SCHEMBL20495643

SCHEMBL20495643

CC(CCCN)C(N)Cc1ccccc1

nearest known ligand 0.53

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CYP2D6 P10635 1/20 0.53
SLC6A2 P23975 2/20 0.52
TAAR1 Q96RJ0 2/20 0.52
MAOA P21397 2/20 0.52
SLC6A4 P31645 1/20 0.52
SLC6A3 Q01959 1/20 0.52
SIGMAR1 Q99720 1/20 0.52
CYP2A6 P11509 1/20 0.52
ADORA2A P29274 1/20 0.52
ADORA1 P30542 1/20 0.52
CSNK1E P49674 1/20 0.47
TRPA1 O75762 1/20 0.47
HTR2A P28223 1/20 0.46
HRH1 P35367 1/20 0.46
EPHX1 P07099 1/20 0.45
ANPEP P15144 2/20 0.42
LAP3 P28838 3/20 0.42
RNPEP Q9H4A4 1/20 0.42
DNPEP Q9ULA0 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21844821 0.83 CSNK1E (0.69) CYP2D6SLC6A2TAAR1MAOASLC6A4
SCHEMBL19628486 0.79 TAAR1 (0.52) CYP2D6SLC6A2TAAR1MAOASLC6A4
SCHEMBL9187239 0.79 CYP2D6 (0.53) CYP2D6SLC6A2TAAR1MAOASLC6A4
SCHEMBL9191396 0.77 HRH1 (0.53) CYP2D6SLC6A2TAAR1MAOASLC6A4
SCHEMBL10202821 0.77 EPHX1 (0.64) SLC6A2TAAR1MAOASLC6A4SLC6A3
SCHEMBL3844176 0.77 CYP2D6 (0.61) CYP2D6SLC6A2TAAR1MAOASLC6A4
SCHEMBL30758604 0.77 TRPA1 (0.70) CYP2D6SLC6A2TAAR1MAOASLC6A4
SCHEMBL30758601 0.77 TRPA1 (0.70) CYP2D6SLC6A2TAAR1MAOASLC6A4
SCHEMBL19971984 0.77 TAAR1 (0.44) CYP2D6SLC6A2TAAR1SLC6A4SLC6A3
SCHEMBL8664619 0.75 HTR2A (0.54) CYP2D6SLC6A2TAAR1MAOASLC6A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110382587-B Method for preparing curing agent of low-emission epoxy resin composition SIKA技术股份公司 2023-03-24 CN disclosed
CN-110312748-B Curing agents for low emission epoxy resin compositions SIKA技术股份公司 2023-01-06 CN disclosed
US-11225588-B2 Method for producing a curing agent for low-emission epoxy resin compositions SIKA TECHNOLOGY AG (CH) 2022-01-18 US disclosed
US-11053347-B2 Curing agent for low-emission epoxy resin compositions SIKA TECHNOLOGY AG (CH) 2021-07-06 US disclosed
EP-3596151-B1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-28 EP disclosed
EP-3596150-B1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-07 EP disclosed
US-20200040215-A1 METHOD FOR PRODUCING A CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2020-02-06 US disclosed
CN-110382587-A The method for being used to prepare the curing agent of low emission composition epoxy resin SIKA技术股份公司 2019-10-25 CN disclosed
CN-110312748-A Curing agents for low emission epoxy resin compositions SIKA技术股份公司 2019-10-08 CN disclosed
WO-2018166996-A1 METHOD FOR PRODUCING A CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-20 WO disclosed
WO-2018166997-A1 CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-20 WO disclosed
EP-3375803-A1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-19 EP disclosed
EP-3375802-A1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-19 EP disclosed