-A1 BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION DAI NIPPON PRINTING CO., LTD. (JP) 2011-04-14 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (2 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20120070781-A1 BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD USING THE PHOTOSENSITIVE RESIN COMPOSITION AND PRODUCTS COMPRISING THE SAME RER1, SUN2, REV1 MAPT 852/4885PELI1 585/4885TRPV1 536/4885
US-20110086311-A1 BASE GENERATOR, PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING MATERIAL COMPRISING THE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERN FORMING METHOD AND ARTICLE USING THE PHOTOSENSITIVE RESIN COMPOSITION RER1, SUN2, LCP1 MAPT 490/4885PELI1 586/4885TRPV1 728/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.