SCHEMBL29492473

SCHEMBL29492473

Nc1cccc(C(=O)c2ccc(C(=O)c3cccc(N)c3)cc2)c1

nearest known ligand 0.88

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PBRM1 Q86U86 1/20 0.88
NPC1 O15118 1/20 0.72
MITF O75030 1/20 0.72
LMNA P02545 1/20 0.72
POLB P06746 1/20 0.72
CA1 P00915 1/20 0.67
CA2 P00918 1/20 0.67
CA9 Q16790 1/20 0.67
ATM Q13315 1/20 0.60
TDP1 Q9NUW8 1/20 0.60
L3MBTL1 Q9Y468 1/20 0.60
F2 P00734 1/20 0.52
PLG P00747 1/20 0.52
PRSS1 P07477 1/20 0.52
PRSS2 P07478 1/20 0.52
PRSS3 P35030 1/20 0.52
ALDH1A1 P00352 2/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
SRD5A2 P31213 2/20 0.48

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL203373 1.00 PBRM1 (0.88) PBRM1NPC1MITFLMNAPOLB
SCHEMBL9097509 1.00 PBRM1 (0.88) PBRM1NPC1MITFLMNAPOLB
SCHEMBL5114913 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL127545 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL5832368 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL29037240 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL17744847 0.96 PBRM1 (0.81) PBRM1NPC1MITFLMNAPOLB
SCHEMBL29363032 0.95 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB
SCHEMBL125621 0.95 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB
SCHEMBL9282073 0.95 PBRM1 (0.87) PBRM1NPC1MITFLMNAPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122079805-A Preparation method and application of trifluoro-methoxy-amide-containing bridged aromatic amine compound 2026-05-26 CN claimed
CN-122079805-A Preparation method and application of trifluoro-methoxy-amide-containing bridged aromatic amine compound 2026-05-26 CN disclosed
CN-120040805-A Polyimide film, laminate, and surface material for display 大日本印刷株式会社 2025-05-27 CN disclosed
CN-119948089-A Hard coating film and display 株式会社钟化 2025-05-06 CN disclosed
CN-119775953-A Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board 荒川化学工业株式会社 2025-04-08 CN disclosed
CN-119403881-A Resin composition, molded article, and film 株式会社钟化 2025-02-07 CN disclosed
CN-119307222-A Adhesive composition, cured product, adhesive sheet, resin-coated copper foil, copper-clad laminate, and printed wiring board 荒川化学工业株式会社 2025-01-14 CN disclosed
CN-118974146-A Film, method for producing the same, and image display device 株式会社钟化 2024-11-15 CN disclosed
CN-118852169-A Tertiary amine salt thermal alkaline generator, photosensitive composition capable of being cured at low temperature and polyimide film 中国科学院长春应用化学研究所 2024-10-29 CN disclosed
CN-117279780-B Laminated substrate, laminated body manufacturing method, laminated body with member for electronic device, and electronic device manufacturing method AGC株式会社 2024-08-16 CN disclosed
CN-114958287-A Adhesive composition, cured product, adhesive sheet, copper foil with resin, copper-clad laminate, and printed wiring board 荒川化学工业株式会社 2022-08-30 CN disclosed
CN-114940757-A Polyimide resin composition, adhesive composition, and related articles 荒川化学工业株式会社 2022-08-26 CN disclosed
WO-2022176919-A1 POLYIMIDE FILM AND PRODUCTION METHOD THEREFOR, HARDCOAT FILM, AND IMAGE DISPLAY DEVICE 株式会社カネカ 2022-08-25 WO disclosed
CN-114846082-A Resin composition and film 株式会社钟化 2022-08-02 CN disclosed
WO-2022124195-A1 POLYIMIDE RESIN, POLYIMIDE FILM AND MANUFACTURING METHOD THEREFOR 株式会社カネカ 2022-06-16 WO disclosed
CN-114621723-A Adhesive composition, cured product, adhesive sheet, copper foil with resin, copper-clad laminate, and printed wiring board 荒川化学工业株式会社 2022-06-14 CN disclosed
CN-108699270-B Polyimide film, method for producing polyimide film, and polyimide precursor resin composition 大日本印刷株式会社 2022-05-27 CN disclosed
CN-108690552-B Adhesive, adhesive material, adhesive layer, adhesive sheet, copper foil, copper-clad laminate, wiring board, and method for producing same 荒川化学工业株式会社 2022-04-19 CN disclosed
CN-109563282-B Medical film and method for producing same, medical coating composition, medical device and method for producing same 三井化学株式会社 2022-04-15 CN disclosed
CN-107793991-B Copper-clad laminate for flexible printed wiring board, and flexible printed wiring board 荒川化学工业株式会社 2022-03-08 CN disclosed