Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CHRNB2 | P17787 | 10/20 | 0.48 |
| ▸ | CHRNA4 | P43681 | 10/20 | 0.48 |
| ▸ | CHRNB4 | P30926 | 8/20 | 0.48 |
| ▸ | CHRNA3 | P32297 | 6/20 | 0.39 |
| ▸ | TRPV1 | Q8NER1 | 1/20 | 0.36 |
| ▸ | ACACB | O00763 | 1/20 | 0.35 |
| ▸ | MTNR1A | P48039 | 6/20 | 0.34 |
| ▸ | MTNR1B | P49286 | 6/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2736107 | 0.88 | CHRNB2 (0.46) | CHRNB2CHRNA4CHRNB4CHRNA3ACACB | |
| SCHEMBL9888804 | 0.79 | ALDH1A1 (0.42) | TRPV1ACACBMTNR1AMTNR1B | |
| SCHEMBL6451928 | 0.79 | TRPV1 (0.40) | TRPV1ACACBMTNR1AMTNR1B | |
| SCHEMBL12506705 | 0.78 | PAOX (0.38) | TRPV1ACACBMTNR1AMTNR1B | |
| SCHEMBL20149715 | 0.78 | TRPV1 (0.39) | TRPV1ACACBMTNR1AMTNR1B | |
| SCHEMBL20149718 | 0.76 | ALDH1A1 (0.41) | TRPV1ACACBMTNR1AMTNR1B | |
| SCHEMBL13645924 | 0.76 | TRPV1 (0.35) | TRPV1ACACBMTNR1AMTNR1B | |
| SCHEMBL2760205 | 0.75 | TAS1R3 (0.50) | TRPV1ACACB | |
| SCHEMBL6451931 | 0.75 | TRPV1 (0.40) | TRPV1ACACBMTNR1AMTNR1B | |
| SCHEMBL20257406 | 0.75 | TRPV1 (0.40) | TRPV1ACACBMTNR1AMTNR1B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180135196-A1 | ADDITIVE FOR COPPER ELECTROPLATING BATH, COPPER ELECTROPLATING BATH CONTAINING SAID ADDITIVE, AND COPPER ELECTROPLATING METHOD USING SAID COPPER ELECTROPLATING BATH | ADEKA CORPORATION (JP) | 2018-05-17 | — | — | US | disclosed |