SCHEMBL203373

SCHEMBL203373

Nc1cccc(C(=O)c2ccc(C(=O)c3cccc(N)c3)cc2)c1

nearest known ligand 0.88

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PBRM1 Q86U86 1/20 0.88
NPC1 O15118 1/20 0.72
MITF O75030 1/20 0.72
LMNA P02545 1/20 0.72
POLB P06746 1/20 0.72
CA1 P00915 1/20 0.67
CA2 P00918 1/20 0.67
CA9 Q16790 1/20 0.67
ATM Q13315 1/20 0.60
TDP1 Q9NUW8 1/20 0.60
L3MBTL1 Q9Y468 1/20 0.60
F2 P00734 1/20 0.52
PLG P00747 1/20 0.52
PRSS1 P07477 1/20 0.52
PRSS2 P07478 1/20 0.52
PRSS3 P35030 1/20 0.52
ALDH1A1 P00352 2/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
SRD5A2 P31213 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29492473 1.00 PBRM1 (0.88) PBRM1NPC1MITFLMNAPOLB
SCHEMBL9097509 1.00 PBRM1 (0.88) PBRM1NPC1MITFLMNAPOLB
SCHEMBL5114913 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL127545 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL5832368 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL29037240 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL17744847 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL29363032 0.95 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB
SCHEMBL125621 0.95 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB
SCHEMBL9282073 0.95 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 221 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6040418-A FLUORINATED POLYMIDES COMPRISING UNITS OF 2,2',5,5',6,6'-HEXAFLUOROBIPHENYL-3,3',4,4'-TETRACARBOXYLIC DIANHYDRIDE AND AROMATIC DIAMINE UBE INDUSTRIES, LTD. (JP) 2000-03-21 US claimed
WO-2026100662-A1 LIQUID CRYSTAL ALIGNING AGENT AND LIQUID CRYSTAL DISPLAY ELEMENT 日産化学株式会社 2026-05-15 WO disclosed
US-12504687-B2 Curable photosensitive resin composition, cured product, resist pattern, method of producing resist pattern, semiconductor device and electronic device ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2025-12-23 US disclosed
US-20250382418-A1 DISPLAY PANEL, ALIGNMENT FILM COMPOSITION AND DISPLAY DEVICE Guangzhou China Star Optoelectronics Semiconductor Display Technology Co., Ltd. (CN) 2025-12-18 US disclosed
US-20250346020-A1 LAMINATE AND DISPLAY KANEKA CORPORATION (JP) 2025-11-13 US disclosed
US-20250320338-A1 TRANSPARENT FILM, HARD COAT FILM, AND DISPLAY KANEKA CORPORATION (JP) 2025-10-16 US disclosed
US-20250282996-A1 ALIGNMENT FILM COMPOSITION, DISPLAY PANEL AND METHOD OF MANUFACTURE THEREOF TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD. (CN) 2025-09-11 US disclosed
WO-2025074873-A1 POLYAMIDIMIDE, RESIN COMPOSITION, MOLDED ARTICLE, AND FILM 株式会社カネカ 2025-04-10 WO disclosed
US-20250109264-A1 FILM, METHOD FOR MANUFACTURING SAME, AND IMAGE DISPLAY DEVICE KANEKA CORPORATION (JP) 2025-04-03 US disclosed
WO-2025063230-A1 POLYIMIDE, RESIN COMPOSITION, MOLDED OBJECT, AND FILM 株式会社カネカ 2025-03-27 WO disclosed
US-5321096-A Good processability and heat stability MITSUI TOATSU CHEMICAL, INCORPORATED (JP) 1994-06-14 US disclosed
EP-0572196-A1 Polyimide, and preparation process of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-12-01 EP disclosed
EP-0565352-A2 Aromatic diamine and polyimde, and preparation process of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-13 EP disclosed
EP-0564299-A2 Polyimide composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-06 EP disclosed
US-5231160-A AROMATIC DIAMINE COMPOUND, PREPARATION PROCESS OF SAME AND POLYIMIDE PREPARED FROM SAME MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1993-07-27 US disclosed
US-5153277-A Curable mixture comprising amino group-containing unsaturated ester compound or amino resin or polyethers and epoxy compound , curing agent; heat resistance, workability, adhesiveness to reinforcing fibers, fatigue-resistance NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1992-10-06 US disclosed
US-5082598-A Thermosetting unsaturated ester, thiuram compound, crosslinking agent, copper compound NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1992-01-21 US disclosed
US-4980416-A HEAT RESISTANCE, NONCRACKING, HIGH STRENGTH NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1990-12-25 US disclosed
EP-0400226-A1 Resin composition NIPPON SHOKUBAI CO., LTD. (JP) 1990-12-05 EP disclosed
US-4837280-A ACRYLATE GROUP-CONTAINING POLYAROMATIC AMINE COMPOUNDS TO FORM THERMOSETTING RESINS; HEAT RESISTANCE NIPPON SHOKUBAI KAGAKU KOGYO CO., LTD. (JP) 1989-06-06 US disclosed