SCHEMBL20547181

SCHEMBL20547181

CCN(CC)/N=N/c1ccccc1C(=O)O

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MYC P01106 1/20 0.51
▸ IDE P14735 1/20 0.49
▸ MEN1 O00255 7/20 0.47
▸ KMT2A Q03164 7/20 0.47
▸ MAPT P10636 6/20 0.47
▸ NPSR1 Q6W5P4 3/20 0.47
▸ GAA P10253 2/20 0.47
▸ TDP1 Q9NUW8 2/20 0.47
▸ PSMD14 O00487 1/20 0.47
▸ HSP90AA1 P07900 1/20 0.47
▸ MMP2 P08253 1/20 0.47
▸ THRB P10828 1/20 0.47
▸ MAPK1 P28482 1/20 0.47
▸ POLB P06746 3/20 0.44
▸ ALDH1A1 P00352 3/20 0.43
▸ L3MBTL1 Q9Y468 2/20 0.43
▸ HPGD P15428 1/20 0.43
▸ CYP2C19 P33261 1/20 0.42
▸ ALOX15 P16050 1/20 0.42
▸ CCNE2 O96020 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20547182 1.00 MYC (0.51) MYCIDEMEN1KMT2AMAPT
SCHEMBL14577739 0.85 ALDH1A1 (0.44) MYCMEN1KMT2AMAPTGAA
SCHEMBL3412059 0.81 MYC (0.59) MYCIDEMEN1KMT2AMAPT
SCHEMBL68503 0.78 IDE (0.71) MYCIDEMEN1KMT2AMAPT
SCHEMBL68504 0.78 IDE (0.71) MYCIDEMEN1KMT2AMAPT
SCHEMBL18768620 0.74 IDE (0.58) MYCIDEMEN1KMT2AMAPT
SCHEMBL192884 0.74 MYC (0.72) MYCIDEMEN1KMT2AMAPT
SCHEMBL2307598 0.74 MYC (0.72) MYCIDEMEN1KMT2AMAPT
SCHEMBL16983234 0.73 MYC (0.74) MYCIDEMEN1KMT2AMAPT
SCHEMBL522969 0.72 IDE (0.59) MYCIDEMEN1KMT2AMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11608455-B2 Adhesive for semiconductor device, and high productivity method for manufacturing said device SHOWA DENKO MATERIALS CO., LTD. (JP) 2023-03-21 — — US disclosed
CN-108352333-B Adhesive for semiconductor, semiconductor device, and method for manufacturing semiconductor device 昭和电工材料株式会社 2021-07-20 — — CN disclosed
US-10669454-B2 Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer HITACHI CHEMICAL COMPANY, LTD. (JP) 2020-06-02 — — US disclosed
US-20200095481-A1 ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAID DEVICE RESONAC CORPORATION (JP) 2020-03-26 — — US disclosed
US-20180312731-A1 ADHESIVE FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SAID DEVICE RESONAC CORPORATION (JP) 2018-11-01 — — US disclosed
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