SCHEMBL20220960

SCHEMBL20220960

CCO[Si](CCCNC(=O)Nc1cccnc1)(OCC)OCI

nearest known ligand 0.62

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CDK2 P24941 1/20 0.62
FLT4 P35916 1/20 0.62
KEAP1 Q14145 3/20 0.51
NFE2L2 Q16236 3/20 0.51
NPC1 O15118 5/20 0.50
RAB9A P51151 5/20 0.50
MAPT P10636 1/20 0.50
PKM P14618 1/20 0.50
L3MBTL1 Q9Y468 1/20 0.47
MEN1 O00255 2/20 0.46
KMT2A Q03164 2/20 0.46
CASP3 P42574 1/20 0.46
SENP8 Q96LD8 1/20 0.46
SENP7 Q9BQF6 1/20 0.46
SENP6 Q9GZR1 1/20 0.46
KDM4E B2RXH2 1/20 0.44
LMNA P02545 1/20 0.44
POLB P06746 1/20 0.44
FPR2 P25090 1/20 0.43
TSHR P16473 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16137613 0.94 CDK2 (0.69) CDK2FLT4KEAP1NFE2L2NPC1
SCHEMBL17030476 0.82 CDK2 (0.72) CDK2FLT4KEAP1NFE2L2NPC1
SCHEMBL6280635 0.81 EPHX1 (0.62) CDK2FLT4NPC1RAB9AMAPT
SCHEMBL17030473 0.80 KEAP1 (0.52) CDK2FLT4KEAP1NFE2L2RAB9A
SCHEMBL12989334 0.79 CDK2 (0.81) CDK2FLT4KEAP1NFE2L2NPC1
SCHEMBL21581791 0.79 EPHX1 (0.51) NPC1RAB9AMAPTMEN1KMT2A
SCHEMBL28420696 0.77 EPHX1 (0.65) CDK2FLT4NPC1RAB9AMEN1
SCHEMBL10987238 0.76 CDK2 (0.75) CDK2FLT4KEAP1NFE2L2NPC1
SCHEMBL19091261 0.74 ALDH1A1 (0.56) NPC1RAB9AMAPTL3MBTL1KMT2A
SCHEMBL3780409 0.74 FLT4 (0.81) CDK2FLT4KEAP1NFE2L2NPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3330320-B1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-04-24 EP disclosed
EP-3330320-A1 POLYIMIDE PRECURSOR COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-06-06 EP disclosed