SCHEMBL2060072

SCHEMBL2060072

O=C(O)CC(C1CN1)C(C(CC(=O)O)C1CN1)(C(CC(=O)O)C1CN1)C(CO)(CO)CCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL536388 0.85
SCHEMBL129335 0.69 SLC22A6 (0.30)
SCHEMBL11385435 0.68
SCHEMBL244677 0.68
SCHEMBL536336 0.67 SMN1; SMN2 (0.33)
SCHEMBL17870865 0.64
SCHEMBL435282 0.63 RNPEP (0.32)
SCHEMBL9805867 0.61 LMNA (0.31)
SCHEMBL1255080 0.61
SCHEMBL1258912 0.61 ALDH1A1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1776209-B1 COATED ABRASIVE ARTICLE WITH TIE LAYER, AND METHOD OF MAKING AND USING THE SAME 3M INNOVATIVE PROPERTIES CO (US) 2008-03-26 EP claimed
EP-1773544-B1 COATED ABRASIVE ARTICLE WITH COMPOSITE TIE LAYER, AND METHOD OF MAKING AND USING THE SAME 3M INNOVATIVE PROPERTIES CO (US) 2008-03-26 EP claimed
CN-114040933-B Block copolymer, resin composition, and method for producing block copolymer 东亚合成株式会社 2023-08-11 CN disclosed
CN-112119136-B Adhesive sheet 东亚合成株式会社 2022-06-10 CN disclosed
CN-114040933-A Block copolymer, resin composition, and method for producing block copolymer 东亚合成株式会社 2022-02-11 CN disclosed
CN-108728023-B Pressure sensitive adhesive composition and film formed using the same 信越化学工业株式会社 2021-11-02 CN disclosed
CN-112639043-A Adhesive composition and use thereof 东亚合成株式会社 2021-04-09 CN disclosed
CN-112119136-A Adhesive sheet 东亚合成株式会社 2020-12-22 CN disclosed
CN-111971342-A Curable resin composition, block copolymer, and method for producing same 东亚合成株式会社 2020-11-20 CN disclosed
WO-2020059637-A1 ADHESIVE COMPOSITION AND USE THEREOF 東亞合成株式会社 2020-03-26 WO disclosed
WO-2020032163-A1 ADHESIVE COMPOSITION AND USE THEREOF 東亞合成株式会社 2020-02-13 WO disclosed
US-20130017392-A1 ADHESIVE SHEET LINTEC CORPORATION (JP) 2013-01-17 US disclosed
US-8148299-B2 Reversible thermosensitive recording material, IC card, magnetic card and method for producing reversible thermosensitive recording material RICOH COMPANY, LTD. (JP) 2012-04-03 US disclosed
EP-2022642-A1 Reversible thermosensitive recording material, ic card, magnetic card and method for producing reversible thermosensitive recording material Ricoh Company, Ltd. (JP) 2009-02-11 EP disclosed
US-20090029854-A1 REVERSIBLE THERMOSENSITIVE RECORDING MATERIAL, IC CARD, MAGNETIC CARD AND METHOD FOR PRODUCING REVERSIBLE THERMOSENSITIVE RECORDING MATERIAL RICOH COMPANY, LTD. (JP) 2009-01-29 US disclosed
EP-0587069-B1 Degradable adhesive film and degradable resin composition MITSUI CHEMICALS INC (JP) 1998-12-02 EP disclosed
US-5663288-A Degradable adhesive film and degradable resin composition MITSUI TOATSU CHEMICALS, INC. (JP) 1997-09-02 US disclosed
US-5489474-A LACTIC ACID BASE POLYMER MITSUI TOATSU CHEMICALS, INC. (JP) 1996-02-06 US disclosed
EP-0677561-A1 Degradable resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1995-10-18 EP disclosed
EP-0587069-A1 Degradable adhesive film and degradable resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1994-03-16 EP disclosed