SCHEMBL204369

SCHEMBL204369

O=c1oc(=O)c2cccc3c(=O)oc(=O)c4cccc1c4c23

nearest known ligand 0.47

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.47
L3MBTL1 Q9Y468 1/20 0.47
ALDH1A1 P00352 4/20 0.46
GLA P06280 2/20 0.46
ELANE P08246 6/20 0.44
MAPT P10636 2/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
HSD17B10 Q99714 2/20 0.44
GMNN O75496 1/20 0.44
LMNA P02545 1/20 0.44
TP53 P04637 1/20 0.44
CYP1A2 P05177 1/20 0.44
POLB P06746 1/20 0.44
CTSG P08311 1/20 0.44
CTSA P10619 1/20 0.44
CYP2D6 P10635 1/20 0.44
CYP2C9 P11712 1/20 0.44
ALOX15 P16050 1/20 0.44
NFKB1 P19838 1/20 0.44
CYP2C19 P33261 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13570169 0.92 TDP1 (0.42) TDP1L3MBTL1ALDH1A1GLAELANE
SCHEMBL6720013 0.92 CES1 (0.43) TDP1L3MBTL1ALDH1A1GLAELANE
SCHEMBL150550 0.88 TDP1 (0.45) TDP1L3MBTL1ALDH1A1GLAELANE
SCHEMBL20963057 0.88 ELANE (0.54) L3MBTL1ALDH1A1GLAELANEMAPT
SCHEMBL15119580 0.86 CES1 (0.42) TDP1L3MBTL1ALDH1A1GLAELANE
SCHEMBL21173973 0.85 ELANE (0.52) L3MBTL1ALDH1A1GLAELANEMAPT
SCHEMBL1279011 0.83 L3MBTL1 (0.59) TDP1L3MBTL1ALDH1A1GLAELANE
SCHEMBL17192485 0.83 CYP3A4 (0.44) TDP1L3MBTL1ALDH1A1GLAELANE
SCHEMBL24891350 0.81 ELANE (0.61) TDP1L3MBTL1ALDH1A1GLAELANE
SCHEMBL5574162 0.80 L3MBTL1 (0.41) TDP1L3MBTL1ALDH1A1GLAELANE

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2021125308-A1 RELEASE LAYER FORMING COMPOSITION 日産化学株式会社 2021-06-24 WO disclosed
US-20210189126-A1 DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER NISSAN CHEMICAL CORPORATION (JP) 2021-06-24 US disclosed
US-20200317963-A1 DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER NISSAN CHEMICAL CORPORATION (JP) 2020-10-08 US disclosed
US-20200317915-A1 DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER NISSAN CHEMICAL CORPORATION (JP) 2020-10-08 US disclosed
EP-3467040-A1 DETACHABLE LAYER-FORMING COMPOSITION AND DETACHABLE LAYER Nissan Chemical Corporation (JP) 2019-04-10 EP disclosed
WO-2017141734-A1 PHOTOSENSITIVE RESIN COMPOSITION, DRY FILM, CURED PRODUCT, PRINTED CIRCUIT BOARD, AND PHOTOBASE GENERATOR 太陽ホールディングス株式会社 2017-08-24 WO disclosed
WO-2015019802-A1 PHOTOSENSITIVE RESIN COMPOSITION, RELIEF PATTERN FILM THEREOF, METHOD FOR PRODUCING RELIEF PATTERN FILM, ELECTRONIC COMPONENT OR OPTICAL PRODUCT INCLUDING RELIEF PATTERN FILM, AND ADHESIVE INCLUDING PHOTOSENSITIVE RESIN COMPOSITION 太陽ホールディングス株式会社 (JP) 2015-02-12 WO disclosed
US-8088882-B2 Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereof DAI NIPPON PRINTING CO., LTD. (JP) 2012-01-03 US disclosed
US-20070100129-A1 Low expansion polyimide, resin composition and article using thereof DAI NIPPON PRINTING CO., LTD (JP) 2007-05-03 US disclosed
US-20070100129-A1 Low expansion polyimide, resin composition and article using thereof DAI NIPPON PRINTING CO., LTD (JP) 2007-05-03 US disclosed
US-20060229384-A1 Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereof DAI NIPPON PRINTING CO., LTD. (JP) 2006-10-12 US disclosed