SCHEMBL20495646

SCHEMBL20495646

CC(N)CNCc1cccc2ccccc12

nearest known ligand 0.73

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 1/20 0.52
MC5R P33032 2/20 0.50
MAPK1 P28482 1/20 0.50
KMT2A Q03164 3/20 0.49
MEN1 O00255 2/20 0.49
MC1R Q01726 1/20 0.49
HPGD P15428 1/20 0.49
CA2 P00918 2/20 0.49
ANPEP P15144 1/20 0.45
KDM4E B2RXH2 1/20 0.45
ALDH1A1 P00352 1/20 0.45
TDP1 Q9NUW8 1/20 0.45
CA12 O43570 1/20 0.45
CA1 P00915 1/20 0.45
CA4 P22748 1/20 0.45
CA9 Q16790 1/20 0.45
MAPT P10636 1/20 0.44
SMPD1 P17405 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL17240223 0.86 DNM1 (0.55) DNM1MC5RMAPK1KMT2AMEN1
SCHEMBL23391386 0.84 MEN1 (0.43) DNM1KMT2AMEN1CA2ANPEP
SCHEMBL20525468 0.84 MEN1 (0.43) DNM1KMT2AMEN1CA2ANPEP
SCHEMBL20824982 0.83 DNM1 (0.52) DNM1MC5RMAPK1KMT2AMEN1
SCHEMBL13995739 0.83 DNM1 (0.52) DNM1MC5RMAPK1KMT2AMEN1
SCHEMBL20495653 0.82 KMT2A (0.60) DNM1MC5RMAPK1KMT2AMEN1
SCHEMBL30305243 0.82 KMT2A (0.60) DNM1MC5RMAPK1KMT2AMEN1
SCHEMBL6008064 0.80 MC5R (0.70) DNM1MC5RMAPK1KMT2AMEN1
SCHEMBL1703409 0.78 DNM1 (0.48) DNM1MC5RMAPK1KMT2AMEN1
SCHEMBL13394478 0.77 CHRM2 (0.53) DNM1KMT2AHPGDCA2KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110382587-B Method for preparing curing agent of low-emission epoxy resin composition SIKA技术股份公司 2023-03-24 CN disclosed
CN-110312748-B Curing agents for low emission epoxy resin compositions SIKA技术股份公司 2023-01-06 CN disclosed
EP-3596151-B1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-28 EP disclosed
EP-3596150-B1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECH AG (CH) 2021-04-07 EP disclosed
CN-110382587-A The method for being used to prepare the curing agent of low emission composition epoxy resin SIKA技术股份公司 2019-10-25 CN disclosed
CN-110312748-A Curing agents for low emission epoxy resin compositions SIKA技术股份公司 2019-10-08 CN disclosed
WO-2018166996-A1 METHOD FOR PRODUCING A CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-20 WO disclosed
WO-2018166997-A1 CURING AGENT FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-20 WO disclosed
EP-3375802-A1 METHOD FOR THE PREPARATION OF A CROSS-LINKER FOR LOW EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-19 EP disclosed
EP-3375803-A1 HARDENER FOR LOW-EMISSION EPOXY RESIN COMPOSITIONS SIKA TECHNOLOGY AG (CH) 2018-09-19 EP disclosed