Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.76 |
| ▸ | POLB | P06746 | 1/20 | 0.76 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.71 |
| ▸ | MGLL | Q99685 | 2/20 | 0.53 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1068467 | 0.90 | ALDH1A1 (0.87) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL1065164 | 0.86 | LMNA (0.93) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL1065271 | 0.85 | LMNA (0.90) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL3213768 | 0.83 | LMNA (0.76) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL8425153 | 0.83 | ALDH1A1 (1.00) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL10438344 | 0.83 | LMNA (0.76) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL873613 | 0.83 | LMNA (0.76) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL27761826 | 0.82 | LMNA (0.74) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL811116 | 0.82 | ALDH1A1 (0.74) | LMNAPOLBALDH1A1MGLL | |
| SCHEMBL19519472 | 0.82 | ALDH1A1 (0.74) | LMNAPOLBALDH1A1MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12032287-B2 | Resist material and patterning process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2024-07-09 | — | — | US | disclosed |
| EP-3398983-B1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | SHINETSU CHEMICAL CO (JP) | 2023-09-27 | — | — | EP | disclosed |
| US-11526078-B2 | Photosensitive resin composition, photosensitive resin coating, photosensitive dry film, laminate, and pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-12-13 | — | — | US | disclosed |
| US-11256174-B2 | Pattern forming process | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2022-02-22 | — | — | US | disclosed |
| EP-3398983-A1 | POLYMER OF POLYIMIDE PRECURSOR, POSITIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS, METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC PARTS | Shin-Etsu Chemical Co., Ltd. (JP) | 2018-11-07 | — | — | EP | disclosed |